Patents by Inventor Shun-Jen Chiang
Shun-Jen Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11319410Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.Type: GrantFiled: January 11, 2018Date of Patent: May 3, 2022Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Po-Yu Huang, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Shun-Jen Chiang, Chung-Kai Cheng
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Patent number: 11198792Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.Type: GrantFiled: July 14, 2017Date of Patent: December 14, 2021Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Chung-Kai Cheng, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Po-Yu Huang, Shun-Jen Chiang
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Patent number: 11034797Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.Type: GrantFiled: March 30, 2018Date of Patent: June 15, 2021Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Meng-Yen Chou, Chung-Jen Wu, Chang-Hong Ho, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
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Patent number: 10995179Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.Type: GrantFiled: June 17, 2016Date of Patent: May 4, 2021Assignee: ETERNAL MATERIALS CO., LTDInventors: Shun-Jen Chiang, Chung-Jen Wu, Po-Yu Huang, Meng-Yen Chou, Chang-Hong Ho, Chun-Kai Cheng
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Publication number: 20210079161Abstract: The present disclosure relates to a polyimide precursor composition comprising an antic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.Type: ApplicationFiled: November 23, 2020Publication date: March 18, 2021Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Meng-Yen CHOU, Chung-Jen WU, Chang-Hong HO, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
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Patent number: 10765008Abstract: The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.Type: GrantFiled: June 17, 2016Date of Patent: September 1, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Shun-Jen Chiang, Chung-Jen Wu, Meng-Yen Chou
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Patent number: 10731004Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.Type: GrantFiled: November 30, 2017Date of Patent: August 4, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Chang-Hong Ho, Chung-Jen Wu, Meng-Yen Chou, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
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Patent number: 10639876Abstract: The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.Type: GrantFiled: July 20, 2015Date of Patent: May 5, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Chung-Jen Wu, Meng-Yen Chou, Yi-Chung Shih, Meng-Tso Chen, Chih-Ming An, Chang-Hong Ho, Shih-Chieh Yeh, Shun-Jen Chiang, Po-Yu Huang, Shu-Wan Lu
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Patent number: 10626220Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.Type: GrantFiled: November 29, 2017Date of Patent: April 21, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Chang-Hong Ho, Chung-Jen Wu, Meng-Yen Chou, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
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Patent number: 10590305Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.Type: GrantFiled: June 29, 2017Date of Patent: March 17, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Po-Yu Huang, Chih-Min An, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Shun-Jen Chiang, Chung-Kai Cheng
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Publication number: 20180282577Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.Type: ApplicationFiled: July 14, 2017Publication date: October 4, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Chung-Kai CHENG, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Po-Yu HUANG, Shun-Jen CHIANG
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Publication number: 20180282482Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.Type: ApplicationFiled: March 30, 2018Publication date: October 4, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Meng-Yen CHOU, Chung-Jen Wu, Chang-Hong Ho, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
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Publication number: 20180194899Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.Type: ApplicationFiled: January 11, 2018Publication date: July 12, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Po-Yu HUANG, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Shun-Jen CHIANG, Chung-Kai CHENG
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Publication number: 20180148541Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.Type: ApplicationFiled: November 30, 2017Publication date: May 31, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Chang-Hong HO, Chung-Jen WU, Meng-Yen CHOU, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
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Publication number: 20180148544Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.Type: ApplicationFiled: November 29, 2017Publication date: May 31, 2018Applicant: ETERNAL MATERIAL CO., LTD.Inventors: Chang-Hong HO, Chung-Jen WU, Meng-Yen CHOU, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
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Publication number: 20180002567Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.Type: ApplicationFiled: June 29, 2017Publication date: January 4, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Po-Yu HUANG, Chih-Min AN, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Shun-Jen CHIANG, Chung-Kai CHENG
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Publication number: 20160369053Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.Type: ApplicationFiled: June 17, 2016Publication date: December 22, 2016Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Shun-Jen CHIANG, Chung-Jen WU, Po-Yu HUANG, Meng-Yen CHOU, Chang-Hong HO, Chun-Kai CHENG
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Publication number: 20160374208Abstract: The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.Type: ApplicationFiled: June 17, 2016Publication date: December 22, 2016Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Shun-Jen CHIANG, Chung-Jen WU, Meng-Yen CHOU
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Publication number: 20160369056Abstract: The present disclosure relates to a polyimide precursor composition including an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. The polyimide made from the polyimide precursor composition of the present disclosure provides adhesion upon hot pressing such that a quasi double-sided two-layer metal clad laminate with an appropriate peeling strength or a double-sided two-layer metal clad laminate with a high peeling strength can be provided.Type: ApplicationFiled: June 17, 2016Publication date: December 22, 2016Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Chung-Jen WU, Shun-Jen CHIANG, Po-Yu HUANG, Meng-Yen CHOU, Chang-Hong HO
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Publication number: 20160017105Abstract: The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.Type: ApplicationFiled: July 20, 2015Publication date: January 21, 2016Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Chung-Jen WU, Meng-Yen CHOU, Yi-Chung SHIH, Meng-Tso CHEN, Chih-Ming AN, Chang-Hong HO, Shih-Chieh YEH, Shun-Jen CHIANG, Po-Bu HUANG, Shu-Wan LU