Patents by Inventor Shun-Jen Chiang

Shun-Jen Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11319410
    Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: May 3, 2022
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Po-Yu Huang, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Shun-Jen Chiang, Chung-Kai Cheng
  • Patent number: 11198792
    Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: December 14, 2021
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Chung-Kai Cheng, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Po-Yu Huang, Shun-Jen Chiang
  • Patent number: 11034797
    Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: June 15, 2021
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Meng-Yen Chou, Chung-Jen Wu, Chang-Hong Ho, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
  • Patent number: 10995179
    Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: May 4, 2021
    Assignee: ETERNAL MATERIALS CO., LTD
    Inventors: Shun-Jen Chiang, Chung-Jen Wu, Po-Yu Huang, Meng-Yen Chou, Chang-Hong Ho, Chun-Kai Cheng
  • Publication number: 20210079161
    Abstract: The present disclosure relates to a polyimide precursor composition comprising an antic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.
    Type: Application
    Filed: November 23, 2020
    Publication date: March 18, 2021
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Meng-Yen CHOU, Chung-Jen WU, Chang-Hong HO, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
  • Patent number: 10765008
    Abstract: The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: September 1, 2020
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Shun-Jen Chiang, Chung-Jen Wu, Meng-Yen Chou
  • Patent number: 10731004
    Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: August 4, 2020
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Chang-Hong Ho, Chung-Jen Wu, Meng-Yen Chou, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
  • Patent number: 10639876
    Abstract: The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: May 5, 2020
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Chung-Jen Wu, Meng-Yen Chou, Yi-Chung Shih, Meng-Tso Chen, Chih-Ming An, Chang-Hong Ho, Shih-Chieh Yeh, Shun-Jen Chiang, Po-Yu Huang, Shu-Wan Lu
  • Patent number: 10626220
    Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: April 21, 2020
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Chang-Hong Ho, Chung-Jen Wu, Meng-Yen Chou, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
  • Patent number: 10590305
    Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: March 17, 2020
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Po-Yu Huang, Chih-Min An, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Shun-Jen Chiang, Chung-Kai Cheng
  • Publication number: 20180282577
    Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.
    Type: Application
    Filed: July 14, 2017
    Publication date: October 4, 2018
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Chung-Kai CHENG, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Po-Yu HUANG, Shun-Jen CHIANG
  • Publication number: 20180282482
    Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 4, 2018
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Meng-Yen CHOU, Chung-Jen Wu, Chang-Hong Ho, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
  • Publication number: 20180194899
    Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 12, 2018
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Po-Yu HUANG, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Shun-Jen CHIANG, Chung-Kai CHENG
  • Publication number: 20180148541
    Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.
    Type: Application
    Filed: November 30, 2017
    Publication date: May 31, 2018
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Chang-Hong HO, Chung-Jen WU, Meng-Yen CHOU, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
  • Publication number: 20180148544
    Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.
    Type: Application
    Filed: November 29, 2017
    Publication date: May 31, 2018
    Applicant: ETERNAL MATERIAL CO., LTD.
    Inventors: Chang-Hong HO, Chung-Jen WU, Meng-Yen CHOU, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
  • Publication number: 20180002567
    Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.
    Type: Application
    Filed: June 29, 2017
    Publication date: January 4, 2018
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Po-Yu HUANG, Chih-Min AN, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Shun-Jen CHIANG, Chung-Kai CHENG
  • Publication number: 20160369053
    Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 22, 2016
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Shun-Jen CHIANG, Chung-Jen WU, Po-Yu HUANG, Meng-Yen CHOU, Chang-Hong HO, Chun-Kai CHENG
  • Publication number: 20160374208
    Abstract: The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 22, 2016
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Shun-Jen CHIANG, Chung-Jen WU, Meng-Yen CHOU
  • Publication number: 20160369056
    Abstract: The present disclosure relates to a polyimide precursor composition including an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. The polyimide made from the polyimide precursor composition of the present disclosure provides adhesion upon hot pressing such that a quasi double-sided two-layer metal clad laminate with an appropriate peeling strength or a double-sided two-layer metal clad laminate with a high peeling strength can be provided.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 22, 2016
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Chung-Jen WU, Shun-Jen CHIANG, Po-Yu HUANG, Meng-Yen CHOU, Chang-Hong HO
  • Publication number: 20160017105
    Abstract: The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.
    Type: Application
    Filed: July 20, 2015
    Publication date: January 21, 2016
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Chung-Jen WU, Meng-Yen CHOU, Yi-Chung SHIH, Meng-Tso CHEN, Chih-Ming AN, Chang-Hong HO, Shih-Chieh YEH, Shun-Jen CHIANG, Po-Bu HUANG, Shu-Wan LU