Patents by Inventor Shyh-Ming Chang
Shyh-Ming Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8215969Abstract: A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.Type: GrantFiled: June 24, 2008Date of Patent: July 10, 2012Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Displays Corp.Inventors: Sheng-Shu Yang, Shyh-Ming Chang
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Patent number: 8211788Abstract: A method of fabricating a bonding structure having compliant bumps includes first providing a first substrate and a second substrate. The first substrate includes first bonding pads. The second substrate is disposed on one side of the first substrate and includes second bonding pads and compliant bumps disposed thereon. The second bonding pads are opposite to the first bonding pads. Next, a non-conductive adhesive layer and ball-shaped spacers are formed between the first and the second substrates. Finally, the first substrate, the non-conductive adhesive layer, and the second substrate are compressed, such that the compliant bumps on the second bonding pads of the second substrate pass through the non-conductive adhesive layer and are electrically connected to the first bonding pads of the first substrate, respectively. The ball-shaped spacers are distributed in the non-conductive adhesive layer sandwiched between the first and the second substrates for maintaining the gap therebetween.Type: GrantFiled: June 18, 2009Date of Patent: July 3, 2012Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research, TPO Displays Corp.Inventors: Shyh-Ming Chang, Sheng-Shu Yang
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Publication number: 20110230044Abstract: A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.Type: ApplicationFiled: June 1, 2011Publication date: September 22, 2011Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORP., QUANTA DISPLAY INC., HANNSTAR DISPLAY CORP., CHI MEI OPTOELECTRONICS CORP., INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TOPOLY OPTOELECTRONICS CORP.Inventors: Shyh-Ming Chang, Sheng-Shu Yang, Chao-Chyun An
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Patent number: 7988808Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.Type: GrantFiled: August 19, 2008Date of Patent: August 2, 2011Assignee: Industrial Technology Research InstituteInventors: Su-Tsai Lu, Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang
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Patent number: 7977788Abstract: A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.Type: GrantFiled: November 24, 2006Date of Patent: July 12, 2011Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corp., Quanta Display Inc., Hannstar Display Corp., Chi Mei Optoelectronics Corp., Industrial Technology Research Institute, Toppoly Optoelectronics Corp.Inventors: Shyh-Ming Chang, Sheng-Shu Yang, Chao-Chyun An
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Patent number: 7871918Abstract: A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.Type: GrantFiled: February 10, 2009Date of Patent: January 18, 2011Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Dispalys Corp.Inventor: Shyh-Ming Chang
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Patent number: 7834453Abstract: A contact structure including a contact pad, a polymer bump and a conductive layer is provided in the present invention. The contact pad is disposed on a substrate. The polymer bump is disposed on the contact pad. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad. The invention further discloses a manufacturing method of a contact structure. First, a substrate is provided having a contact pad already formed thereon. Then, a polymer bump is formed on the contact pad and a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.Type: GrantFiled: June 13, 2007Date of Patent: November 16, 2010Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Displays Corp.Inventor: Shyh-Ming Chang
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Patent number: 7732928Abstract: A structure for protecting electronic package contacts is provided. The structure includes at least an electronic contact mounted on a chip, a dielectric layer, a conductor trace line and a protective layer. The protective layer is used to prevent stresses from being gathered within electronic contacts on the chip through surroundingly covering the conductor trace line.Type: GrantFiled: September 6, 2006Date of Patent: June 8, 2010Assignee: Instrument Technology Research CenterInventors: Shyh-Ming Chang, Ji-Cheng Lin, Shou-Lung Chen
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Publication number: 20090253233Abstract: A method of fabricating a bonding structure having compliant bumps includes first providing a first substrate and a second substrate. The first substrate includes first bonding pads. The second substrate is disposed on one side of the first substrate and includes second bonding pads and compliant bumps disposed thereon. The second bonding pads are opposite to the first bonding pads. Next, a non-conductive adhesive layer and ball-shaped spacers are formed between the first and the second substrates. Finally, the first substrate, the non-conductive adhesive layer, and the second substrate are compressed, such that the compliant bumps on the second bonding pads of the second substrate pass through the non-conductive adhesive layer and are electrically connected to the first bonding pads of the first substrate, respectively. The ball-shaped spacers are distributed in the non-conductive adhesive layer sandwiched between the first and the second substrates for maintaining the gap therebetween.Type: ApplicationFiled: June 18, 2009Publication date: October 8, 2009Applicants: Taiwan TFT LCD Association, Chunghwa Picture Tubes, LTD., AU Optronics Corporation, Hannstar Display Corporation, CHI Mei Optoelectronics Corporation, Iindustrial Technology Research Institute, TPO Display Corp.Inventors: Shyh-Ming Chang, Sheng-Shu Yang
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Publication number: 20090243093Abstract: A contact structure disposed on a substrate is provided. The contact structure includes at least one pad, at least one polymer bump and at least one conductive layer. The pad is disposed on the substrate and the polymer bump is disposed on the substrate. The polymer bump has a curved surface having a plurality of concave-convex structures. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.Type: ApplicationFiled: February 5, 2009Publication date: October 1, 2009Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventor: Shyh-Ming Chang
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Publication number: 20090246988Abstract: A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.Type: ApplicationFiled: June 24, 2008Publication date: October 1, 2009Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TPO DISPLAYS CORP.Inventors: Sheng-Shu Yang, Shyh-Ming Chang
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Patent number: 7576430Abstract: A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.Type: GrantFiled: January 31, 2007Date of Patent: August 18, 2009Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Dispalys Corp.Inventors: Shyh-Ming Chang, Sheng-Shu Yang
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Publication number: 20090149015Abstract: A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.Type: ApplicationFiled: February 10, 2009Publication date: June 11, 2009Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TPO DISPLAYS CORP.Inventor: Shyh-Ming Chang
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Patent number: 7531900Abstract: A package structure with embedded electronic devices is provided. The package structure includes a substrate, a multi-layered circuit board, an adhesive film and at least an electronic device. The electronic device is disposed on the substrate. The electronic device is press-adhered to the multi-layered circuit board through the adhesive film and the composite bump thereon, so that the electronic device is embedded within the package structure and between the substrate and the circuit board. Due to the deformity of the composite bump, the electronic device is protected from being cracking in the pressing process.Type: GrantFiled: October 31, 2006Date of Patent: May 12, 2009Assignee: Industrial Technology Research InstituteInventors: Ji-Cheng Lin, Shyh-Ming Chang
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Publication number: 20080305624Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.Type: ApplicationFiled: August 19, 2008Publication date: December 11, 2008Inventors: Su-Tsai Lu, Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang
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Patent number: 7459055Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.Type: GrantFiled: October 16, 2006Date of Patent: December 2, 2008Assignee: Industrial Technology Research InstituteInventors: Su-Tsai Lu, Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang
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Publication number: 20080284011Abstract: A bump structure including at least one contact pad, at least one first polymer bump, at least one second polymer bump, and a conductive layer is provided. The contact pad is disposed on a substrate, and the first polymer bump is also disposed on the substrate. The second polymer bump is disposed on the substrate and is connected to the first polymer bump. The conductive layer covers the first polymer bump and electrically connects the contact pad.Type: ApplicationFiled: August 7, 2007Publication date: November 20, 2008Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TPO DISPLAYS CORP.Inventors: Shyh-Ming Chang, Ngai Tsang, Kuo-Shu Kao
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Patent number: 7449716Abstract: A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.Type: GrantFiled: June 5, 2007Date of Patent: November 11, 2008Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, LTD., Au Optronics Corporation, Hannstar Display Corporation, Chi Mei Optoelectronics Corporation, Industrial Technology Research Institute, TPO Displays Corp.Inventors: Ming-Yao Chen, Sheng-Shu Yang, Shyh-Ming Chang, Ngai Tsang
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Patent number: 7446421Abstract: A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.Type: GrantFiled: January 4, 2007Date of Patent: November 4, 2008Assignee: Industrial Technology Research InstituteInventors: Su-Tsai Lu, Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang
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Publication number: 20080237850Abstract: A compliant bump structure includes a substrate, at least a first polymer bump, at least a second polymer bump and at least a conductive layer. The substrate has at least a pad on a surface thereof. The first polymer bump is disposed on the pad. The second polymer bump is disposed on the surface of the substrate outside the pad. The conductive layer is disposed on the first and second polymer bumps.Type: ApplicationFiled: October 8, 2007Publication date: October 2, 2008Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventor: Shyh-Ming Chang