Patents by Inventor Shuuichi Kariyazaki

Shuuichi Kariyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220139877
    Abstract: The electronic device includes a first semiconductor device having a logic circuit, a second semiconductor device having a memory circuit, and a wiring substrate to which the first and second semiconductor devices are mounted. The first semiconductor device has a plurality of terminals arranged on a main surface. The plurality of terminals includes a plurality of differential pair terminals electrically connected to the second semiconductor device and to which differential signals are transmitted. The plurality of differential pair terminals is arranged along a side of the main surface, that is extending in an X direction, and includes a first differential pair terminal constituted by a pair of terminals arranged along a Y direction orthogonal to the X direction, and a second differential pair terminal constituted by a pair of terminals arranged along the Y direction. The first and second differential pair terminals are arranged along the Y direction.
    Type: Application
    Filed: October 21, 2021
    Publication date: May 5, 2022
    Inventor: Shuuichi KARIYAZAKI
  • Patent number: 11158597
    Abstract: The electronic device includes first and second semiconductor components. And, the electronic device includes a sealing body for sealing the first semiconductor component (i.e., the logic chip). A plurality of through conductors electrically connected to the first semiconductor component and/or the second semiconductor component is formed in the sealing body. In plan view, the sealing body has a first region in which the first semiconductor component is located, a second region located on a periphery of a first surface of the sealing body, a third region located between the second region and the first region, and a fourth region located between the second region and the third region. The plurality of through conductors is arranged most in the second region. The number of the plurality of through conductors located in the third region is larger than the number of the plurality of through conductors located in the fourth region.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: October 26, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Wataru Shiroi, Shuuichi Kariyazaki
  • Patent number: 11101206
    Abstract: The lower surface of the wiring substrate includes a first region overlapping with the semiconductor chip mounted on the upper surface, and a second region surrounding the first region and not overlapping with the semiconductor chip. The first region includes a third region in which the plurality of external terminals is not arranged, and a fourth region surrounding the third region in which the plurality of external terminals is arranged. The plurality of external terminals includes a plurality of terminals arranged in the fourth region of the first region and a plurality of terminals arranged in the second region. The plurality of terminals includes a plurality of power supply terminals for supplying a power supply potential to the core circuit of the semiconductor chip, and a plurality of reference terminals for supplying a reference potential to the core circuit of the semiconductor chip.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: August 24, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Yoshitaka Okayasu, Shuuichi Kariyazaki
  • Patent number: 11049786
    Abstract: The semiconductor device includes a wiring substrate, a first and second semiconductor chips, and the heat sink. The wiring substrate has a first surface. The first and second semiconductor chips are disposed on the first surface. The heat sink is disposed on the first surface so as to cover the first semiconductor chip. The heat sink has a second surface and the third surface opposite the first surface. The second surface faces the first surface. The heat sink has a first cut-out portion. The first cut-out portion is formed at a position overlapping with the second semiconductor chip in plan view, and penetrates the heat sink in a direction from the third surface toward the second surface. The second surface is joined to at least four corners of the first surface.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: June 29, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Keita Tsuchiya, Shuuichi Kariyazaki, Takashi Kikuchi, Michiaki Sugiyama, Yusuke Tanuma
  • Patent number: 10937753
    Abstract: A semiconductor device comprising: a semiconductor chip; and a wiring substrate having: a first region overlapping with the semiconductor chip, and a second region surrounding the first region in plan view. Also, the wiring substrate includes: a first wiring layer, a third wiring layer, and a plurality of data wirings arranged so as to straddle a border between the first region and the second region. Also, the plurality of data wirings includes: a first data wiring transmitting a first byte data signal, and a second data wiring transmitting a second byte data signal. Also, in the first wiring layer, the first data wiring is arranged so as to straddle the border. Also, in the third wiring layer, the second data wiring is arranged so as to straddle the border. Further, in plan view, the first data wiring and the second data wiring are overlapped with each other.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: March 2, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Shuuichi Kariyazaki
  • Publication number: 20200294954
    Abstract: The electronic device includes first and second semiconductor components. And, the electronic device includes a sealing body for sealing the first semiconductor component (i.e., the logic chip). A plurality of through conductors electrically connected to the first semiconductor component and/or the second semiconductor component is formed in the sealing body. In plan view, the sealing body has a first region in which the first semiconductor component is located, a second region located on a periphery of a first surface of the sealing body, a third region located between the second region and the first region, and a fourth region located between the second region and the third region. The plurality of through conductors is arranged most in the second region. The number of the plurality of through conductors located in the third region is larger than the number of the plurality of through conductors located in the fourth region.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 17, 2020
    Inventors: Wataru SHIROI, Shuuichi KARIYAZAKI
  • Patent number: 10763214
    Abstract: Performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip and a chip component that are electrically connected to each other via a wiring substrate. The semiconductor chip includes an input/output circuit and an electrode pad electrically connected to the input/output circuit and transmitting the signal. The chip component includes a plurality of types of passive elements and includes an equalizer circuit for correcting signal waveforms of the signal, and electrodes electrically connected to the equalizer circuit. The path length from the signal electrode of the semiconductor chip to the electrode of the chip component is 1/16 or more and 3.5/16 or less with respect to the wavelength of the signal.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: September 1, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shuuichi Kariyazaki, Kazuyuki Nakagawa, Keita Tsuchiya, Yosuke Katsura, Shinji Katayama, Norio Chujo, Masayoshi Yagyu, Yutaka Uematsu
  • Publication number: 20200168540
    Abstract: The lower surface of the wiring substrate includes a first region overlapping with the semiconductor chip mounted on the upper surface, and a second region surrounding the first region and not overlapping with the semiconductor chip. The first region includes a third region in which the plurality of external terminals is not arranged, and a fourth region surrounding the third region in which the plurality of external terminals is arranged. The plurality of external terminals includes a plurality of terminals arranged in the fourth region of the first region and a plurality of terminals arranged in the second region. The plurality of terminals includes a plurality of power supply terminals for supplying a power supply potential to the core circuit of the semiconductor chip, and a plurality of reference terminals for supplying a reference potential to the core circuit of the semiconductor chip.
    Type: Application
    Filed: October 15, 2019
    Publication date: May 28, 2020
    Inventors: Yoshitaka OKAYASU, Shuuichi KARIYAZAKI
  • Patent number: 10643960
    Abstract: A semiconductor device includes a semiconductor chip including a first circuit and a wiring substrate over which the semiconductor chip is mounted. The wiring substrate includes input signal wires transmitting an input signal to the semiconductor chip, output signal wires transmitting an output signal from the semiconductor chip, and first conductor planes supplied with a reference potential. When a wire cross-sectional area is defined as the cross-sectional area of each wire in a direction orthogonal to a direction in which the wire extends, the wire cross-sectional area of each input signal wire is smaller than the wire cross-sectional area of each output signal wire. In the thickness direction of the wiring substrate, each input signal wire is interposed between second conductor planes and third conductor planes each supplied with the reference potential. Between the output signal wires and the input signal wires, the third conductor planes are disposed.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: May 5, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shuuichi Kariyazaki, Wataru Shiroi, Shinji Katayama, Keita Tsuchiya
  • Patent number: 10643939
    Abstract: A semiconductor device has a wiring substrate on which a semiconductor chip is mounted. A wiring layer of the wiring substrate has a wiring. This wiring has a main wiring unit extending in a direction “X” and a plurality of sub-wiring units extending in a direction “Y”, in a cross sectional view, and is supplied with a power source potential. The wiring layer has a wiring. This wiring has a main wiring unit extending in the direction “X” and a plurality of sub-wiring units extending in the direction “Y”, in a cross sectional view, and is supplied with a reference potential. The sub-wiring units and the sub-wiring units have end units and end units on a side opposed to the end units, and are alternately arranged along the direction “X” between the main wiring units. To the end units, via wirings are coupled.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: May 5, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shuuichi Kariyazaki, Keita Tsuchiya, Yoshitaka Okayasu, Wataru Shiroi
  • Publication number: 20200135607
    Abstract: The semiconductor device includes a wiring substrate, a first and second semiconductor chips, and the heat sink. The wiring substrate has a first surface. The first and second semiconductor chips are disposed on the first surface. The heat sink is disposed on the first surface so as to cover the first semiconductor chip. The heat sink has a second surface and the third surface opposite the first surface. The second surface faces the first surface. The heat sink has a first cut-out portion. The first cut-out portion is formed at a position overlapping with the second semiconductor chip in plan view, and penetrates the heat sink in a direction from the third surface toward the second surface. The second surface is joined to at least four corners of the first surface.
    Type: Application
    Filed: September 18, 2019
    Publication date: April 30, 2020
    Inventors: Keita TSUCHIYA, Shuuichi KARIYAZAKI, Takashi KIKUCHI, Michiaki SUGIYAMA, Yusuke TANUMA
  • Patent number: 10541216
    Abstract: A semiconductor device includes a semiconductor chip mounted over a wiring substrate. A signal wiring for input for transmitting input signals to the semiconductor chip and a signal wiring for output for transmitting output signals from the semiconductor chip are placed in different wiring layers in the wiring substrate and overlap with each other. In the direction of thickness of the wiring substrate, each of the signal wirings is sandwiched between conductor planes supplied with reference potential. In the front surface of the semiconductor chip, a signal electrode for input and a signal electrode for output are disposed in different rows. In cases where the signal wiring for output is located in a layer higher than the signal wiring for input in the wiring substrate, the signal electrode for output is placed in a row closer to the outer edge of the front surface than the signal electrode for input.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: January 21, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kazuyuki Nakagawa, Keita Tsuchiya, Yoshiaki Sato, Shuuichi Kariyazaki, Norio Chujo, Masayoshi Yagyu, Yutaka Uematsu
  • Patent number: 10515890
    Abstract: A semiconductor device which provides improved reliability. The semiconductor device includes: a wiring substrate having a first surface and a second surface opposite to the first surface; a chip condenser built in the wiring substrate, having a first electrode and a second electrode; a first terminal and a second terminal disposed on the first surface; and a third terminal disposed on the second surface. The semiconductor device further includes: a first conduction path for coupling the first terminal and the third terminal; a second conduction path for coupling the first terminal and the first electrode; a third conduction path for coupling the third terminal and the first electrode; and a fourth conduction path for coupling the second terminal and the first electrode.
    Type: Grant
    Filed: November 19, 2017
    Date of Patent: December 24, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Yoshiaki Sato, Shuuichi Kariyazaki, Kazuyuki Nakagawa
  • Publication number: 20190363050
    Abstract: Performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip and a chip component that are electrically connected to each other via a wiring substrate. The semiconductor chip includes an input/output circuit and an electrode pad electrically connected to the input/output circuit and transmitting the signal. The chip component includes a plurality of types of passive elements and includes an equalizer circuit for correcting signal waveforms of the signal, and electrodes electrically connected to the equalizer circuit. The path length from the signal electrode of the semiconductor chip to the electrode of the chip component is 1/16 or more and 3.5/16 or less with respect to the wavelength of the signal.
    Type: Application
    Filed: May 7, 2019
    Publication date: November 28, 2019
    Inventors: Shuuichi KARIYAZAKI, Kazuyuki NAKAGAWA, Keita TSUCHIYA, Yosuke KATSURA, Shinji KATAYAMA, Norio CHUJO, Masayoshi YAGYU, Yutaka UEMATSU
  • Patent number: 10347552
    Abstract: A semiconductor device includes first and second semiconductor components mounted on an interposer mounted on a wiring substrate, and electrically connected to each other via the interposer. Also, a plurality of wiring layers of the interposer include first, second and third wiring layers which are stacked in order from a main surface side to be a reference. In addition, in a first region of the interposer sandwiched between the first semiconductor component and the second semiconductor component, a ratio of a reference potential wiring in the third wiring layer is higher than a ratio of a reference potential wiring in the first wiring layer. Further, in the first region, a ratio of a signal wiring in the first wiring layer is higher than a ratio of a signal wiring in the third wiring layer.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: July 9, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Ryuichi Oikawa, Toshihiko Ochiai, Shuuichi Kariyazaki, Yuji Kayashima, Tsuyoshi Kida
  • Publication number: 20190198463
    Abstract: A semiconductor device includes a semiconductor chip including a first circuit and a wiring substrate over which the semiconductor chip is mounted. The wiring substrate includes input signal wires transmitting an input signal to the semiconductor chip, output signal wires transmitting an output signal from the semiconductor chip, and first conductor planes supplied with a reference potential. When a wire cross-sectional area is defined as the cross-sectional area of each wire in a direction orthogonal to a direction in which the wire extends, the wire cross-sectional area of each input signal wire is smaller than the wire cross-sectional area of each output signal wire. In the thickness direction of the wiring substrate, each input signal wire is interposed between second conductor planes and third conductor planes each supplied with the reference potential. Between the output signal wires and the input signal wires, the third conductor planes are disposed.
    Type: Application
    Filed: November 15, 2018
    Publication date: June 27, 2019
    Inventors: Shuuichi KARIYAZAKI, Wataru SHIROI, Shinji KATAYAMA, Keita TSUCHIYA
  • Publication number: 20190198462
    Abstract: A semiconductor device includes a semiconductor chip mounted over a wiring substrate. A signal wiring for input for transmitting input signals to the semiconductor chip and a signal wiring for output for transmitting output signals from the semiconductor chip are placed in different wiring layers in the wiring substrate and overlap with each other. In the direction of thickness of the wiring substrate, each of the signal wirings is sandwiched between conductor planes supplied with reference potential. In the front surface of the semiconductor chip, a signal electrode for input and a signal electrode for output are disposed in different rows. In cases where the signal wiring for output is located in a layer higher than the signal wiring for input in the wiring substrate, the signal electrode for output is placed in a row closer to the outer edge of the front surface than the signal electrode for input.
    Type: Application
    Filed: October 30, 2018
    Publication date: June 27, 2019
    Inventors: Kazuyuki NAKAGAWA, Keita TSUCHIYA, Yoshiaki SATO, Shuuichi KARIYAZAKI, Norio CHUJO, Masayoshi YAGYU, Yutaka UEMATSU
  • Patent number: 10325841
    Abstract: According to an embodiment of the present invention, there is provided a semiconductor device having a first semiconductor component and a second semiconductor component which are mounted on a wiring substrate. The first semiconductor component has a first terminal for transmitting a first signal between the first semiconductor component and the outside and a second terminal for transmitting a second signal between the first semiconductor component and the second semiconductor component. In addition, the second semiconductor component has a third terminal for transmitting the second signal between the second semiconductor component and the first semiconductor component. Further, the first signal is transmitted at a higher frequency than the second signal. Furthermore, the second terminal of the first semiconductor component and the third terminal of the second semiconductor component are electrically connected to each other via the first wiring member.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: June 18, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kazuyuki Nakagawa, Katsushi Terajima, Keita Tsuchiya, Yoshiaki Sato, Hiroyuki Uchida, Yuji Kayashima, Shuuichi Kariyazaki, Shinji Baba
  • Publication number: 20190115295
    Abstract: A semiconductor device has a wiring substrate on which a semiconductor chip is mounted. A wiring layer of the wiring substrate has a wiring. This wiring has a main wiring unit extending in a direction “X” and a plurality of sub-wiring units extending in a direction “Y”, in a cross sectional view, and is supplied with a power source potential. The wiring layer has a wiring. This wiring has a main wiring unit extending in the direction “X” and a plurality of sub-wiring units extending in the direction “Y”, in a cross sectional view, and is supplied with a reference potential. The sub-wiring units and the sub-wiring units have end units and end units on a side opposed to the end units, and are alternately arranged along the direction “X” between the main wiring units. To the end units, via wirings are coupled.
    Type: Application
    Filed: August 7, 2018
    Publication date: April 18, 2019
    Inventors: Shuuichi KARIYAZAKI, Keita TSUCHIYA, Yoshitaka OKAYASU, Wataru SHIROI
  • Publication number: 20180374788
    Abstract: According to an embodiment of the present invention, there is provided a semiconductor device having a first semiconductor component and a second semiconductor component which are mounted on a wiring substrate. The first semiconductor component has a first terminal for transmitting a first signal between the first semiconductor component and the outside and a second terminal for transmitting a second signal between the first semiconductor component and the second semiconductor component. In addition, the second semiconductor component has a third terminal for transmitting the second signal between the second semiconductor component and the first semiconductor component. Further, the first signal is transmitted at a higher frequency than the second signal. Furthermore, the second terminal of the first semiconductor component and the third terminal of the second semiconductor component are electrically connected to each other via the first wiring member.
    Type: Application
    Filed: February 10, 2016
    Publication date: December 27, 2018
    Inventors: Kazuyuki NAKAGAWA, Katsushi TERAJIMA, Keita TSUCHIYA, Yoshiaki SATO, Hiroyuki UCHIDA, Yuji KAYASHIMA, Shuuichi KARIYAZAKI, Shinji BABA