Patents by Inventor Siew Lian Tay

Siew Lian Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Secure erasure of a drive array using drive-defined, trusted computing group bands
    Patent number: 11449265
    Abstract: Partitions of drives are used to form a volume of a drive array. Each partition is associated with a trusted computing group (TCG) band. Each drive encrypts data stored on the partition with a key unique to the TCG band. The volume is formed using the partitions of the drives. In response to a band-based erasure being invoked on the volume, each drive of the plurality of drives overwrites the key of the TCG band associated with the partition and provides an erasure certificate attesting to the overwriting of the key. The erasure certifications from the drives are compiled into a consolidated erasure certification that attests to the erasure of the volume.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: September 20, 2022
    Assignee: Seagate Technology LLC
    Inventors: Varun Reddy Boddu, Siew Lian Tay
  • SECURE ERASURE OF A DRIVE ARRAY USING DRIVE-DEFINED, TRUSTED COMPUTING GROUP BANDS
    Publication number: 20220137850
    Abstract: Partitions of drives are used to form a volume of a drive array. Each partition is associated with a trusted computing group (TCG) band. Each drive encrypts data stored on the partition with a key unique to the TCG band. The volume is formed using the partitions of the drives. In response to a band-based erasure being invoked on the volume, each drive of the plurality of drives overwrites the key of the TCG band associated with the partition and provides an erasure certificate attesting to the overwriting of the key. The erasure certifications from the drives are compiled into a consolidated erasure certification that attests to the erasure of the volume.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Inventors: Varun Reddy Boddu, Siew Lian Tay