Patents by Inventor Shuji Akiyama
Shuji Akiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150204909Abstract: A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle tips and a supporting member 27 configured to support the WAPP 28. On a top surface of the WAPP 28, a wrapping sheet 29 is provided, and the WAPP 28 includes multiple recesses 31 formed on a bottom surface 30 thereof and the supporting member 27 includes multiple protrusions 33 formed on a ceiling surface 32 thereof. When the WAPP 28 is moved to a retreat position, the protrusions 33 are respectively inserted and fitted into the recesses 31, and when the WAPP 28 is moved to a contact position, top portions of the protrusions 33 are respectively brought into contact with portions on the bottom surface 30 where the recesses 31 are not formed.Type: ApplicationFiled: January 21, 2015Publication date: July 23, 2015Inventors: Kazuya Yano, Shuji Akiyama
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Patent number: 8866503Abstract: A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount.Type: GrantFiled: March 25, 2011Date of Patent: October 21, 2014Assignee: Tokyo Electron LimitedInventors: Kazunari Ishii, Toshihiko Iijima, Shuji Akiyama
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Patent number: 8310261Abstract: There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.Type: GrantFiled: June 19, 2009Date of Patent: November 13, 2012Assignee: Tokyo Electron LimitedInventors: Hiroki Hosaka, Shuji Akiyama, Tadashi Obikane
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Patent number: 8041097Abstract: To provide a confocal microscope for obtaining an extended image by easily determining the capturing range of an observation image without being aware of the shape of a sample to be observed, the confocal microscope comprises confocal image generating unit for generating a confocal image, first counting unit for counting a first number of pixels having a predetermined brightness level or lower among the brightness levels of the pixels of the confocal image, second counting unit for counting a second number of pixels obtained by extracting only a pixel that matches a predetermined condition for the confocal image, and boundary determining unit for detecting a boundary by determining whether or not the observation surface is within the image capturing range based on the first and the second numbers of pixels.Type: GrantFiled: September 11, 2008Date of Patent: October 18, 2011Assignee: Olympus CorporationInventors: Shuji Akiyama, Akihiro Kitahara
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Publication number: 20110234247Abstract: A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount.Type: ApplicationFiled: March 25, 2011Publication date: September 29, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Kazunari ISHII, Toshihiko Iijima, Shuji Akiyama
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Patent number: 8007389Abstract: A technique of a heavy object turning apparatus that is compact, is enabled to reduce the distance between the center of gravity of a heavy object and a pivot positioned on an axis, and is configured so that a turning arm and a drive unit has a length in the direction of an axis passing through the pivot around which the heavy object is turned. A control unit fixes a support base onto a stand. An orthogonal axis reduction gear serves as an anterior reduction gear and has a configuration in which an output shaft is on an axis of a planetary gear type reduction gear serving as the posterior reduction gear. An input shaft is perpendicular to the axis. The orthogonal reduction gear is constituted by a hypoid reduction gear or a worm-geared reduction gear. A motor is disposed on the bottom surface of the orthogonal reduction gear.Type: GrantFiled: September 2, 2005Date of Patent: August 30, 2011Assignees: Nabtesco Corporation, Tokyo Electron LimitedInventors: Toshihiro Yudate, Shuji Akiyama, Hiroshi Yamada, Nobuhiro Kameda
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Patent number: 7887280Abstract: There is provided a processing apparatus capable of modifying an existing processing apparatus having a single loading port to one having dual loading ports by providing an additional loading port without increasing a foot print thereof and also capable of realizing a complete automation of a wafer transfer by utilizing an existing automatic transfer line. The processing apparatus includes a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon waters; a sub-chuck, disposed under the second loading port, for positioning the wafers; and a wafer transfer unit having a transfer arm for transferring the wafers between the sub-chuck and the prober chamber, the transfer arm being rotatable and movable vertically.Type: GrantFiled: May 11, 2007Date of Patent: February 15, 2011Assignee: Tokyo Electron LimitedInventors: Hiroki Hosaka, Shuji Akiyama, Tadashi Obikane
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Publication number: 20100310351Abstract: In a method for handling a wafer case having attachable and detachable grips, the method comprising the step of handling the wafer case e in an automatic transfer line while the attachable and detachable grips are detached from the wafer case and holding parts allowing an automatic transfer unit to hold the wafer case are attached to portions of the wafer case from which the attachable and detachable grips have been detached. The holding parts allow an automatic transfer unit to hold the wafer case.Type: ApplicationFiled: August 13, 2010Publication date: December 9, 2010Applicant: TOKYO ELECTRON LIMITEDInventor: Shuji AKIYAMA
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Patent number: 7794350Abstract: A compact turning device for a heavy object, comprising a turning arm joined to the heavy object and a drive device drivingly turning the turning arm. The drive device further comprises a motor incorporating a rotor shaft connected to the rotating input part of a planetary gear type speed reducer on a same axis (A). Also, the turning arm is installed by joining its first plane to the plane of the planetary gear type speed reducer forming the rotating output part and its second plane orthogonal to the first plane to the heavy object. The turning arm and the drive device are disposed within the width (D) of the heavy object in the axis (A) direction of the turning pivot of the turning arm. The planetary gear type speed reducer of the drive device may be disposed in two front and rear stages.Type: GrantFiled: March 23, 2005Date of Patent: September 14, 2010Assignees: Tokyo Electron Limited, Nabtesco CorporationInventors: Shuji Akiyama, Toshihiro Yudate, Hiroshi Yamada, Nobuhiro Kameda
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Patent number: 7741837Abstract: A probe apparatus includes a load port for mounting therein a carrier having therein a plurality of substrates; a plurality of probe apparatus main bodies, each having a probe card having probes on its bottom surface; a substrate transfer mechanism for transferring the substrates between the load port and the probe apparatus main bodies, the substrate transfer mechanism being rotatable about a vertical axis and movable up and down. The substrate transfer mechanism has at least three substrates capable of moving back and forth independently. Further, at least two wafers are received from the carrier by the substrate transfer mechanism, and then are sequentially loaded into the probe apparatus main bodies. The prove apparatus a high throughput increasing a wafer transfer efficiency.Type: GrantFiled: May 14, 2008Date of Patent: June 22, 2010Assignee: Tokyo Electron LimitedInventors: Tadashi Obikane, Shuji Akiyama
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Patent number: 7701236Abstract: A prove apparatus includes a first and a second loading port for mounting therein two carriers facing each other, a wafer transfer mechanism having a rotation center between the loading ports, and a first and a second inspection unit being symmetrical to each other and disposed in accordance with the arrangement of the loading ports. In this configuration, wafers are directly transferred between the carrier and a wafer chuck of the inspection unit by the wafer transfer mechanism. The wafer transfer mechanism has three arms for unloading two wafers from the carrier. The prove apparatus has a compact size and achieves a high throughput.Type: GrantFiled: May 14, 2008Date of Patent: April 20, 2010Assignee: Tokyo Electron LimitedInventors: Shuji Akiyama, Tadashi Obikane, Masaru Suzuki, Yasuhito Yamamoto, Kazuya Yano, Yuji Asakawa, Kazumi Yamagata, Shigeki Nakamura, Eiichi Matsuzawa, Kazuhiro Ozawa, Fumito Kagami, Shinji Kojima
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Publication number: 20090267626Abstract: There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.Type: ApplicationFiled: June 19, 2009Publication date: October 29, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Hiroki HOSAKA, Shuji Akiyama, Tadashi Obikane
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Patent number: 7583096Abstract: There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.Type: GrantFiled: May 11, 2007Date of Patent: September 1, 2009Assignee: Tokyo Electron LimitedInventors: Hiroki Hosaka, Shuji Akiyama, Tadashi Obikane
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Publication number: 20090097109Abstract: To provide a confocal microscope for obtaining an extended image by easily determining the capturing range of an observation image without being aware of the shape of a sample to be observed, the confocal microscope comprises confocal image generating unit for generating a confocal image, first counting unit for counting a first number of pixels having a predetermined brightness level or lower among the brightness levels of the pixels of the confocal image, second counting unit for counting a second number of pixels obtained by extracting only a pixel that matches a predetermined condition for the confocal image, and boundary determining unit for detecting a boundary by determining whether or not the observation surface is within the image capturing range based on the first and the second numbers of pixels.Type: ApplicationFiled: September 11, 2008Publication date: April 16, 2009Applicant: Olympus CorporationInventors: Shuji Akiyama, Akihiro Kitahara
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Publication number: 20080298948Abstract: A technique of a heavy object turning apparatus that is compact, is enabled to reduce the distance between the center of gravity of a heavy object and a pivot positioned on an axis, and is configured so that a turning arm and a drive unit has a length in the direction of an axis passing through the pivot around which the heavy object is turned. A control unit fixes a support base onto a stand. An orthogonal axis reduction gear serves as an anterior reduction gear and has a configuration in which an output shaft is on an axis of a planetary gear type reduction gear serving as the posterior reduction gear. An input shaft is perpendicular to the axis. The orthogonal reduction gear is constituted by a hypoid reduction gear or a worm-geared reduction gear. A motor is disposed on the bottom surface of the orthogonal reduction gear.Type: ApplicationFiled: September 2, 2005Publication date: December 4, 2008Applicants: TOKYO ELECTRON LIMITED, NABTESCO CORPORATIONInventors: Toshihiro Yudate, Shuji Akiyama, Hiroshi Yamada, Nobuhiro Kameda
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Publication number: 20080290886Abstract: A prove apparatus includes a first and a second loading port for mounting therein two carriers facing each other, a wafer transfer mechanism having a rotation center between the loading ports, and a first and a second inspection unit being symmetrical to each other and disposed in accordance with the arrangement of the loading ports. In this configuration, wafers are directly transferred between the carrier and a wafer chuck of the inspection unit by the wafer transfer mechanism. The wafer transfer mechanism has three arms for unloading two wafers from the carrier. The prove apparatus has a compact size and achieves a high throughput.Type: ApplicationFiled: May 14, 2008Publication date: November 27, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Shuji Akiyama, Tadashi Obikane, Masaru Suzuki, Yasuhito Yamamoto, Kazuya Yano, Yuji Asakawa, Kazumi Yamagata, Shigeki Nakamura, Eiichi Matsuzawa, Kazuhiro Ozawa, Fumito Kagami, Shinji Kojima
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Patent number: 7457680Abstract: The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.Type: GrantFiled: October 18, 2006Date of Patent: November 25, 2008Assignee: Tokyo Electron LimitedInventors: Shuji Akiyama, Toshihiko Iijima, Hiroki Hosaka
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Patent number: D592230Type: GrantFiled: November 16, 2007Date of Patent: May 12, 2009Assignee: Tokyo Electron LimitedInventors: Hiroki Hosaka, Shuji Akiyama, Tadashi Obikane
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Patent number: D602882Type: GrantFiled: August 4, 2008Date of Patent: October 27, 2009Assignee: Tokyo Electron LimitedInventors: Hiroki Hosaka, Shuji Akiyama, Tadashi Obikane
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Patent number: D607424Type: GrantFiled: October 2, 2006Date of Patent: January 5, 2010Assignee: Tokyo Electron LimitedInventors: Hiroki Hosaka, Shuji Akiyama, Tadashi Obikane