Abstract: An interposer substrate having electrodes on the front surface and on the rear surface thereof, respectively, is prepared, and at least one memory chip having electrodes connected to an internal circuit is prepared. Then, the rear surface of the memory chip is bonded to the front surface of the interposer substrate, and the memory chip is sealed to the front surface of the interposer substrate to constitute an encapsulated capsule type semiconductor package. On the other hand, a logic chip is prepared. Further, a main substrate is prepared in which electrodes are formed on the front surface and on the rear surface, respectively, and desired internal connections are provided between these electrodes.

Abstract: A package structure which aims at improvement in function, miniaturization, and systematization of a semiconductor integrated circuit having been made into multichip is offered. A substrate in which a plurality of terminals for a test and a plurality of terminals for external connection are arranged on the front surface, and a plurality of terminals for internal connection are arranged on the back surface, and a semiconductor chip in which a plurality of surface terminals connected to an internal circuit are formed in the front surface are prepared. An encapsulated semiconductor package is formed by joining the back surface of this semiconductor chip to the back surface of the substrate, connecting the surface terminal of the semiconductor chip to the desired terminal for internal connection of the substrate, and sealing the semiconductor chip on the back surface of the substrate with a molded member.

Abstract: An interposer substrate having electrodes on the front surface and on the rear surface thereof, respectively, is prepared, and at least one memory chip having electrodes connected to an internal circuit is prepared. Then, the rear surface of the memory chip is bonded to the front surface of the interposer substrate, and the memory chip is sealed to the front surface of the interposer substrate to constitute an encapsulated capsule type semiconductor package. On the other hand, a logic chip is prepared. Further, a main substrate is prepared in which electrodes are formed on the front surface and on the rear surface, respectively, and desired internal connections are provided between these electrodes.

Abstract: A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ring so that the semiconductor wafer is fixed to the frame ring through the ultraviolet tape. Successive semiconductor wafers thus fixed to respective frame rings are subjected to a series of steps including dicing, breaking and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided into dices and held by the ultraviolet tape with reduced adhesiveness is sent to a next step such as die-bonding step.

Abstract: A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor wafer is fixed to the ring frame with the ultraviolet sensitive tape. Successive semiconductor wafers thus fixed to respective ring frames are subjected to a series of steps including dicing, breaking, and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided in dice and held by the ultraviolet sensitive tape with reduced adhesiveness, is sent to a next step, such as a die-bonding step.

Abstract: A process is provided herein for preparing an organo-substituted sodium aluminum hydride by reacting sodium, aluminum, an organic compound of specific structure containing a hydroxyl group and hydrogen.In such process, an aluminum alloy is used as the aluminum.

Abstract: With a method of and an apparatus for manufacturing semiconductor devices using copper-type lead frames with no silver plating, semiconductor devices are continuously manufactured in the following steps: first, a semiconductor pellet having electrodes on its surface is bonded, through a resin material, to a die pad on a copper-alloy lead frame which is not silver-plated. The resin material used for the bonding is then cured by heating it for 120 seconds or less in a non-oxidizing-gas atmosphere having an oxygen density of 1000 ppm or less. Then, the thickness of the oxide film which is formed on the surface of the lead frame while curing the resin material is reduced to 20 .ANG. or less by keeping the lead frame in a deoxidizing-gas atmosphere having an oxygen density of 500 ppm or less.

Abstract: A lead frame of a package cast from mold resin is composed of a die bond pad section on which a semiconductor chip is placed and connected to a plurality of leads placed around the die bond pad section. The die bond pad section is formed of a length of an elongated material of a reduced width, i.e., having a line-like form disposed as a pattern in the form of a Peano curve. The die bond pad section has one or a plurality of such supporting sections integrally connected to and supported by one or more extension lead or leads. The die bond pad section formed by the elongated material has a low stiffness, and thus serves to prevent cracks from being formed in the package or in the semiconductor ship due to thermal contraction effects.

Abstract: An apparatus for assembling semiconductor devices includes a transportation line for transporting partially fabricated articles such as lead frames with a semiconductor chip mounted thereon; a working unit disposed in the transportation line for processing the partially fabricated articles by wire bonding or die bonding; an inspection unit disposed separately from the transportation line; a delivery unit for extracting a processed article from the transportation line, moving the extracted worked article to an inspection section and returning the processed article to the transportation line after checking; and a stock unit for stocking the processed articles. In the inspection section, one of the processed articles selected for sampling inspection is placed on a support and is checked with a microscope. During checking, the support and the microscope can be moved relative to each other to enable observation of the whole of the selected article.

Abstract: A wheel slip detection system which is especially effective in cases where a gentle or sluggish slip simultaneously occurs on all the axles of a vehicle. For instance, when the velocity difference (.DELTA.V) between the standard speed, namely, the maximum axle speed, of two or more axles exceeds the preset velocity, this condition is detected as a slip state. In the present system, the first and second velocity values V.alpha.1 and V.alpha.2 are set, and it is detected as a slip of all axles when the following (a), (b), (c) states occur at each axle wherein:(a) V.alpha.1<.DELTA.V,(b) Max. .DELTA.V<V.alpha.2,(c) Max. axle acceleration<Standard acceleration.

Abstract: A wheel-speed detecting arrangement for detecting the wheel-speed of a vehicle having a fixed wheel-and-axle configuration includes a wheel generator connected to the wheel/axle configuration such that a first distance signal is produced indicating rotational displacement of the wheel. This first distance signal is then synchronized by use of a basic clock and passed onto a first counter which produces a first data signal indicative of the number of distance pulses. A second counter, enabled as a function of the output of the first counter, measures the number of clock pulses occurring within a measuring time period and generates a second data signal representing that time count. The first distance signal also operates a latch circuit such that, upon initial occurrence of any distance pulse, a reading of the second counter is taken and passed through to a calculating circuit.

Abstract: A wheel-slip detection system and/or method for implementing self-readhesion or resticking viscous sticking phenomenon after all the wheels of a car have assumed a slipping condition. The detected data are self-retained until all of the wheel speed differences .DELTA.V become smaller than the first speed value .DELTA..alpha.2 regardless of the restoration of all wheel acceleration by the brake release application. Through this method, it is possible to prevent repeated occurrence of any simultaneous gentle or sluggish-slip state of all the wheels when self-readhesion application is not expected so that the increase of brake distance is avoided.