Abstract: A silicone pressure-sensitive adhesive composition exhibiting powerful adhesive strength to silicone rubbers. The composition includes (A) a polydiorganosiloxane composed of components (A1) and (A2) described below and having a mass ratio of (A1)/(A2) within a range from 100/0 to 10/90, (A1) a linear polydiorganosiloxane having two or more alkenyl groups within each molecule, (A2) a linear polydiorganosiloxane having SiOH groups at the terminals and having no alkenyl groups, (B) a polyorganosiloxane containing R33SiO0.5 units, SiO2 units and silanol groups and having a molar ratio of R33SiO0.5 units/SiO2 units within a range from 0.5 to 0.9, (C) a polyorganohydrogensiloxane containing three or more SiH groups, (D) a reaction retarder, (E) a platinum group metal-based catalyst, and (F) at least one metal compound having a formula MYx wherein M represents a metal element having an atomic valence of 3 or 4 such as aluminum, x represents a number equal to the atomic valence of M, and Y represents a ligand.

Abstract: The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.

Abstract: An object of the invention is to provide a flat ceramic sheet including an internal electrode used for manufacturing a multilayer ceramic electronic part. Specifically, an electrode portion is formed on a surface of a transparent base member, and a photosensitive slurry containing dielectric powder is applied thereon. The photosensitive slurry is exposed from the backside of the base member up to a predetermined thickness, and then it is subjected to development. After that, the base member is removed. Thus, a ceramic green sheet is obtained.

Abstract: A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer formed on a surface of the substrate film, said pressure sensitive adhesive layer being prepared from (A) a silicone composition comprising a diorganopolysiloxane having at least two alkenyl groups per molecule and (C) a polyorganosiloxane having an SiH bond, characterized in that the alkenyl groups are contained in an amount of from 0.0007 to 0.05 mole per 100 g of the diorganopolysiloxane (A) and that the polyorganosiloxane (C) is contained in such an amount that a molar ratio of the SiH bond to the alkenyl group of the diorganopolysiloxane (A) ranges from 0.5 to 20.

Abstract: A peroxide curable silicon adhesive composition comprising a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R13SiO0.5 unit and SiO2 unit in a molar ratio of the R13SiO0.5 unit to the SiO2 unit of from 0.6 to 1.7, a hindered amine compound (C), and an organic peroxide (D), and an adhesive tape thereof are provided. Also provided are an addition-reactive silicon adhesive composition comprising a diorganopolysiloxane (A?) having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C), a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G), and an adhesive tape thereof.

Abstract: A solventless silicone pressure-sensitive adhesive composition is provided. The composition includes (A) a polyorganosiloxane with a polymerization degree of 300 to 2,000 and having at least two alkenyl group-containing organic groups, (B) a polyorganohydrosiloxane having at least three silicon-bonded hydrogen atoms, (C) a polydiorganosiloxane having alkenyl groups at both terminals, (D) a polydiorganosiloxane having SiH groups at both terminals, (E) a polyorganosiloxane composed of R23SiO1/2 units and SiO2 units (R2 is a monovalent hydrocarbon group), and (F) a platinum-based catalyst. The composition enables the prevention of problems caused by residual or volatilized organic substances, such as the absorption of ultraviolet radiation or the like, and also enables ready removal of the composition without deforming or damaging the adherend.

Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.

Abstract: A peroxide curable silicon adhesive composition comprising a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R13SiO0.5 unit and SiO2 unit in a molar ratio of the R13SiO0.5 unit to the SiO2 unit of from 0.6 to 1.7, a hindered amine compound (C), and an organic peroxide (D), and an adhesive tape thereof are provided. Also provided are an addition-reactive silicon adhesive composition comprising a diorganopolysiloxane (A?) having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C), a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G), and an adhesive tape thereof.

Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.

Abstract: A peroxide curable silicon adhesive composition comprising a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R13SiO0.5 unit and SiO2 unit in a molar ratio of the R13SiO0.5 unit to the SiO2 unit of from 0.6 to 1.7, a hindered amine compound (C), and an organic peroxide (D), and an adhesive tape thereof are provided. Also provided are an addition-reactive silicon adhesive composition comprising a diorganopolysiloxane (A?) having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C), a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G), and an adhesive tape thereof.

Abstract: A method for preparing a polyorganosiloxane which is sold at 25 ° C. and has R13SiO0.5 units wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms and SiO2 units, said method comprising the steps of: [1] subjecting at least one selected from an organosilane and an organodisiloxane, and at least one selected from a tetralkoxysilane and a partial condensate of hydrolysates of the tetralkoxysilane to hydrolysis reaction and condensation reaction in the presence of an acidic catalyst; [2] adding a liquid aliphatic hydrocarbon; and subsequently [3] separating a liquid aliphatic hydrocarbon phase and an aqueous phase and then removing said aqueous phase; provided that the step [2] may be performed before, during, or after the step [1].

Abstract: The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part.

Abstract: The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.

Abstract: An object of the invention is to provide a flat ceramic sheet including an internal electrode used for manufacturing a multilayer ceramic electronic part. Specifically, an electrode portion is formed on a surface of a transparent base member, and a photosensitive slurry containing dielectric powder is applied thereon. The photosensitive slurry is exposed from the backside of the base member up to a predetermined thickness, and then it is subjected to development. After that, the base member is removed. Thus, a ceramic green sheet is obtained.

Abstract: A peroxide curable silicon adhesive composition comprising a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R13SiO0.5 unit and SiO2 unit in a molar ratio of the R13SiO0.5 unit to the SiO2 unit of from 0.6 to 1.7, a hindered amine compound (C), and an organic peroxide (D), and an adhesive tape thereof are provided. Also provided are an addition-reactive silicon adhesive composition comprising a diorganopolysiloxane (A?) having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C), a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G), and an adhesive tape thereof.

Abstract: A silicone composition for use as a pressure sensitive adhesive, comprising a mixture obtained by reacting (A) a polyorganosiloxane having at least two alkenyl groups per molecule with (B) a polyorganosiloxane having an R13SiO0.5 unit and a SiO2 unit, wherein R1 may be the same with or different from each other and is a monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) a polyorganosiloxane having an SiH group, (D) a retarder and (E) a platinum group metal catalyst. A pressure sensitive adhesive tape made from the composition can be peeled off from an object without leaving adhesive residue even after aged at a temperature of 250° C. or higher.

Abstract: A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer formed on a surface of the substrate film, said pressure sensitive adhesive layer being prepared from (A) a silicone composition comprising a diorganopolysiloxane having at least two alkenyl groups per molecule and (C) a polyorganosiloxane having an SiH bond, characterized in that the alkenyl groups are contained in an amount of from 0.0007 to 0.05 mole per 100 g of the diorganopolysiloxane (A) and that the polyorganosiloxane (C) is contained in such an amount that a molar ratio of the SiH bond to the alkenyl group of the diorganopolysiloxane (A) ranges from 0.5 to 20.

Abstract: A conductive powder is incorporated in a pressure-sensitive adhesive composition comprising a silicone gum, an MQ resin, and a crosslinking agent. The conductive powder consists of core particles of inorganic material or organic resin, an interlayer of silicon-base polymer, and a metal plating. The resulting conductive silicone pressure-sensitive adhesive composition is satisfactorily adherent to silicone rubber and cures into a product that exhibits stable conductivity and adhesive properties in the temperature region where silicone rubber is used.

Abstract: The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part.

Abstract: There is provided a sheet used for manufacturing multilayer electronic parts in which accuracy in shape and formation position and uniformity in thickness of a complex configuration with recesses and projections of an insulating layer or the like are assured. A layer made of a photosensitive material containing a powder having a specific electric characteristic is formed on a light transmissive base member. A mask having a plurality of patterns with different transmittances for ultraviolet light is disposed on the back side of the base member. The photosensitive material is subjected to an exposure process in which it is irradiated with ultraviolet light or the like through the mask. The photosensitive material is subjected to development process after the exposure process.