Patents by Inventor Sina Bigdeli

Sina Bigdeli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230208079
    Abstract: Cowlings described herein for board-to-board connectors can provide high stiffness, low weight, and low total cost. Such cowlings can provide ribs with increased thickness for targeted stiffness to resist bowing in a given direction. The layers of the cowlings can include carbon fiber extending in directions parallel to the ribs in some layers and transverse to the ribs in other layers. The layers can be formed together within a mold tool that shapes the fibers into the ribs.
    Type: Application
    Filed: November 22, 2022
    Publication date: June 29, 2023
    Inventors: Noell G. JOHNSON, David R. CRAMER, Sina BIGDELI, Edward S. HUO, Jeremy C. FRANKLIN, Jason C. SAUERS
  • Patent number: 10616387
    Abstract: Electronic devices, such as mobile communication devices, may include several enhancements and modification not found on traditional electronic devices. An electronic device can include a circuit board assembly that includes stacked layers of circuit components that are retained in a stacked configuration and operably connected to each other by retention features such as solder joints. Features can be provided for structural support and thermal mitigation. A battery assembly can accommodate nesting of other components, such as display components, within one or more recesses defined by variable thickness along different regions of the battery assemblies. The battery assembly can further provide a slim profile by including notches to accommodate the increased thickness of a pouch having folded flaps to seal a cell module of the battery assembly.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: April 7, 2020
    Assignee: APPLE INC.
    Inventors: Bryan D. Keen, Sina Bigdeli, Sawyer I. Cohen, William A. Counts, Lucy E. Browning, Devon A. Monaco, Jian Yang, Eric W. Bates
  • Publication number: 20200084310
    Abstract: Electronic devices, such as mobile communication devices, may include several enhancements and modification not found on traditional electronic devices. An electronic device can include a circuit board assembly that includes stacked layers of circuit components that are retained in a stacked configuration and operably connected to each other by retention features such as solder joints. Features can be provided for structural support and thermal mitigation. A battery assembly can accommodate nesting of other components, such as display components, within one or more recesses defined by variable thickness along different regions of the battery assemblies. The battery assembly can further provide a slim profile by including notches to accommodate the increased thickness of a pouch having folded flaps to seal a cell module of the battery assembly.
    Type: Application
    Filed: March 8, 2019
    Publication date: March 12, 2020
    Inventors: Bryan D. Keen, Sina Bigdeli, Sawyer I. Cohen, William A. Counts, Lucy E. Browning, Devon A. Monaco, Jian Yang, Eric W. Bates
  • Patent number: 10349565
    Abstract: An electronic assembly having a printed circuit board (PCB) formed of a substrate of electrically isolating material that electrically isolates conductive traces carried therein and an electrical contact electrically coupled to an electrical trace and including, an electrical component that uses a high current/low loss signal, the electrical component being mounted at the substrate and electrically coupled to the electrical contact, a flex assembly having a housing formed of electrically isolating material, the housing carrying lines in a stacked arrangement each of which is capable of providing a high current/low loss path for carrying the high current/low loss signal, the flex assembly having a terminal having contacts arranged in a low-noise pattern where a contact is electrically connected to a corresponding transmission line and capable of forming an electrical connection between the transmission line and at least one electrical trace.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: July 9, 2019
    Assignee: Apple Inc.
    Inventors: Kurtis J. Mundell, Sina Bigdeli
  • Patent number: 10225964
    Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: March 5, 2019
    Assignee: Apple Inc.
    Inventors: James B. Smith, Daniel W. Jarvis, David A. Pakula, Gregory N. Stephens, Nicholas G. L. Merz, Shayan Malek, Sina Bigdeli
  • Publication number: 20180070484
    Abstract: An electronic assembly having a printed circuit board (PCB) formed of a substrate of electrically isolating material that electrically isolates conductive traces carried therein and an electrical contact electrically coupled to an electrical trace and including, an electrical component that uses a high current/low loss signal, the electrical component being mounted at the substrate and electrically coupled to the electrical contact, a flex assembly having a housing formed of electrically isolating material, the housing carrying lines in a stacked arrangement each of which is capable of providing a high current/low loss path for carrying the high current/low loss signal, the flex assembly having a terminal having contacts arranged in a low-noise pattern where a contact is electrically connected to a corresponding transmission line and capable of forming an electrical connection between the transmission line and at least one electrical trace.
    Type: Application
    Filed: February 2, 2017
    Publication date: March 8, 2018
    Inventors: Kurtis J. MUNDELL, Sina BIGDELI
  • Publication number: 20170290207
    Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.
    Type: Application
    Filed: August 29, 2016
    Publication date: October 5, 2017
    Inventors: James B. Smith, Daniel W. Jarvis, David A. Pakula, Gregory N. Stephens, Nicholas G. L. Merz, Shayan Malek, Sina Bigdeli
  • Patent number: D830964
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: October 16, 2018
    Assignee: Apple Inc.
    Inventors: Shota Aoyagi, Jeremy Bataillou, Sina Bigdeli, Richard Hung Minh Dinh, Richard P. Howarth, Kurtis James Mundell, Scott A. Myers, Benjamin J. Pope, Clement Tissandier
  • Patent number: D906234
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: December 29, 2020
    Assignee: Apple Inc.
    Inventors: Sina Bigdeli, Lucy E. Browning, Richard Hung Minh Dinh, Shayan Malek, Aaron H. Squier