Patents by Inventor Shyun-ichi Fukuyama

Shyun-ichi Fukuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Material and method for planarization of substrate
    Patent number: 5976703
    Abstract: A material and a method for planarizing an uneven surface of a substrate, such as those used for making wiring boards and electronic devices and having broad patterns on their surfaces, are provided. The material is a polysilphenylenesiloxane or a copolymer of polysilphenylenesiloxane with an organosiloxane, and is applied to an uneven surface of a substrate, and then heated to be reflowed to thereby be formed into a planarized film or layer. The material allows a substrate containing wiring having a width of up to several hundred micrometers to be planarized.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: November 2, 1999
    Assignee: Fujitsu Limited
    Inventors: Yoshihiro Nakata, Shyun-ichi Fukuyama, Michiko Katayama, Joe Yamaguchi, Hideki Harada, Yoshiyuki Ohkura