Patents by Inventor Shunsuke Nakai
Shunsuke Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11941011Abstract: A provision method provides plurality of pieces of advice pertaining to household appliances of a user on a tablet 103. A priority of each piece of advice is changed by determining whether an advice-specific standard for the user the reference that piece of advice is met by an auto-log or overall user information. The pieces of advice are displayed in accordance with determination results. The format of display according to determination results is a list of advice sorted by priority.Type: GrantFiled: March 30, 2023Date of Patent: March 26, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Hiroshi Yoshitake, Hideo Umetani, Kentaro Nakai, Keigo Aso, Shunsuke Kuhara
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Patent number: 11854638Abstract: A memory stores dummy data including a first data area having more “0” than “1” of a binary logic and a second data area having more “1” than “0” of the binary logic. An ECC processor detects a first error bit number related to the first data area and a second error bit number related to the second data area. A calculator calculates a relative difference of the first error bit number from the second error bit number. A comparator compares the relative difference with a predetermined value. A corrector corrects a read voltage on the basis of a result of comparison by the comparator.Type: GrantFiled: February 4, 2022Date of Patent: December 26, 2023Assignee: MEGACHIPS CORPORATIONInventors: Shunsuke Nakai, Atsufumi Kawamura, Yasuhisa Marumo, Handa Chen
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Publication number: 20230378717Abstract: A control unit performs stop control of causing a power supply circuit to stop supplying the supply current, if a supply current is determined to exceed a predetermined threshold, determines whether an input AC voltage is abnormal, with supply of the supply current to the power supply circuit stopped by the stop control, and causes the power supply circuit to resume supplying the supply current, if the input AC voltage is determined not to be abnormal.Type: ApplicationFiled: August 3, 2023Publication date: November 23, 2023Inventors: Yuta KUROSAKI, Masashi SAMIZO, Shunsuke NAKAI
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Publication number: 20220254426Abstract: A memory stores dummy data including a first data area having more “0” than “1” of a binary logic and a second data area having more “1” than “0” of the binary logic. An ECC processor detects a first error bit number related to the first data area and a second error bit number related to the second data area. A calculator calculates a relative difference of the first error bit number from the second error bit number. A comparator compares the relative difference with a predetermined value. A corrector corrects a read voltage on the basis of a result of comparison by the comparator.Type: ApplicationFiled: February 4, 2022Publication date: August 11, 2022Applicant: MegaChips CorporationInventors: Shunsuke NAKAI, Atsufumi KAWAMURA, Yasuhisa MARUMO, Handa CHEN
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Publication number: 20220166448Abstract: A communication device according to the present disclosure includes a housing and at least one antenna component. The housing includes at least one metal portion used as an antenna that performs wireless communication in a first frequency band, and a transmission portion fixed to the metal portion and capable of transmitting radio waves. The metal portion is located at least at an end portion of the housing in a first direction. The antenna component is used for wireless communication in a second frequency band, and is covered with the transmission portion.Type: ApplicationFiled: May 17, 2019Publication date: May 26, 2022Applicant: Sony Group CorporationInventor: Shunsuke NAKAI
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Patent number: 10207390Abstract: A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.Type: GrantFiled: September 4, 2013Date of Patent: February 19, 2019Assignee: TOSHIBA MEMORY CORPORATIONInventors: Noburu Shimizu, Shinro Ohta, Koji Maruyama, Yoichi Kobayashi, Ryuichiro Mitani, Shunsuke Nakai, Atsushi Shigeta
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Publication number: 20140004773Abstract: A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.Type: ApplicationFiled: September 4, 2013Publication date: January 2, 2014Applicants: KABUSHIKI KAISHA TOSHIBA, EBARA CORPORATIONInventors: Noburu SHIMIZU, Shinro OHTA, Koji MARUYAMA, Yoichi KOBAYASHI, Ryuichiro MITANI, Shunsuke NAKAI, Atsushi SHIGETA
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Patent number: 8554356Abstract: A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.Type: GrantFiled: October 5, 2007Date of Patent: October 8, 2013Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Noburu Shimizu, Shinro Ohta, Koji Maruyama, Yoichi Kobayashi, Ryuichiro Mitani, Shunsuke Nakai, Atsushi Shigeta
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Patent number: 8342907Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: November 30, 2009Date of Patent: January 1, 2013Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Publication number: 20100075576Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: November 30, 2009Publication date: March 25, 2010Inventors: Yoichi KOBAYASHI, Shunsuke NAKAI, Hitoshi TSUJI, Yasuo TSUKUDA, Junki ISHIMOTO, Kazunari SHINYA
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Patent number: 7675634Abstract: A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.Type: GrantFiled: August 13, 2008Date of Patent: March 9, 2010Assignee: Ebara CorporationInventors: Toshifumi Kimba, Shunsuke Nakai
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Publication number: 20100015889Abstract: The present invention relates to a processing end point detection method for detecting a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate.Type: ApplicationFiled: October 5, 2007Publication date: January 21, 2010Inventors: Noburu Shimizu, Shinro Ohta, Koji Maruyama, Yoichi Kobayashi, Ryuichiro Mitani, Shunsuke Nakai, Atsushi Shigeta
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Patent number: 7645181Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: August 27, 2008Date of Patent: January 12, 2010Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Patent number: 7585204Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: GrantFiled: February 17, 2009Date of Patent: September 8, 2009Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Publication number: 20090191790Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: ApplicationFiled: February 17, 2009Publication date: July 30, 2009Inventors: Yoichi KOBAYASHI, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Patent number: 7547242Abstract: A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the measurement fluid to the fluid chamber.Type: GrantFiled: May 19, 2004Date of Patent: June 16, 2009Assignees: Ebara Corporation, Shimadzu CorporationInventors: Kazuto Hirokawa, Yoichi Kobayashi, Shunsuke Nakai, Shinrou Ohta, Yasuo Tsukuda
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Patent number: 7510460Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: GrantFiled: May 31, 2007Date of Patent: March 31, 2009Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Patent number: 7507144Abstract: A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table.Type: GrantFiled: March 28, 2007Date of Patent: March 24, 2009Assignee: Ebara CorporationInventors: Kazuto Hirokawa, Shunsuke Nakai, Shinrou Ohta, Yutaka Wada, Yoichi Kobayashi
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Publication number: 20090051939Abstract: A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.Type: ApplicationFiled: August 13, 2008Publication date: February 26, 2009Inventors: Toshifumi Kimba, Shunsuke Nakai
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Publication number: 20090011680Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: August 27, 2008Publication date: January 8, 2009Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya