Abstract: A detector for detecting an occurrence of a current strength of interest (e.g. zero current) of a current of a signal to be sensed includes a magnetoresistive structure and a detection unit. The magnetoresistive structure varies a resistance depending on a magnetic field caused by the current of the signal to be sensed. Further, the detection unit generates and provides a current detection signal indicating an occurrence of the current strength of interest based on a detected magnitude of the varying resistance of the magnetoresistive structure.

Abstract: A detector for detecting an occurrence of a current strength of interest (e.g. zero current) of a current of a signal to be sensed includes a magnetoresistive structure and a detection unit. The magnetoresistive structure varies a resistance depending on a magnetic field caused by the current of the signal to be sensed. Further, the detection unit generates and provides a current detection signal indicating an occurrence of the current strength of interest based on a detected magnitude of the varying resistance of the magnetoresistive structure.

Abstract: A detector for detecting an occurrence of a current strength of interest of a current of a signal to be sensed includes a magnetoresistive structure and a detection unit. The magnetoresistive structure varies a resistance depending on a magnetic field caused by the current of the signal to be sensed. Further, the detection unit generates and provides a current detection signal indicating an occurrence of the current strength of interest based on a detected magnitude of the varying resistance of the magnetoresistive structure.

Abstract: Embodiments relate to integrated circuits, systems and methods for combined sensing and heating functions in structures suitable for use in deicing, heating and other applications. In an embodiment, an integrated circuit is coupled to a heating element and configured to control operation of the heating element to provide heat as well as to utilize the heating element as at least part of a sensing structure to sense the presence of ice, water or air on or near the heating element. In embodiments, the heating element comprises a conductive polymer structure, and the presence of ice, water or air is sensed based on a capacitance, impedance or other spectroscopy of the structure sensed and analyzed by integrated circuitry coupled to the structure.

Abstract: In one example, a temperature regulating system, the system comprising temperature regulating device including a hot side and a cold side; and an icing sensor disposed on the cold side and which provides an output which changes based on a condition of the cold side; wherein the system is configured to detect, via the output of the icing sensor, icing of the cold side during a temperature regulating operation, and initiate deicing of the cold side based on the detection of the icing of the cold side.

Abstract: A detector for detecting an occurrence of a current strength of interest of a current of a signal to be sensed includes a magnetoresistive structure and a detection unit. The magnetoresistive structure varies a resistance depending on a magnetic field caused by the current of the signal to be sensed. Further, the detection unit generates and provides a current detection signal indicating an occurrence of the current strength of interest based on a detected magnitude of the varying resistance of the magnetoresistive structure.

Abstract: Embodiments relate to integrated circuits, systems and methods for combined sensing and heating functions in structures suitable for use in deicing, heating and other applications. In an embodiment, an integrated circuit is coupled to a heating element and configured to control operation of the heating element to provide heat as well as to utilize the heating element as at least part of a sensing structure to sense the presence of ice, water or air on or near the heating element. In embodiments, the heating element comprises a conductive polymer structure, and the presence of ice, water or air is sensed based on a capacitance, impedance or other spectroscopy of the structure sensed and analyzed by integrated circuitry coupled to the structure.

Abstract: This application relates to a semiconductor sensor comprising a carrier that comprises a first surface and a second surface; a sensor chip attached to the first surface; attachment means on the second surface; and mould material applied over the sensor chip and the attachment means.