Patents by Inventor Shusuke Kitawaki

Shusuke Kitawaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10106662
    Abstract: The porous polyurethane polishing pad includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. The porous matrix is a blend of two thermoplastic polymers. The first thermoplastic polyurethane has by molecular percent, 45 to 60 adipic acid, 10 to 30 MDI-ethylene glycol and 15 to 35 MDI and an Mn of 40,000 to 60,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 2.5 to 4 The second thermoplastic polyurethane has by molecular percent, 40 to 50 adipic acid, 20 to 40 adipic acid butane diol, 5 to 20 MDI-ethylene glycol and 5 to 25 MDI and an Mn of 60,000 to 80,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 1.5 to 3.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: October 23, 2018
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Shuiyuan Luo, George C. Jacob, Henry Sanford-Crane, Koichi Yoshida, Katsumasa Kawabata, Shusuke Kitawaki, Shogo Takahashi, Yosuke Takei
  • Publication number: 20180037706
    Abstract: The porous polyurethane polishing pad includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. The porous matrix is a blend of two thermoplastic polymers. The first thermoplastic polyurethane has by molecular percent, 45 to 60 adipic acid, 10 to 30 MDI-ethylene glycol and 15 to 35 MDI and an Mn of 40,000 to 60,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 2.5 to 4 The second thermoplastic polyurethane has by molecular percent, 40 to 50 adipic acid, 20 to 40 adipic acid butane diol, 5 to 20 MDI-ethylene glycol and 5 to 25 MDI and an Mn of 60,000 to 80,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 1.5 to 3.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 8, 2018
    Inventors: Shuiyuan Luo, George C. Jacob, Henry Sanford-Crane, Koichi Yoshida, Katsumasa Kawabata, Shusuke Kitawaki, Shogo Takahashi, Yosuke Takei
  • Patent number: 6800019
    Abstract: An abrasive ground fabric which is a composite ground fabric comprising a fiber substrate and a elastic polymer filled in the fiber substrate, wherein (1) the fiber substrate is composed of bundles, each consisting of 20 to 3,000 fine fibers, and (2) the average diameter (D1) of fine fibers existent in a center portion from the center of the cross section perpendicular to a lengthwise direction of each bundle to ½ of the radius of each bundle is 0.3 to 10 &mgr;m, the average diameter (D2) of fine fibers existent in a peripheral portion from ½ of the radius to the end of each bundle is 0.05 to 1 &mgr;m, and the D1/D2 ratio is 1.5 or more. According to the present invention, the abrasive ground fabric is suitably used for the texturing of a substrate in the production of a magnetic recording medium, particularly a hard disk, enables high-accuracy surface finish and has excellent strength.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: October 5, 2004
    Assignee: Teijin Limited
    Inventors: Manabu Tanaka, Yoshiyuki Suzuki, Shusuke Kitawaki, Masahisa Mimura
  • Publication number: 20030013382
    Abstract: An abrasive ground fabric which is a composite ground fabric comprising a fiber substrate and a elastic polymer filled in the fiber substrate, wherein
    Type: Application
    Filed: July 31, 2002
    Publication date: January 16, 2003
    Inventors: Manabu Tanaka, Yoshiyuki Suzuki, Shusuke Kitawaki, Masahisa Mimura