Patents by Inventor Shuji Akiyama

Shuji Akiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10889519
    Abstract: Provided is method of producing a glass roll, the method including: a conveying step of conveying a glass film (G) along a longitudinal direction thereof; a cutting step of irradiating the glass film (G) with a laser beam (L) from a laser irradiation apparatus (19) while conveying the glass film (G) by the conveying step, to thereby separate the glass film (G) into a non-product portion (Gc) and a product portion (Gd); and a take-up step of taking up the product portion (Gd) into a roll shape, to thereby form a glass roll (R). The cutting step includes winding a thread-like peeled material (Ge) generated from an end portion of the product portion (Gd) in a width direction around a rod-shaped collecting member (20a), to thereby collect the thread-like peeled material (Ge).
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: January 12, 2021
    Assignee: NIPPON ELECTRIC GLASS CO., LTD.
    Inventors: Naohiro Ikai, Kaoru Mitsugi, Shuji Akiyama, Hiroki Mori, Koichi Mori, Yasuhiro Uemura
  • Patent number: 10823778
    Abstract: An inspection system, for inspecting an inspection target on a stage in a low temperature environment, includes a system main body including an inspection apparatus having inspection chambers each accommodating an inspection unit for performing electrical inspection of an inspection target on a stage and having inspection spaces arranged in multiple stages vertically, the plurality of inspection chambers being arranged horizontally, and a loader unit for transferring the inspection target with respect to the stage of the inspection unit; and a coolant supply unit configured to supply a coolant to the stage. The system main body further includes coolant line arrangement spaces, in which coolant lines extending from the coolant supply unit are arranged, provided above or below the respective inspection spaces to correspond to the respective inspection spaces, and the coolant lines are directed toward the corresponding inspection spaces in each of the coolant line arrangement spaces.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: November 3, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shuji Akiyama, Takeo Saito, Eiichi Matsuzawa
  • Patent number: 10766804
    Abstract: A conveying device (14) for a glass film (G) includes: a first support (21) configured to support a first portion (Gc) of the glass film (G) having been cut; a second support (22) configured to support a second portion (Gd) of the glass film (G) having been cut; and an opening (23) formed at a position between the first support (21) and the second support (22) and below a laser irradiation apparatus (19). A cutting step for the glass film (G) includes deforming the glass film (G) so as to be convex downward through the opening (23), and radiating a laser beam (LB) from the laser irradiation apparatus (19) to a position which is within a range of the opening (23), and which is prevented from coinciding with a top (GT) of the glass film (G).
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: September 8, 2020
    Assignee: NIPPON ELECTRIC GLASS CO., LTD.
    Inventors: Kaoru Mitsugi, Naohiro Ikai, Shuji Akiyama
  • Publication number: 20200164545
    Abstract: Provided is a glass film manufacturing method in which manufacture-related processing is performed on a glass film while the glass film (G) is conveyed, the glass film manufacturing method comprising the step of conveying the glass film (G) on a suction roller (46), wherein the suction roller (46a) is configured to suck only a center portion of the glass film in a width direction of the glass film (G).
    Type: Application
    Filed: February 22, 2018
    Publication date: May 28, 2020
    Inventors: Kaoru MITSUGI, Shuji AKIYAMA, Yoshinori HASEGAWA
  • Publication number: 20200168481
    Abstract: A wafer inspection apparatus according to one embodiment is a wafer inspection apparatus including a plurality of inspection parts arranged in a height direction and a lateral direction, and includes a pair of air circulating means disposed at both ends in a longitudinal direction of an air circulating region including the plurality of inspection parts arranged in the lateral direction and configured to circulate air in the circulating region.
    Type: Application
    Filed: April 13, 2018
    Publication date: May 28, 2020
    Inventors: Shuji AKIYAMA, Hiroki HOSAKA
  • Publication number: 20190375666
    Abstract: Provided is a method of manufacturing a glass film, including: a conveying step of conveying an elongated glass film (G) along a longitudinal direction thereof; and a cutting step of irradiating the glass film (G) with a laser beam (L) from a laser irradiation apparatus (19) while conveying the glass film (G) through the conveying step, to thereby separate the glass film (G). The cutting step includes generating a thread-like peeled material (Ge) in a helical shape from an end portion of the separated glass film (G) in a width direction. The thread-like peeled material (Ge) has a width (W) of 180 ?m or more and 300 ?m or less. In addition, the thread-like peeled material (Ge) has a helical diameter (D) of 80 mm or more and 200 mm or less.
    Type: Application
    Filed: January 29, 2018
    Publication date: December 12, 2019
    Inventors: Hiroki MORI, Koichi MORI, Shuji AKIYAMA, Yasuhiro UEMURA, Naoyuki MATSUMOTO
  • Publication number: 20190161385
    Abstract: A conveying device (14) for a glass film (G) includes: a first support (21) configured to support a first portion (Gc) of the glass film (G) having been cut; a second support (22) configured to support a second portion (Gd) of the glass film (G) having been cut; and an opening (23) formed at a position between the first support (21) and the second support (22) and below a laser irradiation apparatus (19). A cutting step for the glass film (G) includes deforming the glass film (G) so as to be convex downward through the opening (23), and radiating a laser beam (LB) from the laser irradiation apparatus (19) to a position which is within a range of the opening (23), and which is prevented from coinciding with a top (GT) of the glass film (G).
    Type: Application
    Filed: April 21, 2017
    Publication date: May 30, 2019
    Applicant: Nippon Electric Glass Co., Ltd.
    Inventors: Kaoru MITSUGI, Naohiro IKAI, Shuji AKIYAMA
  • Publication number: 20190152826
    Abstract: Provided is method of producing a glass roll, the method including: a conveying step of conveying a glass film (G) along a longitudinal direction thereof; a cutting step of irradiating the glass film (G) with a laser beam (L) from a laser irradiation apparatus (19) while conveying the glass film (G) by the conveying step, to thereby separate the glass film (G) into a non-product portion (Gc) and a product portion (Gd); and a take-up step of taking up the product portion (Gd) into a roll shape, to thereby form a glass roll (R). The cutting step includes winding a thread-like peeled material (Ge) generated from an end portion of the product portion (Gd) in a width direction around a rod-shaped collecting member (20a), to thereby collect the thread-like peeled material (Ge).
    Type: Application
    Filed: April 21, 2017
    Publication date: May 23, 2019
    Inventors: Naohiro IKAI, Kaoru MITSUGI, Shuji AKIYAMA, Hiroki MORI, Koichi MORI, Yasuhiro UEMURA
  • Publication number: 20190041454
    Abstract: An inspection system, for inspecting an inspection target on a stage in a low temperature environment, includes a system main body including an inspection apparatus having inspection chambers each accommodating an inspection unit for performing electrical inspection of an inspection target on a stage and having inspection spaces arranged in multiple stages vertically, the plurality of inspection chambers being arranged horizontally, and a loader unit for transferring the inspection target with respect to the stage of the inspection unit; and a coolant supply unit configured to supply a coolant to the stage. The system main body further includes coolant line arrangement spaces, in which coolant lines extending from the coolant supply unit are arranged, provided above or below the respective inspection spaces to correspond to the respective inspection spaces, and the coolant lines are directed toward the corresponding inspection spaces in each of the coolant line arrangement spaces.
    Type: Application
    Filed: July 30, 2018
    Publication date: February 7, 2019
    Inventors: Shuji AKIYAMA, Takeo SAITO, Eiichi MATSUZAWA
  • Patent number: 9914590
    Abstract: Provided is a workpiece conveyance method for conveying a workpiece (1) in a predetermined direction by applying a conveying force (F) to the workpiece (1) while supporting the workpiece (1) through use of free rollers (11), and the workpiece conveyance method includes: applying flows of a fluid to the free rollers (11) to apply a rotation auxiliary force (f) to the free rollers (11) in a rotation direction of the free rollers (11) during conveyance of the workpiece (1).
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: March 13, 2018
    Assignee: NIPPON ELECTRIC GLASS CO., LTD.
    Inventors: Shuji Akiyama, Kaoru Mitsugi, Koji Nishijima
  • Patent number: 9684014
    Abstract: A prober can suppress a decrease of a throughput in inspection of semiconductor devices on a substrate. The prober 10 includes a stage 11 having a horizontal mounting surface 11a that mounts thereon a wafer W on which semiconductor devices are formed; a probe card 16 provided to face the stage 11; three roller devices 26, each having a vertical rotational shaft, equally-spaced along a circumference of the mounted wafer W. Each roller device 26 is configured to rotate the wafer W on a horizontal plane while being in contact with a peripheral edge of the wafer W.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: June 20, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shuji Akiyama, Kazuya Yano, Isamu Inomata
  • Publication number: 20170087599
    Abstract: Provided is a method of cleaning a surface of a glass film (1b) by causing roller brushes (2) arranged on a conveyance path to rotate in a direction reverse to a conveyance direction of a belt-shaped body (1) while conveying the belt-shaped body (1) that is obtained by coupling together end portions of the belt-shaped glass film (1b) and a leader (1a) by a sheet-shaped coupling member (1c) bonded on surfaces of the end portions. The method includes causing the roller brushes (2) to rotate forward in conformity with the conveyance direction of the belt-shaped body (1) when the coupling member (1c) passes through an arrangement region of the roller brushes (2).
    Type: Application
    Filed: March 18, 2015
    Publication date: March 30, 2017
    Inventors: Shuji AKIYAMA, Kaoru MITSUGI, Koji NISHIJIMA
  • Publication number: 20170073164
    Abstract: Provided is a workpiece conveyance method for conveying a workpiece (1) in a predetermined direction by applying a conveying force (F) to the workpiece (1) while supporting the workpiece (1) through use of free rollers (11), and the workpiece conveyance method includes: applying flows of a fluid to the free rollers (11) to apply a rotation auxiliary force (f) to the free rollers (11) in a rotation direction of the free rollers (11) during conveyance of the workpiece (1).
    Type: Application
    Filed: March 18, 2015
    Publication date: March 16, 2017
    Inventors: Shuji AKIYAMA, Kaoru MITSUGI, Koji NISHIJIMA
  • Patent number: 9494187
    Abstract: There is provided a fluid bearing including: a sleeve having a bearing hole; a shaft being inserted into the bearing hole to be rotatable with respect to the sleeve; a thrust portion that is fixed to the sleeve and covers one end portion of the bearing hole; and a liquid filled in a gap between the sleeve and the shaft. The bearing hole is configured to have a first portion having a first diameter; a second portion that is located at an end portion that is closer to the thrust portion than the first portion, the second portion having a second diameter that is substantially the dame with the first diameter; and a groove that is located at a position between the first portion and the second portion.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: November 15, 2016
    Assignee: Minebea Co., Ltd.
    Inventors: Katsunori Sakuragi, Michiharu Yamamoto, Shuji Akiyama
  • Patent number: 9383389
    Abstract: A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle tips and a supporting member 27 configured to support the WAPP 28. On a top surface of the WAPP 28, a wrapping sheet 29 is provided, and the WAPP 28 includes multiple recesses 31 formed on a bottom surface 30 thereof and the supporting member 27 includes multiple protrusions 33 formed on a ceiling surface 32 thereof. When the WAPP 28 is moved to a retreat position, the protrusions 33 are respectively inserted and fitted into the recesses 31, and when the WAPP 28 is moved to a contact position, top portions of the protrusions 33 are respectively brought into contact with portions on the bottom surface 30 where the recesses 31 are not formed.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: July 5, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kazuya Yano, Shuji Akiyama
  • Publication number: 20150240866
    Abstract: There is provided a fluid bearing including: a sleeve having a bearing hole; a shaft being inserted into the bearing hole to be rotatable with respect to the sleeve; a thrust portion that is fixed to the sleeve and covers one end portion of the bearing hole; and a liquid filled in a gap between the sleeve and the shaft. The bearing hole is configured to have a first portion having a first diameter; a second portion that is located at an end portion that is closer to the thrust portion than the first portion, the second portion having a second diameter that is substantially the dame with the first diameter; and a groove that is located at a position between the first portion and the second portion.
    Type: Application
    Filed: February 24, 2015
    Publication date: August 27, 2015
    Inventors: Katsunori SAKURAGI, Michiharu YAMAMOTO, Shuji AKIYAMA
  • Publication number: 20150226767
    Abstract: A prober can suppress a decrease of a throughput in inspection of semiconductor devices on a substrate. The prober 10 includes a stage 11 having a horizontal mounting surface 11a that mounts thereon a wafer W on which semiconductor devices are formed; a probe card 16 provided to face the stage 11; three roller devices 26, each having a vertical rotational shaft, equally-spaced along a circumference of the mounted wafer W. Each roller device 26 is configured to rotate the wafer W on a horizontal plane while being in contact with a peripheral edge of the wafer W.
    Type: Application
    Filed: February 11, 2015
    Publication date: August 13, 2015
    Inventors: Shuji Akiyama, Kazuya Yano, Isamu Inomata
  • Publication number: 20150204909
    Abstract: A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle tips and a supporting member 27 configured to support the WAPP 28. On a top surface of the WAPP 28, a wrapping sheet 29 is provided, and the WAPP 28 includes multiple recesses 31 formed on a bottom surface 30 thereof and the supporting member 27 includes multiple protrusions 33 formed on a ceiling surface 32 thereof. When the WAPP 28 is moved to a retreat position, the protrusions 33 are respectively inserted and fitted into the recesses 31, and when the WAPP 28 is moved to a contact position, top portions of the protrusions 33 are respectively brought into contact with portions on the bottom surface 30 where the recesses 31 are not formed.
    Type: Application
    Filed: January 21, 2015
    Publication date: July 23, 2015
    Inventors: Kazuya Yano, Shuji Akiyama
  • Patent number: 8866503
    Abstract: A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: October 21, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Kazunari Ishii, Toshihiko Iijima, Shuji Akiyama
  • Patent number: 8310261
    Abstract: There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: November 13, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Hiroki Hosaka, Shuji Akiyama, Tadashi Obikane