Patents by Inventor Siddhartha Bhowmik
Siddhartha Bhowmik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11298555Abstract: A feedthrough connector contains an electrically insulating body formed from glass. The body has a front side and a back side facing away from the front side. The body further has a circumferential lateral side extending from the front side to the back side of the body. The body has a plurality of through-openings, wherein each through-opening extends from the front side to the back side of the body. A plurality of electrical conductors is provided and, each conductor is arranged in one of the through-openings to hermetically seal the respective through-opening. The respective conductor contains a metallic material. A first end of the conductor is arranged at the front side and is connected to a first contact pad arranged on the front side, and an opposing second end is arranged at the back side and is connected to a second contact pad arranged on the back side.Type: GrantFiled: July 17, 2019Date of Patent: April 12, 2022Assignee: BIOTRONIK SE & Co. KGInventor: Siddhartha Bhowmik
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Patent number: 11211200Abstract: A coil is produced by winding a wire that is clad with an electrical insulation so as to form a coil bundle of successive windings. The coil bundle has at least one first winding formed by a first end section of the wire and at least one second winding formed by a second end section of the wire. A portion of the electrical insulation of the at least one first winding is removed to expose a portion of the first end section of the wire for forming a first electrical contact of the coil, and a portion of the electrical insulation of the at least one second winding is removed to expose a portion of the second end section of the wire for forming said second electrical contact of the coil. There is also described a coil.Type: GrantFiled: August 14, 2018Date of Patent: December 28, 2021Assignee: BIOTRONIK Se & Co. KGInventors: Siddhartha Bhowmik, Frederik Sporon-Fiedler, Daniel Witherspoon
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Publication number: 20200023187Abstract: A feedthrough connector contains an electrically insulating body formed from glass. The body has a front side and a back side facing away from the front side. The body further has a circumferential lateral side extending from the front side to the back side of the body. The body has a plurality of through-openings, wherein each through-opening extends from the front side to the back side of the body. A plurality of electrical conductors is provided and, each conductor is arranged in one of the through-openings to hermetically seal the respective through-opening. The respective conductor contains a metallic material. A first end of the conductor is arranged at the front side and is connected to a first contact pad arranged on the front side, and an opposing second end is arranged at the back side and is connected to a second contact pad arranged on the back side.Type: ApplicationFiled: July 17, 2019Publication date: January 23, 2020Inventor: SIDDHARTHA BHOWMIK
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Publication number: 20190057812Abstract: A coil is produced by winding a wire that is clad with an electrical insulation so as to form a coil bundle of successive windings. The coil bundle has at least one first winding formed by a first end section of the wire and at least one second winding formed by a second end section of the wire. A portion of the electrical insulation of the at least one first winding is removed to expose a portion of the first end section of the wire for forming a first electrical contact of the coil, and a portion of the electrical insulation of the at least one second winding is removed to expose a portion of the second end section of the wire for forming said second electrical contact of the coil. There is also described a coil.Type: ApplicationFiled: August 14, 2018Publication date: February 21, 2019Inventors: SIDDHARTHA BHOWMIK, FREDERIK SPORON-FIEDLER, DANIEL WITHERSPOON
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Publication number: 20160197056Abstract: The present invention refers to a die (1) with an improved crack detecting structure for a predefined area of the die comprising an electrical conductive path (5,6) laid along a perimeter of the predefined area and a first bond pad (17a) at the first end of the path (5, 6) and a second bond pad (17b) at the second end of the path (5, 6), wherein the electrical conductive path (5,6) contains at least one first path section (12) disposed at the front side of the die (1) and at least one second path section (13) disposed at the back side of the die (1), wherein the at least one first path section (12) and the at least one second path section (13) are coupled by at least one through connection (14). Further, the invention refers to a respective system on package and methods for manufacturing a respective die or a respective system on package.Type: ApplicationFiled: July 24, 2014Publication date: July 7, 2016Inventors: Siddhartha Bhowmik, Frederik Sporon-Fiedler
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Patent number: 8888252Abstract: A print head die (30) includes slot ribs (41) having edges (62, 64) with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side (50) of a wafer (30) a series of spaced openings (220) completely through the wafer (30) and separated by ribs (41) followed by wet etching the wafer (30) from a second opposite side (44) to recess the ribs (41) from the second side (44).Type: GrantFiled: July 9, 2008Date of Patent: November 18, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Siddhartha Bhowmik, Swaroop K. Kommera, Manish Giri, Robert N. K. Browning, Charles Gustav Schmidt
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Patent number: 8714710Abstract: Thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel for receiving fluid from the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to a fluid feed channel wall, and a cantilever extending over the fluid feed channel wall, having a staggered edge that follows the staggered pattern of the resistors.Type: GrantFiled: April 9, 2010Date of Patent: May 6, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Rio Rivas, Siddhartha Bhowmik, Ed Friesen
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Patent number: 8585180Abstract: A method of method of making a corrosion resistant print head die comprises creating a self-ionized plasma (SIP) of a coating material; establishing a bias on a print head die comprising a plurality of feed slots (40), each feed slot (40) comprising side wall surfaces (61); and causing the coating material plasma to be deposited on the surfaces to form a protective coating, wherein at least a portion of the coating material is deposited on at least a portion of the surfaces by resputtering. In some cases, the feed slots have an aspect ratio greater than 2. In some cases, the feed slot comprises at least one rib (41), each rib (41) comprising a top surface (68), two side surfaces (66), and an under surface (69), and the formed protective coating is deposited on the top surface (68), two side surfaces (66), and under surface (69) of each rib (41).Type: GrantFiled: October 28, 2009Date of Patent: November 19, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Siddhartha Bhowmik, Rio Rivas, Gerald R. Wonnacott
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Patent number: 8573740Abstract: Manufacturing method for an inkjet print head, comprising forming a nozzle layer onto a substrate, depositing an LSE (low surface energy) coating onto the nozzle layer, depositing a sacrificial film onto the LSE coating, post processing the substrate, and removing the sacrificial film from the LSE coating, the LSE coating having a water contact angle of at least 50° after removal of the sacrificial film.Type: GrantFiled: April 9, 2010Date of Patent: November 5, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Rio Rivas, Robert Messenger, Becky Clark, Rob Pugliese, Siddhartha Bhowmik
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Publication number: 20130256260Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side of the substrate toward a first side of the substrate, further forming the opening in the substrate to the first side of the substrate, anisotropically wet etching the substrate, including increasing the opening at the second side of the substrate and forming the opening with converging sidewalls from the second side to the first side, and after anisotropically wet etching the substrate, isotropically etching the substrate.Type: ApplicationFiled: October 19, 2010Publication date: October 3, 2013Inventors: Siddhartha Bhowmik, J. Daniel Smith
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Publication number: 20130033548Abstract: Thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel for receiving fluid from the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to a fluid feed channel wall, and a cantilever extending over the fluid feed channel wall, having a staggered edge that follows the staggered pattern of the resistors.Type: ApplicationFiled: April 9, 2010Publication date: February 7, 2013Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Rio Rivas, Siddhartha Bhowmik, Ed Friesen
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Publication number: 20130027471Abstract: Manufacturing method for an inkjet print head, comprising forming a nozzle layer onto a substrate, depositing an LSE (low surface energy) coating onto the nozzle layer, depositing a sacrificial film onto the LSE coating, post processing the substrate, and removing the sacrificial film from the LSE coating, the LSE coating having a water contact angle of at least 50° after removal of the sacrificial film.Type: ApplicationFiled: April 9, 2010Publication date: January 31, 2013Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Rio Rivas, Robert Messenger, Becky Clark, Rob Pugliese, Siddhartha Bhowmik
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Patent number: 8333459Abstract: A printing device (10) including a substrate (22) having an aperture (20) extending therethrough, wherein the aperture includes a side wall and defines a liquid ink flow path, an ink firing chamber (24) fluidically connected to the aperture, and a coating positioned on the side wall of the aperture, the coating being impervious to etching by liquid ink, and wherein the coating is chosen from one of silicon dioxide, aluminum oxide, hafnium oxide and silicon nitride.Type: GrantFiled: April 29, 2008Date of Patent: December 18, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Rio Rivas, Jon A. Crabtree, Eric L. Nikkel, Siddhartha Bhowmik, Bradley D. Chung, Samson Berhane
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Patent number: 8262204Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.Type: GrantFiled: October 15, 2007Date of Patent: September 11, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
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Patent number: 8240828Abstract: A fluid ejection cartridge includes a body, having fluid passageways at a first spacing, a die, having fluid passage-ways at a second closer spacing, and an interposer, bonded to the body at a first surface and plasma bonded to the die at a second surface. The interposer includes fluid passageways between the first and second surfaces, which are substantially aligned with the respective passageways of the body and the die.Type: GrantFiled: January 9, 2008Date of Patent: August 14, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alok Sharan, Manishi Giri, Siddhartha Bhowmik, Richard W Seaver
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Publication number: 20120139997Abstract: A method of method of making a corrosion resistant print head die comprises creating a self-ionized plasma (SIP) of a coating material; establishing a bias on a print head die comprising a plurality of feed slots (40), each feed slot (40) comprising side wall surfaces (61); and causing the coating material plasma to be deposited on the surfaces to form a protective coating, wherein at least a portion of the coating material is deposited on at least a portion of the surfaces by resputtering. In some cases, the feed slots have an aspect ratio greater than 2. In some cases, the feed slot comprises at least one rib (41), each rib (41) comprising a top surface (68), two side surfaces (66), and an under surface (69), and the formed protective coating is deposited on the top surface (68), two side surfaces (66), and under surface (69) of each rib (41).Type: ApplicationFiled: October 28, 2009Publication date: June 7, 2012Inventors: Siddhartha Bhowmik, Rio Rivas, Gerald R. Wonnacott
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Publication number: 20110069120Abstract: A print head die (30) includes slot ribs (41) having edges (62, 64) with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side (50) of a wafer (30) a series of spaced openings (220) completely through the wafer (30) and separated by ribs (41) followed by wet etching the wafer (30) from a second opposite side (44) to recess the ribs (41) from the second side (44).Type: ApplicationFiled: July 9, 2008Publication date: March 24, 2011Inventors: Siddhartha Bhowmik, Swaroop K. Kommera, Manish Giri, Robert N.K. Browning, Charles Gustav Schmidt
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Publication number: 20110018938Abstract: A printing device (10) including a substrate (22) having an aperture (20) extending therethrough, wherein the aperture includes a side wall and defines a liquid ink flow path, an ink firing chamber (24) fluidically connected to the aperture, and a coating positioned on the side wall of the aperture, the coating being impervious to etching by liquid ink, and wherein the coating is chosen from one of silicon dioxide, aluminum oxide, hafnium oxide and silicon nitride.Type: ApplicationFiled: April 29, 2008Publication date: January 27, 2011Inventors: Rio Rivas, Jon A. Crabtree, Eric L. Nikkel, Siddhartha Bhowmik, Bradley D. Chung, Samson Berhane
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Patent number: 7855151Abstract: A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (12). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.Type: GrantFiled: August 21, 2007Date of Patent: December 21, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Swaroop K. Kommera, Siddhartha Bhowmik, Richard J. Oram, Sriram Ramamoorthi, David M. Braun
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Publication number: 20100271445Abstract: A fluid ejection cartridge includes a body, having fluid passageways at a first spacing, a die, having fluid passage-ways at a second closer spacing, and an interposer, bonded to the body at a first surface and plasma bonded to the die at a second surface. The interposer includes fluid passageways between the first and second surfaces, which are substantially aligned with the respective passageways of the body and the die.Type: ApplicationFiled: January 9, 2008Publication date: October 28, 2010Inventors: Alok Sharan, Manishi Giri, Siddhartha Bhowmik, Richard W. Seaver