Abstract: An apparatus includes a housing, a cover that is opened and closed on the housing, a detection part that detects opening and closing of the cover using ON and OFF, a rotating part that is rotatably supported and turns on and off the detection part, a pushing portion that comes into contact with the rotating part to rotate the rotating part in a case where the cover is closed, and a rotation applying part that applies a rotational force to the rotating part rotated by the pushing portion in a direction in which the detection part is turned on in a case where the cover is closed.

Abstract: An object of the present disclosure is to enable a warning to be issued to a person who is highly likely to be put in danger at a risky point. In an information processing apparatus, a controller acquires information indicating a risky point, acquires a state of a person with a predetermined positional relationship to the risky point, and determines whether or not the state of the person is a state where there is a high possibility of being put in danger, among a plurality of states of the person assumable at the risky point. Furthermore, in a case where the state of the person is determined to be the state where there is a high possibility of being put in danger, the controller causes an output unit to output information indicating a warning.

Abstract: An image forming apparatus includes a rotatable image bearing member and a rotatable developing member to carry developer made up of toner particles and carrier particles adhered to surfaces of the toner particles. Where a pressing force pressing the developing member against the image bearing member is F1, a total number of the carrier particles interposed between the toner particles and the image bearing member is N1, and an adhesion Ft between a carrier particle and a toner particle, measured when the carrier particle is pressed against the toner particle with F1/N1 that is a pressing force per unit carrier particle, and an adhesion Fdr1 between the carrier particle and the image bearing member, measured when the carrier particle is pressed against the image bearing member with F1/N1, satisfy Ft?Fdr1.

Abstract: A thermoelectric power generation device including a thermoelectric element having a first side provided to a heating unit and a second side provided to a cooling unit, and a heat transfer pipe arranged in a passage in which a high temperature fluid flows. The heating unit and the heat transfer pipe have internal spaces communicating with each other. The internal space of the heating unit and the internal space of the heat transfer pipe form a circulation path in which a heat medium is circulated. An outlet of the heat transfer pipe from which the heat medium is discharged is provided in a position higher than an inlet of the heat transfer pipe into which the heat medium flows. The heat transfer pipe vaporizes the heat medium flowing in the circulation path by using heat of the high temperature fluid. The heating unit condenses the heat medium vaporized.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: Provided are a surface inspection device that evaluates a shape of a molded product with high accuracy in a shorter time than in the related art, a shape correction device, a surface inspection method, and a shape correction method. A point measurement sensor 201 that measures each of positions of predetermined points 102 set on a surface of an inspection target 101; a surface measurement sensor 202 that measures a shape of a predetermined surface 103 including the plurality of predetermined points 102 by simultaneously measuring positions of a plurality of points of the inspection target 101; and a deformation amount computation unit 3 that obtains an amount of deformation of the inspection target 101 from a reference shape based on the positions of the predetermined points 102 measured by the point measurement sensor 201 and a normal direction of the predetermined surface 103 measured by the surface measurement sensor 202 are included.

Abstract: A mounting structure includes a first substrate that has a first surface on which a functional element is provided, a wiring that is provided at a position which is different from a position of the functional element on the first surface, and is connected to the functional element, a second substrate that has a second surface facing the first surface, and a conductor that is provided on the second surface, and is connected to the wiring and the functional element, in which the shortest distance between the functional element and the second substrate is longer than a distance between a position where the wiring is connected to the conductor, and the second substrate.

Abstract: A piezoelectric device (an actuator unit) includes the following: a first substrate (a pressure chamber forming substrate, a diaphragm) having a piezoelectric layer and a first wiring conductor (a top electrode layer) that is at least partially stacked on the piezoelectric layer; and a second substrate (a sealing substrate) having a second wiring conductor (a bottom wiring conductor) that faces and is separated from the first wiring conductor (a top electrode layer) and to which an electrical signal different from an electrical signal that is applied to the first wiring conductor (a top electrode layer) is applied. At least one of the first wiring conductor (a top electrode layer) and the second wiring conductor (a bottom wiring conductor) is at least partially covered with an electrically insulating protective layer.

Abstract: This invention provides a high-strength PC steel wire having a chemical composition containing, in mass %, C: 0.90 to 1.10%, Si: 0.80 to 1.50%, Mn: 0.30 to 0.70%, P: 0.030% or less, S: 0.030% or less, Al: 0.010 to 0.070%, N: 0.0010 to 0.010%, Cr: 0 to 0.50%, V: 0 to 0.10%, B: 0 to 0.005%, Ni: 0 to 1.0%, Cu: 0 to 0.50%, and the balance: Fe and impurities. A ratio between the Vickers hardness (HvS) at a location (surface layer) that is 0.1D [D: diameter of steel wire] from the surface of the steel wire and the Vickers hardness (HvI) of a region on the inner side relative to the surface layer satisfies the formula [1.10<HvS/HvI?1.15]. An average carbon concentration in a region from the surface to a depth of 10 ?m (outermost layer region) of the steel wire is 0.8 times or less a carbon concentration of the steel wire. The steel micro-structure in the region on the inner side relative to the outermost layer region contains, in area %, a pearlite structure: 95% or more.

Abstract: Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate having a first surface to which a pressure chamber-forming plate including multiple piezoelectric elements is joined and a second surface which is on a side opposite from the first surface and to which a drive IC that outputs signals for driving the piezoelectric elements is joined, wherein a lower surface-side embedded wire connected to a common wire common to the driving elements are formed on the first surface of the sealing plate, and the lower surface-side embedded wire is at least partially embedded in the sealing plate.

Abstract: This invention provides a high-strength PC steel wire having a chemical composition containing, in mass %, C: 0.90 to 1.10%, Si: 0.80 to 1.50%, Mn: 0.30 to 0.70%, P: 0.030% or less, S: 0.030% or less, Al: 0.010 to 0.070%, N: 0.0010 to 0.010%, Cr: 0 to 0.50%, V: 0 to 0.10%, B: 0 to 0.005%, Ni: 0 to 1.0%, Cu: 0 to 0.50%, and the balance: Fe and impurities. A ratio between the Vickers hardness (HvS) at a location (surface layer) that is 0.1D [D: diameter of steel wire] from the surface of the steel wire and the Vickers hardness (HvI) of a region on the inner side relative to the surface layer satisfies the formula [1.10<HvS/HvI?1.15]. The steel micro-structure in the region from the surface of the steel wire to 0.01D (outermost layer region) consists of, in area %, a pearlite structure: less than 80%, and the balance: a ferrite structure and/or a bainitic structure.

Abstract: A stranded wire having a plurality of steel wires twisted together includes, in its cross section perpendicular to its longitudinal direction, a central wire as the steel wire, a plurality of first circumferential wires as the steel wires arranged in contact with the central wire to surround an outer periphery side of the central wire, and a plurality of second circumferential wires as the steel wires arranged in contact with the first circumferential wires to surround an outer periphery side of a region where the first circumferential wires are arranged, the second circumferential wires being greater in yield stress than the central wire and the first circumferential wires. The central wire is in surface contact with the first circumferential wires. The first circumferential wires are in surface contact with the second circumferential wires.

Abstract: A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.

Abstract: Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate having a first surface to which a pressure chamber-forming plate including multiple piezoelectric elements is joined and a second surface which is on a side opposite from the first surface and to which a drive IC that outputs signals for driving the piezoelectric elements is joined, wherein a lower surface-side embedded wire connected to a common wire common to the driving elements are formed on the first surface of the sealing plate, and the lower surface-side embedded wire is at least partially embedded in the sealing plate.

Abstract: To provide a concrete-reinforcing shaped body containing concrete-reinforcing fibers and having a plate-like shape. The concrete-reinforcing fibers each preferably have a diameter of 0.3 mm or smaller and a length of 5 mm or larger and 25 mm or smaller.

Abstract: Provided is an electronic device in which penetrating wires can be formed easily.

Abstract: A pregrouted PC steel material (10) includes a 19-wire-twisted PC strand (1), a pregrouted layer (2) disposed on an outer periphery of the PC strand (1), and a sheath (3) configured to cover an outer periphery of the pregrouted layer (2). A filling resin (4) is filled between steel wires (side wires) (1b, 1c, 1d). Since the filling resin (4) does not exude to the pregrouted layer (2) before tensioning of the PC strand (10), an operation of tensioning the PC strand (1) is not hindered by curing of the pregrouted layer (2). In contrast, since the gap between the steel wires is reduced when the PC strand (1) is tensioned, the filling resin (4) flows out (exudes) from between the steel wires to the pregrouted layer (2) to cure the pregrouted layer (2) only after the reduction.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.