Patents by Inventor Shunji Fukuda

Shunji Fukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240294034
    Abstract: A decorative sheet includes a decorative layer. Holes arranged in a plurality of directions are provided in the decorative layer. An average of values of an array pitch of holes arranged in a first array direction, in which the array pitch has a least value among the plurality of directions, and a standard deviation thereof, and an average of values of an array pitch of holes arranged in a second array direction, in which the array pitch has a second least value among the plurality of directions, and a standard deviation thereof, meet particular conditions.
    Type: Application
    Filed: March 9, 2022
    Publication date: September 5, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji FUKUDA, Shinya YODA, Tsubasa TAKAKURA, Youhei KAKUBA, Hiroyuki KUNIYASU
  • Patent number: 11529798
    Abstract: The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base material film for mold release, a hard coat layer, a primer layer, and an adhesive layer. The weather resistance and adhesiveness of the hard coat layer and the primer layer are improved and hard coat properties and excellent weather resistance can be provided to a resin molded article being the transfer object, as a result of: the hard coat layer being formed from a cured product of a resin composition including a curable resin; and the primer layer being formed from a binder resin including a polyurethane having a mass-average molecular weight of 40,000-100,000 and including 1-30% by mass of an acrylic component.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: December 20, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shunji Fukuda, Junichi Tamuki, Keisuke Koyama
  • Publication number: 20200384747
    Abstract: The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base material film for mold release, a hard coat layer, a primer layer, and an adhesive layer. The weather resistance and adhesiveness of the hard coat layer and the primer layer are improved and hard coat properties and excellent weather resistance can be provided to a resin molded article being the transfer object, as a result of: the hard coat layer being formed from a cured product of a resin composition including a curable resin; and the primer layer being formed from a binder resin including a polyurethane having a mass-average molecular weight of 40,000-100,000 and including 1-30% by mass of an acrylic component.
    Type: Application
    Filed: August 24, 2020
    Publication date: December 10, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Shunji Fukuda, Junichi Tamuki, Keisuke Koyama
  • Patent number: 10792903
    Abstract: The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base material film for mold release, a hard coat layer, a primer layer, and an adhesive layer. The weather resistance and adhesiveness of the hard coat layer and the primer layer are improved and hard coat properties and excellent weather resistance can be provided to a resin molded article being the transfer object, as a result of: the hard coat layer being formed from a cured product of a resin composition including a curable resin; and the primer layer being formed from a binder resin including a polyurethane having a mass-average molecular weight of 40,000-100,000 and including 1-30% by mass of an acrylic component.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: October 6, 2020
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shunji Fukuda, Junichi Tamuki, Keisuke Koyama
  • Patent number: 10434752
    Abstract: An objective of the present invention is to provide an organic glass laminate that exhibits excellent weathering resistance and abrasion resistance, and that can be used as an exterior member. This organic glass laminate comprises at least the following, in order: an organic glass base, a cured layer formed from the cured product of a resin composition, which comprises a curable resin and a UV absorber agent; and an inorganic oxide film. The glass transition temperature of the cured product which constitutes the cured layer is adjusted to 80-160° C., and the thickness of the inorganic oxide film is set to at least 0.01 ?m and less than 0.5 ?m, whereby weathering resistance and abrasion resistance are significantly improved, and the organic glass laminate is made suitable for use as an exterior member.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: October 8, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shunji Fukuda, Junichi Tamuki, Wataru Saitou, Kazuyuki Takasawa, Taro Morimoto, Keisuke Koyama, Misato Kamei, Masanao Matsuoka
  • Publication number: 20170320295
    Abstract: An objective of the present invention is to provide an organic glass laminate that exhibits excellent weathering resistance and abrasion resistance, and that can be used as an exterior member. This organic glass laminate comprises at least the following, in order: an organic glass base, a cured layer formed from the cured product of a resin composition, which comprises a curable resin and a UV absorber agent; and an inorganic oxide film. The glass transition temperature of the cured product which constitutes the cured layer is adjusted to 80-160° C., and the thickness of the inorganic oxide film is set to at least 0.01 ?m and less than 0.5 ?m, whereby weathering resistance and abrasion resistance are significantly improved, and the organic glass laminate is made suitable for use as an exterior member.
    Type: Application
    Filed: December 2, 2015
    Publication date: November 9, 2017
    Inventors: Shunji Fukuda, Junichi Tamuki, Wataru Saitou, Kazuyuki Takasawa, Taro Morimoto, Keisuke Koyama, Misato Kamei, Masanao Matsuoka
  • Publication number: 20170313911
    Abstract: The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base material film for mold release, a hard coat layer, a primer layer, and an adhesive layer. The weather resistance and adhesiveness of the hard coat layer and the primer layer are improved and hard coat properties and excellent weather resistance can be provided to a resin molded article being the transfer object, as a result of: the hard coat layer being formed from a cured product of a resin composition including a curable resin; and the primer layer being formed from a binder resin including a polyurethane having a mass-average molecular weight of 40,000-100,000 and including 1-30% by mass of an acrylic component.
    Type: Application
    Filed: November 5, 2015
    Publication date: November 2, 2017
    Inventors: Shunji Fukuda, Junichi Tamuki, Keisuke Koyama
  • Patent number: 9647242
    Abstract: Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: May 9, 2017
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji Fukuda, Katsuya Sakayori, Yasuhiro Iizumi
  • Publication number: 20160221870
    Abstract: The purpose of the present invention is to provide an organic glass laminate having excellent scratch resistance, wear resistance, wet adhesion, transparency, and weather resistance. This organic glass laminate comprises, in the following order, at least an organic glass substrate, a primer layer, and a hard-coat layer, wherein: the hard-coat layer is formed of a cured product of a resin composition including an ionizing-radiation-curable resin and an ultraviolet absorbent; the ultraviolet absorbent is included at a ratio of 0.5-10 parts by mass per a total of 100 parts by mass of the ionizing-radiation-curable resin; and the pencil hardness of the organic glass laminate and the initial value, as well as values found before and after a predetermined accelerated weathering test, of the haze and the yellow index of the organic glass laminate are set so as to fall within specific ranges.
    Type: Application
    Filed: September 19, 2014
    Publication date: August 4, 2016
    Inventors: Manabu Arita, Shunji Fukuda, Takeshi Kihara
  • Patent number: 9332631
    Abstract: A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 ?m to 20 ?m.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: May 3, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji Fukuda, Katsuya Sakayori, Toshimasa Takarabe
  • Patent number: 9024312
    Abstract: Disclosed is a substrate for a flexible device which, when a TFT is produced on a flexible substrate in which a metal layer and a polyimide layer are laminated, can suppress deterioration of the electrical performance of the TFT due to the surface irregularities of the metal foil surface and can suppress detachment or cracks of the TFT. Also disclosed is a substrate for a thin film element which has excellent surface smoothness and is capable of suppressing deterioration of the characteristics of thin film elements. Also disclosed are methods for manufacturing substrates for thin film elements.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: May 5, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shunji Fukuda, Katsuya Sakayori, Keita Arihara, Koji Ichimura, Kei Amagai
  • Patent number: 8778596
    Abstract: A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: July 15, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Mami Katayama, Shunji Fukuda, Katsuya Sakayori
  • Patent number: 8697332
    Abstract: An object of the present invention is to provide a base generator which has sensitivity and is applicable to a wide range of applications, and a photosensitive resin composition which is applicable to a wide range of applications due to the structure of a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance. The base generator generates a base by exposure to electromagnetic radiation and heating. The photosensitive resin composition comprises a polymer precursor in which reaction into a final product is promoted by the base generator and a basic substance or by heating in the presence of a basic substance.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: April 15, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Mami Katayama, Shunji Fukuda, Katsuya Sakayori, Kouji Kawaguchi
  • Publication number: 20140085830
    Abstract: A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 ?m to 20 ?m.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 27, 2014
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji FUKUDA, Katsuya SAKAYORI, Toshimasa TAKARABE
  • Publication number: 20130309607
    Abstract: A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.
    Type: Application
    Filed: April 25, 2013
    Publication date: November 21, 2013
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mami KATAYAMA, Shunji FUKUDA, Katsuya SAKAYORI
  • Patent number: 8476444
    Abstract: A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: July 2, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Mami Katayama, Shunji Fukuda, Katsuya Sakayori
  • Publication number: 20130126860
    Abstract: A main object of the present invention is to provide a TFT substrate having excellent switching characteristics. The object is attained by providing a thin film transistor substrate comprising: a substrate, and a thin film transistor having an oxide semiconductor layer that is formed on the substrate and is formed from an oxide semiconductor, and a semiconductor layer-adjoining insulating layer formed to be in contact with the oxide semiconductor layer, wherein at least one semiconductor layer-adjoining insulating layer included in the thin film transistor is a photosensitive polyimide insulating layer formed by using a photosensitive polyimide resin composition.
    Type: Application
    Filed: October 4, 2012
    Publication date: May 23, 2013
    Inventors: Shunji FUKUDA, Katsuya SAKAYORI, Keita ARIHARA
  • Publication number: 20120187399
    Abstract: Disclosed is a substrate for a flexible device which, when a TFT is produced on a flexible substrate in which a metal layer and a polyimide layer are laminated, can suppress deterioration of the electrical performance of the TFT due to the surface irregularities of the metal foil surface and can suppress detachment or cracks of the TFT. Also disclosed is a substrate for a thin film element which has excellent surface smoothness and is capable of suppressing deterioration of the characteristics of thin film elements. Also disclosed are methods for manufacturing substrates for thin film elements.
    Type: Application
    Filed: September 29, 2010
    Publication date: July 26, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji Fukuda, Katsuya Sakayori, Keita Arihara, Koji Ichimura, Kei Amagai
  • Publication number: 20120183751
    Abstract: The present invention is to provide a photosensitive resin composition which has excellent resolution, is low in cost and is applicable to a wide range of applications due to the structure of a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance. The present invention is also to provide a base generator which is applicable to such a photosensitive resin composition. Disclosed is a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating. Also disclosed is a photosensitive resin composition which comprises the base generator and a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance.
    Type: Application
    Filed: September 29, 2010
    Publication date: July 19, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mami Katayama, Shunji Fukuda, Katsuya Sakayori
  • Publication number: 20120181914
    Abstract: Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance.
    Type: Application
    Filed: September 29, 2010
    Publication date: July 19, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shunji Fukuda, Katsuya Sakayori, Yasuhiro Iizumi