Abstract: A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.

Abstract: In a position detection device of a type that omits a secondary coil, various inconveniences arising from the use of a voltage-dividing resistance (fixed resistor) are eliminated. At least two pairs of coils are provided. A magnetism-responsive member are placed so as to effect relative displacement in relation to the coils, the relative position of the member in relation to the coils varies with a position of a detection object, and impedance of each coil is varied with the relative position. The impedance changes of two coils constituting each one of coil pairs present characteristics of mutually opposite phase characteristics. For each coil pair, the two coils constituting the pair are connected in series with each other, and from a connection point thereof, a voltage-divided output voltage according to the impedance of the two coils is taken out as a detection output signal for the pair.

Abstract: A piezoelectric device includes a first substrate having a piezoelectric element on one surface thereof and a second substrate having penetration wiring that includes a through hole formed in a thickness direction thereof and a conductor section formed in the through hole. A resin section is formed on a surface of one substrate of one of the first substrate and the second substrate, which opposes the other substrate, and is formed of an elastic body in a shape protruding toward the other substrate, and a first electrode layer is formed on the surface of the other substrate side of the resin section. A second electrode layer is formed on a surface of the other substrate that opposes the one substrate, and the first substrate and the second substrate are joined in a state in which the first electrode layer and the second electrode layer are abutting against each other.

Abstract: A wiring substrate is provided with a surface wiring on at least one surface, a through hole which passes through the wiring substrate, and a through wiring which is formed in the through hole and is connected to a surface wiring, in which an inner surface of the through hole is a rough surface, and electric resistance of the through wiring is equal to or less than the electric resistance of the surface wiring.

Abstract: A conduction structure includes a device substrate (first substrate), an IC (second substrate) having an upper surface and an end surface, a sealing plate (third substrate) having an upper surface and an end surface, a conductive layer having a first part provided on an upper surface of the device substrate, a second part provided on the end surface of the IC and connected to the first part, a third part provided on the upper surface of the IC and connected to the second part, and a fourth part provided on the end surface of the sealing plate and connected to both of the first part and the second part, and a plating layer overlapped with the conductive layer.

Abstract: A suit of the present invention is a two-piece suit (1) including a coat (2) and trousers (3) and/or a skirt that are made from a woven fabric containing animal hair fibers and/or synthetic fibers. The coat (2) stretches more in the weft direction than in the warp direction, and the trousers (3) and/or skirt stretch more in the warp direction than in the weft direction. A method for producing the suit includes: for upper and lower parts of the suit, dyeing yarns of the same quality by the same method and producing woven fabrics that are woven in the same structure; differentiating stretchability of the woven fabrics in warp and weft directions in tentering processing by a heat set in a final finish step, thereby producing a cloth for coat and a cloth for trousers and/or skirt; and cutting and sewing the cloths. Thus, it is possible to provide a suit imparted with a function of high mobility even though it is a two-piece suit, and a method for producing the same.

Abstract: A liquid ejecting head includes a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, in which the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction.

Abstract: An electronic device includes a first substrate including a structure body protruded from one surface; and a second substrate stacked and disposed facing the one surface through a spacer, in which the first substrate and the spacer are bonded to each other by an adhesive, and in which the adhesive is extended up to the structure body along the one surface.

Abstract: A piezoelectric device includes a first substrate having a piezoelectric element on one surface thereof and a second substrate having penetration wiring that includes a through hole formed in a thickness direction thereof and a conductor section formed in the through hole. A resin section is formed on a surface of one substrate of one of the first substrate and the second substrate, which opposes the other substrate, and is formed of an elastic body in a shape protruding toward the other substrate, and a first electrode layer is formed on the surface of the other substrate side of the resin section. A second electrode layer is formed on a surface of the other substrate that opposes the one substrate, and the first substrate and the second substrate are joined in a state in which the first electrode layer and the second electrode layer are abutting against each other.

Abstract: An optical filter device includes a variable wavelength interference filter having a stationary substrate, a movable substrate, a stationary reflecting film, and a movable reflecting film, and a housing adapted to house the variable wavelength interference filter therein. The housing has a base substrate, a lid bonded to the base substrate, and forming an internal space between the base substrate and the lid, and a lid-side glass substrate adapted to block a light passage hole provided to the lid. Further, the lid-side glass substrate has a substrate edge located outside the outer peripheral edge of the light passage hole, and is bonded to the lid in an area extending from the outer peripheral edge of the light passage hole to the substrate edge.

Abstract: An engineering tool program, which writes a program to each functional unit of a programmable logic controller, causes a computer connected to the programmable logic controller to perform: an instruction step of instructing each of a plurality of programmable logic controllers to update firmware; and an update step of updating the firmware by writing new firmware to the each functional unit.

Abstract: A rotational support mechanism includes: a fixing member that holds a support subject unit; an inner chassis that supports the fixing member so that the fixing member is rotatable in a vertical plane via a tilt shaft structure that is formed between the fixing member and the inner chassis; an outer chassis that is formed so as to cover the inner chassis from outside; a pedestal that supports the inner chassis and the outer chassis so that the inner chassis and the outer chassis are rotatable in a horizontal plane via a swivel shaft that is formed between a combination of the inner chassis and the outer chassis and the pedestal; and a first rotatable range restricting unit that is detachable and restricts a horizontal rotatable range of the support subject unit.

Abstract: An electronic device includes a sealing plate including a first surface connected to a pressure chamber formation substrate, and a second surface having a drive IC provided thereon. The sealing plate includes a first region in which a plurality of individual connection terminals are arranged, and a second region in a position different from the first region. A plurality of bump electrodes are arranged at a pitch different from a pitch of an individual connection terminals, in a region overlapping a second region, and a wiring group connecting the individual connection terminal and a bump electrode includes a first wiring of which a position of a pass-through wiring relaying the first surface and the second surface is within the first region. A second wiring of which a position of a pass-through wiring connecting the first surface and the second surface is within the second region.

Abstract: A method of manufacturing a light-emitting device, includes: disposing a first conductive paste on a substrate and sintering the first conductive paste to forma first bonding layer; disposing a second conductive paste on a semiconductor light-emitting element and sintering the second conductive paste to form a second bonding layer; polishing surfaces of the first bonding layer and the second bonding layer; and causing a third conductive paste to intervene between the first bonding layer and the second bonding layer and sintering the third conductive paste to bond the first bonding layer and the second bonding layer together.

Abstract: A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure chamber forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

Abstract: An engineering tool includes a program editing unit that designates a device by selecting a label allocated to the device and edits a sequence program and a label setting management unit that manages the setting of the label. The label setting management unit includes an individual processing setting unit that is capable of setting individual processing to be performed by the device designated by the label. It does this by associating a function corresponding to the individual processing with the label.

Abstract: A pregrouted PC steel material (10) includes a 19-wire-twisted PC strand (1), a pregrouted layer (2) disposed on an outer periphery of the PC strand (1), and a sheath (3) configured to cover an outer periphery of the pregrouted layer (2). A filling resin (4) is filled between steel wires (side wires) (1b, 1c, 1d). Since the filling resin (4) does not exude to the pregrouted layer (2) before tensioning of the PC strand (10), an operation of tensioning the PC strand (1) is not hindered by curing of the pregrouted layer (2). In contrast, since the gap between the steel wires is reduced when the PC strand (1) is tensioned, the filling resin (4) flows out (exudes) from between the steel wires to the pregrouted layer (2) to cure the pregrouted layer (2) only after the reduction.

Abstract: A method of manufacturing a light-emitting device, includes: disposing a first conductive paste on a substrate and sintering the first conductive paste to forma first bonding layer; disposing a second conductive paste on a semiconductor light-emitting element and sintering the second conductive paste to form a second bonding layer; polishing surfaces of the first bonding layer and the second bonding layer; and causing a third conductive paste to intervene between the first bonding layer and the second bonding layer and sintering the third conductive paste to bond the first bonding layer and the second bonding layer together.

Abstract: A conduction structure includes a device substrate (first substrate), an IC (second substrate) having an upper surface and an end surface, a sealing plate (third substrate) having an upper surface and an end surface, a conductive layer having a first part provided on an upper surface of the device substrate, a second part provided on the end surface of the IC and connected to the first part, a third part provided on the upper surface of the IC and connected to the second part, and a fourth part provided on the end surface of the sealing plate and connected to both of the first part and the second part, and a plating layer overlapped with the conductive layer.

Abstract: A rotational support mechanism includes: a fixing member that holds a support subject unit; an inner chassis that supports the fixing member so that the fixing member is rotatable in a vertical plane via a tilt shaft structure that is formed between the fixing member and the inner chassis; an outer chassis that is formed so as to cover the inner chassis from outside; a pedestal that supports the inner chassis and the outer chassis so that the inner chassis and the outer chassis are rotatable in a horizontal plane via a swivel shaft that is formed between a combination of the inner chassis and the outer chassis and the pedestal; and a first rotatable range restricting unit that is detachable and restricts a horizontal rotatable range of the support subject unit.