Abstract: Examples disclosed herein provide methods and systems for the authentication of a print request. As an example, an email service associated with an enterprise network may receive an electronic message having a destination address indicative of a request to print data included in the message, wherein the destination address may have a domain name associated with the enterprise network. The email service may access an authentication service associated with the enterprise network to determine whether a sender address of the electronic message is a valid address to submit print jobs. Upon determining the sender address is a valid address, the email service may forward the electronic message to a cloud print service to prepare the print job comprising the data included in the message for printing.

Abstract: Examples disclosed herein provide methods and systems for the authentication of a print request. As an example, an email service associated with an enterprise network may receive an electronic message having a destination address indicative of a request to print data included in the message, wherein the destination address may have a domain name associated with the enterprise network. The email service may access an authentication service associated with the enterprise network to determine whether a sender address of the electronic message is a valid address to submit print jobs. Upon determining the sender address is a valid address, the email service may forward the electronic message to a cloud print service to prepare the print job comprising the data included in the message for printing.

Abstract: A tamper resistant security sealing tape comprising four or more layers and the method of manufacturing the same. The said tape once stuck properly can not be removed and flakes in bits and pieces. The tape has a fragile base substrate which is a cast polymeric film, a layer of pressure sensitive adhesive on one side of the base substrate, a polymeric film strip which is partially laminated on the other side of the base substrate using pressure sensitive adhesive, a release liner protecting the base substrate adhesive, and optionally an indicia or logo printed on the said polymeric strip. The base substrate is of very low breaking strength and pressure sensitive adhesive is of very high tack and peel strength even on low energy surfaces and at low temperatures. The tape softens and melts at high temperatures and dissolves and gives tacky solution when in contact with solvents.

Abstract: Contact metallurgy is disclosed for passivated semiconductor devices. The metallurgy comprises a compressively stressed, oxygen-containing titanium underlayer covered by a solder-bondable layer extending through via holes in dielectric material on the semiconductor device. The solder bondable layer is either nickel or ruthenium, where lower current densities are encountered or a composite of layers of copper, titanium, copper and gold for higher current densities.

Abstract: The top surface metallurgy of LSI chip carriers is improved by multiple and phased interface of metal layers which enable such metallurgies to be suitable for joining by solder reflow and wire bonding techniques. The modifications result in separating the solder bonding metallurgy from the fan-out conductor metallurgy with an intermediate layer of a metal such as Cr or Ti which prevents the formation of intermetallic alloys which are mechanically weak or brittle and tend to fracture because of thermal fatigue stresses caused by thermal cycling during either multiple (up to 50) solder bonding reflow operations or operation of the circuit. The fan-out metallurgy conductors are preferably composed of Cr-Cu-Cr layers covered by at least one upper metal layer which is separated from the Cu of the conductor by means of a metal such as phased layers of Cr or Ti deposited before the other upper metal layer or layers. Solder ball bonding surfaces are composed of additional metal in the form of Au, Cu and Ni.

Abstract: A controlled geometric configuration of contact pads for securing solder mounds to an integrated circuit chip which reduces cracking of brittle passivating coatings in fabrication of components.