Patents by Inventor Shun-Chi Chang

Shun-Chi Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10796060
    Abstract: A computer readable storage medium encoded with program instructions, wherein, when the program instructions is executed by at least one processor, the at least one processor performs a method. The method includes selecting a cell, determining whether a pin has an area smaller than a predetermined area, allowing a pin access of the pin to extend in a corresponding patterning track of the pin access when the pin access when the pin is determined to be having an area smaller than the predetermined threshold, and causing an integrated circuit to be fabricated according to the pin.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: October 6, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Fong-Yuan Chang, Li-Chun Tien, Shun-Li Chen, Ya-Chi Chou, Ting-Wei Chiang, Po-Hsiang Huang
  • Publication number: 20190369676
    Abstract: An electronic device includes a casing, a driven component, a magnetic component and an electromagnetic component. The casing has an outer surface, an inner surface, and an accommodating groove penetrating through the outer surface and the inner surface. The driven component is movably disposed in the accommodating groove. The magnetic component is connected to the driven component. The electromagnetic component is aligned with the magnetic component, and the magnetic component and the electromagnetic component are located at the same side of the inner surface. When the electromagnetic component isn't powered, the magnetic component and the electromagnetic component are attracted to each other, and the driven component is positioned at a first position. When the electromagnetic component is powered, the magnetic component and the electromagnetic component are repulsed to each other so as to drive the driven component to move from the first position to the second position.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 5, 2019
    Applicant: Acer Incorporated
    Inventors: Hung-Chi Chen, Ming-Feng Hsieh, Ju-Hsien Weng, Tzu-Hsiang Chang, Zheng-Yan Lee, Yu-Ming Lin, Huei-Ting Chuang, Shun-Bin Chen
  • Publication number: 20190243940
    Abstract: A computer readable storage medium encoded with program instructions, wherein, when the program instructions is executed by at least one processor, the at least one processor performs a method. The method includes selecting a cell, determining whether a pin has an area smaller than a predetermined area, allowing a pin access of the pin to extend in a corresponding patterning track of the pin access when the pin access when the pin is determined to be having an area smaller than the predetermined threshold, and causing an integrated circuit to be fabricated according to the pin.
    Type: Application
    Filed: April 17, 2019
    Publication date: August 8, 2019
    Inventors: FONG-YUAN CHANG, LI-CHUN TIEN, SHUN-LI CHEN, YA-CHI CHOU, TING-WEI CHIANG, PO-HSIANG HUANG
  • Patent number: 10361134
    Abstract: A method for performing a lithographic process over a semiconductor wafer is provided. The method includes coating a photoresist layer over a material layer which is formed on the semiconductor wafer in a track apparatus. The method further includes transferring the semiconductor wafer from the track apparatus to an exposure apparatus. The method also includes measuring a height of the photoresist layer before the removal of the semiconductor wafer from the track apparatus. In addition, the method includes measuring height of the material layer in the exposure apparatus. The method also includes determining a focal length for exposing the semiconductor wafer according to the height of the photoresist layer and the height of the material layer.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: July 23, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih Lai, Li-Kai Cheng, Shun-Jung Chen, Bo-Tsun Liu, Han-Lung Chang, Tzung-Chi Fu, Li-Jui Chen
  • Patent number: 7737854
    Abstract: A radio frequency identification tag is provided. The radio frequency identification tag includes a body and a cutting indication formed on the body. The body includes a substrate, an antenna disposed on the substrate and an integrated circuit disposed on the substrate and electrically connected to the antenna for performing a radio frequency communication. An extension of the cutting indication intersects with the antenna to separate the body into two parts after breaking.
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: June 15, 2010
    Assignee: Yuen Foong Yu Paper Mfg. Co. Ltd.
    Inventors: Shun-Chi Chang, Min Shun Wu, Yung Sheng Kuo
  • Publication number: 20090027206
    Abstract: A radio frequency identification tag is provided. The radio frequency identification tag includes a body and a cutting indication formed on the body. The body includes a substrate, an antenna disposed on the substrate and an integrated circuit disposed on the substrate and electrically connected to the antenna for performing a radio frequency communication. An extension of the cutting indication intersects with the antenna to separate the body into two parts after breaking.
    Type: Application
    Filed: January 18, 2008
    Publication date: January 29, 2009
    Applicant: YUEN FOONG YU PAPER MFG. CO. LTD.
    Inventors: Shun-Chi Chang, Min Shun Wu, Yung Sheng Kuo
  • Publication number: 20090020613
    Abstract: A method for packaging a smart card is provided. The method includes steps of providing a first thermoforming plastic piece; providing a first piece on the first thermoforming plastic piece and having an aperture; disposing an electrical element on the first thermoforming plastic piece and in the aperture; providing a second thermoforming plastic piece covering the first piece and the electrical element; and heating the first and the second thermoforming plastic pieces.
    Type: Application
    Filed: January 7, 2008
    Publication date: January 22, 2009
    Inventors: Shun-Chi Chang, Min-Shun Wu, Yung-Sheng Kuo, Chi-Kuang Liu, Ming-Tsai Wang
  • Publication number: 20070159341
    Abstract: A packaging structure for a radio frequency identification (RFID) device is disclosed which comprises a substrate, an antenna with a plurality of terminals formed on the substrate, a RFID chip with a plurality of signal pins electrically coupled to the plurality of terminals, respectively, and a plurality of thermally activated binding pads being electrically conductive and in contact with the plurality of signal pins, respectively, wherein the RFID chip is adhered to the substrate by the plurality of binding pads after a thermo-pressing process.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 12, 2007
    Inventors: Shun-Chi Chang, Guo-Tung Chiang, Chun-Ping Wu, Mei-Yi Wu, Cheng-Hsien Chou
  • Publication number: 20070159340
    Abstract: A structure for packaging a radio frequency identification (RFID) device is disclosed, which comprises a substrate, an antenna formed on the substrate, a RFID chip with a first side attached to the substrate and a second side having at least one signal pin exposed, at least one conductive contact plate placed on the substrate in contact with both the exposed signal pin and a portion of the antenna, and a protective film over the contact plate to secure the same to the substrate, wherein an electrical connection between the signal pin and the portion of the antenna is made through the contact plate.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 12, 2007
    Inventors: Kuo-Tung Chiang, Shun-Chi Chang, Chun-Ping Wu, Mei-Yi Wu, Cheng-Hsien Chou, Mong-Tai Yang, Min Wu
  • Patent number: 7009201
    Abstract: A single molecular species having a low-forward-voltage rectifying property is provided. The molecular species is represented by the formula: CL-IL-A-IR-CR where A is a “conducting” moiety (with a relatively narrow HOMO-LUMO gap), IL and IR are each an “insulating” moiety (with a relatively wide HOMO-LUMO gap), CL is a connecting group for attachment to a first electrode, and CR is a connecting group for attachment to a second electrode. Also, a low-forward-voltage rectifying molecular rectifier is provided, comprising the molecular species attached between the two electrodes. The present teachings provide a set of design rules to build single-molecule rectifying diodes that operate at low forward and large reverse voltages. Such single-molecule rectifying diodes are useful in a variety of nano-scale applications.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: March 7, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Pavel Kornilovich, Alexendre M. Bratkovski, Shun-Chi Chang, R. Stanley Williams
  • Publication number: 20040195565
    Abstract: A single molecular species having a low-forward-voltage rectifying property is provided.
    Type: Application
    Filed: November 7, 2003
    Publication date: October 7, 2004
    Inventors: Pavel Kornilovich, Alexendre M. Bratkovski, Shun-Chi Chang, R. Stanley Williams
  • Publication number: 20040134386
    Abstract: A refractory material is made of plant fibers, refractory granules, and inorganic cement materials in a predetermined proportion, wherein the refractory granules are evenly mixed with the inorganic cement materials, so that it can penetrate between the plant fibers and cover the surface of the plant fiber, the refractory property of the porous refractory granule can effectively strengthen the refractory capability of the inorganic cement material and plant fiber, so that the mixture can stand a burning temperature higher than traditional partition materials, the plant fibers are evenly mixed to effectively enhance the tenacity of the partition material such that the partition material can stand a high-temperature burning for a long time and will not crack into pieces or powder easily.
    Type: Application
    Filed: January 15, 2003
    Publication date: July 15, 2004
    Applicant: FREEDOM GROUP LTD.
    Inventors: Shun-Chi Chang, Chin-Hung Wu
  • Patent number: 6670631
    Abstract: A single molecular species having a low-forward-voltage rectifying property is provided. The molecular species is represented by the formula: CL—IL—A—IR—CR where A is a “conducting” moiety (with a relatively narrow HOMO-LUMO gap), IL and IR are each an “insulating” moiety (with a relatively wide HOMO-LUMO gap), CL is a connecting group for attachment to a first electrode, and CR is a connecting group for attachment to a second electrode. Also, a low-forward-voltage rectifying molecular rectifier is provided, comprising the molecular species attached between the two electrodes. The present teachings provide a set of design rules to build single-molecule rectifying diodes that operate at low forward and large reverse voltages. Such single-molecule rectifying diodes are useful in a variety of nano-scale applications.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: December 30, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Pavel Kornilovich, Alexendre M. Bratkovski, Shun-Chi Chang, R. Stanley Williams
  • Publication number: 20030213951
    Abstract: A single molecular species having a low-forward-voltage rectifying property is provided.
    Type: Application
    Filed: May 20, 2002
    Publication date: November 20, 2003
    Inventors: Pavel Kornilovich, Alexendre M. Bratkovski, Shun-Chi Chang, R. Stanley Williams