Abstract: A conveyance seat includes a large-capacity pocket formed on the rear surface of a seat back of the seat. The pocket has: a pocket forming sheet overlapping an outer surface of a back side skin material positioned on the rear surface of the seat back; and a pocket sewn portion. The pocket sewn portion has: right and left first sewn portions and right and left second sewn portions formed at positions sandwiching an opening portion in a seat width direction to form the opening portion of the pocket in an upper end portion of the pocket forming sheet; right and left third sewn portions forming right and left outer edge portions of the pocket; and a fourth sewn portion forming a lower edge portion of the pocket. The right and left second sewn portions are disposed inside the right and left third sewn portions in the seat width direction.

Abstract: This coating composition for an electrical steel sheet is a coating composition for an electrical steel sheet containing an epoxy resin, a high-temperature curing agent, and inorganic fine particles, wherein a content of the high-temperature curing agent with respect to 100 parts by mass of the epoxy resin is 5 to 30 parts by mass, wherein the inorganic fine particles are one or more selected from metal hydroxides, metal oxides that react with water at 25° C. to become metal hydroxides and silicate minerals having a hydroxyl group, wherein the volume average particle diameter of the inorganic fine particles is 0.05 to 2.0 ?m, wherein a content of the epoxy resin with respect to a total mass of the coating composition for an electrical steel sheet is 45 mass % or more, and wherein a content of the inorganic fine particles with respect to 100 parts by mass of the epoxy resin is 1 to 100 parts by mass.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: Provided are a surface inspection device that evaluates a shape of a molded product with high accuracy in a shorter time than in the related art, a shape correction device, a surface inspection method, and a shape correction method. A point measurement sensor 201 that measures each of positions of predetermined points 102 set on a surface of an inspection target 101; a surface measurement sensor 202 that measures a shape of a predetermined surface 103 including the plurality of predetermined points 102 by simultaneously measuring positions of a plurality of points of the inspection target 101; and a deformation amount computation unit 3 that obtains an amount of deformation of the inspection target 101 from a reference shape based on the positions of the predetermined points 102 measured by the point measurement sensor 201 and a normal direction of the predetermined surface 103 measured by the surface measurement sensor 202 are included.

Abstract: A mounting structure includes a first substrate that has a first surface on which a functional element is provided, a wiring that is provided at a position which is different from a position of the functional element on the first surface, and is connected to the functional element, a second substrate that has a second surface facing the first surface, and a conductor that is provided on the second surface, and is connected to the wiring and the functional element, in which the shortest distance between the functional element and the second substrate is longer than a distance between a position where the wiring is connected to the conductor, and the second substrate.

Abstract: A piezoelectric device (an actuator unit) includes the following: a first substrate (a pressure chamber forming substrate, a diaphragm) having a piezoelectric layer and a first wiring conductor (a top electrode layer) that is at least partially stacked on the piezoelectric layer; and a second substrate (a sealing substrate) having a second wiring conductor (a bottom wiring conductor) that faces and is separated from the first wiring conductor (a top electrode layer) and to which an electrical signal different from an electrical signal that is applied to the first wiring conductor (a top electrode layer) is applied. At least one of the first wiring conductor (a top electrode layer) and the second wiring conductor (a bottom wiring conductor) is at least partially covered with an electrically insulating protective layer.

Abstract: This invention provides a high-strength PC steel wire having a chemical composition containing, in mass %, C: 0.90 to 1.10%, Si: 0.80 to 1.50%, Mn: 0.30 to 0.70%, P: 0.030% or less, S: 0.030% or less, Al: 0.010 to 0.070%, N: 0.0010 to 0.010%, Cr: 0 to 0.50%, V: 0 to 0.10%, B: 0 to 0.005%, Ni: 0 to 1.0%, Cu: 0 to 0.50%, and the balance: Fe and impurities. A ratio between the Vickers hardness (HvS) at a location (surface layer) that is 0.1D [D: diameter of steel wire] from the surface of the steel wire and the Vickers hardness (HvI) of a region on the inner side relative to the surface layer satisfies the formula [1.10<HvS/HvI?1.15]. An average carbon concentration in a region from the surface to a depth of 10 ?m (outermost layer region) of the steel wire is 0.8 times or less a carbon concentration of the steel wire. The steel micro-structure in the region on the inner side relative to the outermost layer region contains, in area %, a pearlite structure: 95% or more.

Abstract: Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate having a first surface to which a pressure chamber-forming plate including multiple piezoelectric elements is joined and a second surface which is on a side opposite from the first surface and to which a drive IC that outputs signals for driving the piezoelectric elements is joined, wherein a lower surface-side embedded wire connected to a common wire common to the driving elements are formed on the first surface of the sealing plate, and the lower surface-side embedded wire is at least partially embedded in the sealing plate.

Abstract: This invention provides a high-strength PC steel wire having a chemical composition containing, in mass %, C: 0.90 to 1.10%, Si: 0.80 to 1.50%, Mn: 0.30 to 0.70%, P: 0.030% or less, S: 0.030% or less, Al: 0.010 to 0.070%, N: 0.0010 to 0.010%, Cr: 0 to 0.50%, V: 0 to 0.10%, B: 0 to 0.005%, Ni: 0 to 1.0%, Cu: 0 to 0.50%, and the balance: Fe and impurities. A ratio between the Vickers hardness (HvS) at a location (surface layer) that is 0.1D [D: diameter of steel wire] from the surface of the steel wire and the Vickers hardness (HvI) of a region on the inner side relative to the surface layer satisfies the formula [1.10<HvS/HvI?1.15]. The steel micro-structure in the region from the surface of the steel wire to 0.01D (outermost layer region) consists of, in area %, a pearlite structure: less than 80%, and the balance: a ferrite structure and/or a bainitic structure.

Abstract: A stranded wire having a plurality of steel wires twisted together includes, in its cross section perpendicular to its longitudinal direction, a central wire as the steel wire, a plurality of first circumferential wires as the steel wires arranged in contact with the central wire to surround an outer periphery side of the central wire, and a plurality of second circumferential wires as the steel wires arranged in contact with the first circumferential wires to surround an outer periphery side of a region where the first circumferential wires are arranged, the second circumferential wires being greater in yield stress than the central wire and the first circumferential wires. The central wire is in surface contact with the first circumferential wires. The first circumferential wires are in surface contact with the second circumferential wires.

Abstract: A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.

Abstract: Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate having a first surface to which a pressure chamber-forming plate including multiple piezoelectric elements is joined and a second surface which is on a side opposite from the first surface and to which a drive IC that outputs signals for driving the piezoelectric elements is joined, wherein a lower surface-side embedded wire connected to a common wire common to the driving elements are formed on the first surface of the sealing plate, and the lower surface-side embedded wire is at least partially embedded in the sealing plate.

Abstract: To provide a concrete-reinforcing shaped body containing concrete-reinforcing fibers and having a plate-like shape. The concrete-reinforcing fibers each preferably have a diameter of 0.3 mm or smaller and a length of 5 mm or larger and 25 mm or smaller.

Abstract: Provided is an electronic device in which penetrating wires can be formed easily.

Abstract: A pregrouted PC steel material (10) includes a 19-wire-twisted PC strand (1), a pregrouted layer (2) disposed on an outer periphery of the PC strand (1), and a sheath (3) configured to cover an outer periphery of the pregrouted layer (2). A filling resin (4) is filled between steel wires (side wires) (1b, 1c, 1d). Since the filling resin (4) does not exude to the pregrouted layer (2) before tensioning of the PC strand (10), an operation of tensioning the PC strand (1) is not hindered by curing of the pregrouted layer (2). In contrast, since the gap between the steel wires is reduced when the PC strand (1) is tensioned, the filling resin (4) flows out (exudes) from between the steel wires to the pregrouted layer (2) to cure the pregrouted layer (2) only after the reduction.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

Abstract: An image-forming apparatus includes a light-irradiation unit configured to move a spot of laser light on a surface of a photosensitive member at a non-constant scanning velocity in a main scanning direction to form a latent image on the photosensitive member, an image data correcting unit configured to correct a length in the main scanning direction of image data by inserting one or more image data pieces into the image data, the number of the image data pieces increasing as the scanning velocity increases, and/or extracting one or more image data pieces from the image data, the number of the image data pieces increasing as the scanning velocity decreases, and a brightness correcting unit configured to correct a brightness of the laser light so that an emission brightness increases as the scanning velocity increases and/or the emission brightness decreases as the scanning velocity decreases.