Patents by Inventor Shuichi Sako

Shuichi Sako has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 8710659
    Abstract: A semiconductor device includes an interlayer dielectric film, a passivation film, made of an insulating material, formed on the interlayer dielectric film, an uppermost wire, made of a material mainly composed of copper, formed between the surface of the interlayer dielectric film and the passivation film, and a wire covering film, made of a material mainly composed of aluminum, interposed between the passivation film and the surface of the uppermost wire for covering the surface of the uppermost wire.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: April 29, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Kei Moriyama, Shuichi Tamaki, Shuichi Sako, Mitsuhide Kori, Junji Goto, Tatsuya Sawada
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110186962
    Abstract: A semiconductor device includes an interlayer dielectric film, a passivation film, made of an insulating material, formed on the interlayer dielectric film, an uppermost wire, made of a material mainly composed of copper, formed between the surface of the interlayer dielectric film and the passivation film, and a wire covering film, made of a material mainly composed of aluminum, interposed between the passivation film and the surface of the uppermost wire for covering the surface of the uppermost wire.
    Type: Application
    Filed: January 14, 2011
    Publication date: August 4, 2011
    Applicant: ROHM CO., LTD.
    Inventors: Kei MORIYAMA, Shuichi Tamaki, Shuichi Sako, Mitsuhide Kori, Junji Goto, Tatsuya Sawada