Patents by Inventor Son V. Nguyen

Son V. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190231521
    Abstract: Expandable docking stations for docking an expandable valve can include a valve seat, one or more sealing portions, and/or one or more retaining portions. The valve seat can be unexpandable or substantially unexpandable beyond a deployed size. The one or more sealing portions can be connected to the valve seat and extend radially outward of the valve seat. The one or more sealing portions can be constructed to expand outward of the valve seat and provide a seal over a range of sizes. The one or more retaining portions can be connected to the one or more sealing portions. The one or more retaining portions are configured to retain the docking station at a deployed position.
    Type: Application
    Filed: March 1, 2019
    Publication date: August 1, 2019
    Inventors: Dustin P. Armer, Michael D. Franklin, Sergio Delgado, Abhijeet Joshi, Dinesh L. Sirinanne, Russell T. Joseph, Eason Michael Abbott, Tram Ngoc Nguyen, Son V. Nguyen, Hien Tran Ngo, Vivian Tran, Charles L. Bowman, Stanton J. Rowe
  • Patent number: 10363130
    Abstract: Expandable docking stations for docking an expandable valve can include a valve seat, one or more sealing portions, and one or more retaining portions. The valve seat can be unexpandable or substantially unexpandable beyond a deployed size. The one or more sealing portions are connected to the valve seat and extend radially outward of the valve seat. The one or more sealing portions are constructed to expand outward of the valve seat and provide a seal over a range of sizes. The one or more retaining portions are connected to the one or more sealing portions. The one or more retaining portions are configured to retain the docking station at a deployed position.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: July 30, 2019
    Assignee: Edwards Lifesciences Corporation
    Inventors: Dustin P. Armer, Michael D. Franklin, Sergio Delgado, Abhijeet Joshi, Dinesh L. Sirimanne, Russell T. Joseph, Eason Michael Abbott, Tram Ngoc Nguyen, Son V. Nguyen, Hien Tran Ngo, Vivian Tran, Charles L. Bowman, Stanton J. Rowe
  • Publication number: 20190192289
    Abstract: Embodiments of a radially collapsible and expandable prosthetic heart valve are disclosed. A valve frame can have a tapered profile when mounted on a delivery shaft, with an inflow end portion having a smaller diameter than an outflow end portion. The valve can comprise generally V-shaped leaflets, reducing material within the inflow end of the frame. An outer skirt can be secured to the outside of the inflow end portion of the frame, the outer skirt having longitudinal slack when the valve is expanded and lying flat against the frame when the valve is collapsed. A diagonally woven inner skirt can elongate axially with the frame. Side tabs of adjacent leaflets can extend through and be secured to window frame portions of the frame to form commissures. The window frame portions can be depressed radially inward relative to surrounding frame portions when the valve is crimped onto a delivery shaft.
    Type: Application
    Filed: November 28, 2018
    Publication date: June 27, 2019
    Applicant: Edwards Lifesciences Corporation
    Inventors: Tamir S. Levi, Son V. Nguyen, Netanel Benichou, David Maimon, Ziv Yohanan, Nikolay Gurovich, Bella Felsen, Larisa Dadonkina, Ron Sharoni, Elena Sherman
  • Publication number: 20190192288
    Abstract: Embodiments of a radially collapsible and expandable prosthetic heart valve are disclosed. A valve frame can have a tapered profile when mounted on a delivery shaft, with an inflow end portion having a smaller diameter than an outflow end portion. The valve can comprise generally V-shaped leaflets, reducing material within the inflow end of the frame. An outer skirt can be secured to the outside of the inflow end portion of the frame, the outer skirt having longitudinal slack when the valve is expanded and lying flat against the frame when the valve is collapsed. A diagonally woven inner skirt can elongate axially with the frame. Side tabs of adjacent leaflets can extend through and be secured to window frame portions of the frame to form commissures. The window frame portions can be depressed radially inward relative to surrounding frame portions when the valve is crimped onto a delivery shaft.
    Type: Application
    Filed: November 27, 2018
    Publication date: June 27, 2019
    Applicant: Edwards Lifesciences Corporation
    Inventors: Tamir S. Levi, Son V. Nguyen, Netanel Benichou, David Maimon, Ziv Yohanan, Nikolay Gurovich, Bella Felsen, Larisa Dadonkina, Ron Sharoni, Elena Sherman
  • Patent number: 10325806
    Abstract: Low capacitance and high reliability interconnect structures and methods of manufacture are disclosed. The method includes forming a copper based interconnect structure in an opening of a dielectric material. The method further includes forming a capping layer on the copper based interconnect structure. The method further includes oxidizing the capping layer and any residual material formed on a surface of the dielectric material. The method further includes forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer. The method further includes removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: June 18, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga K. Shobha
  • Publication number: 20190172704
    Abstract: A method for depositing a dielectric layer that includes introducing a substrate into a process chamber of a deposition tool; and heating the substrate to a process temperature. The method may further include introducing precursors that include at least one dielectric providing gas species for a deposited layer and at least one hydrogen precursor gas into the process chamber of the deposition tool. The hydrogen precursor gas is introduced to the deposition chamber at a flow rate ranging from 50 sccm to 5000 sccm. The molar ratio for Hydrogen/Silicon gas precursor can be equal or greater than 0.05.
    Type: Application
    Filed: January 17, 2019
    Publication date: June 6, 2019
    Inventors: Thomas J. Haigh, JR., Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha
  • Publication number: 20190159894
    Abstract: Embodiments of a radially collapsible and expandable prosthetic heart valve are disclosed. A valve frame can have a tapered profile when mounted on a delivery shaft, with an inflow end portion having a smaller diameter than an outflow end portion. The valve can comprise generally V-shaped leaflets, reducing material within the inflow end of the frame. An outer skirt can be secured to the outside of the inflow end portion of the frame, the outer skirt having longitudinal slack when the valve is expanded and lying flat against the frame when the valve is collapsed. A diagonally woven inner skirt can elongate axially with the frame. Side tabs of adjacent leaflets can extend through and be secured to window frame portions of the frame to form commissures. The window frame portions can be depressed radially inward relative to surrounding frame portions when the valve is crimped onto a delivery shaft.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 30, 2019
    Applicant: Edwards Lifesciences Corporation
    Inventors: Tamir S. Levi, Son V. Nguyen, Netanel Benichou, David Maimon, Ziv Yohanan, Nikolay Gurovich, Bella Felsen, Larisa Dadonkina, Ron Sharoni, Elena Sherman
  • Publication number: 20190159895
    Abstract: Embodiments of a radially collapsible and expandable prosthetic heart valve are disclosed. The prosthetic valve can comprise an annular frame, leaflets, an inner skirt, and an outer skirt. The outer skirt can be secured to the outside of the inflow end portion of the frame, the outer skirt having longitudinal slack that buckles outward radially when the valve is in the expanded configuration and which lies flat when the valve is in the collapsed configuration. In some embodiments, the outer skirt is stiffer in the axial direction of the valve than in the circumferential direction of the valve. In additional embodiments, the outer skirt comprises a self-expandable fabric comprising fibers made of a shape memory material having a shape memory set to enhance the radially outward buckling of the outer skirt. Methods of crimping such valves to a collapsed or partially collapsed configuration are also disclosed.
    Type: Application
    Filed: January 30, 2019
    Publication date: May 30, 2019
    Inventors: Tamir S. Levi, Ron Sharoni, Elena Sherman, Oren H. Wintner, Kevin D. Rupp, Son V. Nguyen, Ajay Chadha, Jeff Lindstrom
  • Publication number: 20190157140
    Abstract: An upper layer is formed in a first interlayer dielectric (ILD) layer. The upper layer comprises a plurality of metal interconnects and one or more upper layer air gaps positioned between adjacent metal interconnects. A lower layer is formed in the first ILD layer. The lower layer comprises one or more vias, and one or more lower air gaps positioned between adjacent vias. The upper layer and the lower layer are formed in accordance with a dual-damascene process.
    Type: Application
    Filed: January 2, 2019
    Publication date: May 23, 2019
    Inventors: Richard A. Conti, Jessica Dechene, Susan S. Fan, Son V. Nguyen, Jeffrey C. Shearer
  • Publication number: 20190133761
    Abstract: A deficient native mitral valve is treated by implanting a prosthetic mitral valve assembly valve in a patient's heart. The prosthetic mitral valve assembly includes a stent having a flared upper portion, an intermediate portion, and a lower portion. The diameter at the inflow end of the stent is larger than at the outflow end. The prosthetic mitral valve assembly also includes a valve portion formed with pericardial tissue leaflets. A tether has a first end attached to the stent and a second end attached to an anchor. The tether extends through a wall of the left ventricle and the tissue anchor is placed outside the left ventricle. After implantation, the flared upper portion resists movement in the downstream direction and the tether resists movement in the upstream direction for securing the prosthetic mitral valve assembly in the native mitral valve.
    Type: Application
    Filed: January 2, 2019
    Publication date: May 9, 2019
    Inventors: Stanton J. Rowe, Mark Chau, Son V. Nguyen
  • Publication number: 20190099269
    Abstract: A method of crimping an implantable prosthetic valve can include placing protective material over at least a portion of the implantable prosthetic valve. The protective material can be configured to occupy space between open cells of a frame of the implantable prosthetic valve to prevent damage to a leaflet structure of the implantable prosthetic valve. The method can also include crimping the implantable prosthetic valve with the protective material on the implantable prosthetic valve, and removing the protective material from between the frame and the leaflet structure of the implantable prosthetic valve.
    Type: Application
    Filed: November 28, 2018
    Publication date: April 4, 2019
    Applicant: Edwards Lifesciences Corporation
    Inventors: Ilia Hariton, Netanel Benichou, Yaacov Nitzan, Bella Felsen, Diana Nguyen-Thien-Nhon, Rajesh A. Khanna, Son V. Nguyen, Tamir S. Levi, Itai Pelled
  • Publication number: 20190099268
    Abstract: A method of crimping an implantable prosthetic valve can include placing protective material over at least a portion of the implantable prosthetic valve. The protective material can be configured to occupy space between open cells of a frame of the implantable prosthetic valve to prevent damage to a leaflet structure of the implantable prosthetic valve. The method can also include crimping the implantable prosthetic valve with the protective material on the implantable prosthetic valve, and removing the protective material from between the frame and the leaflet structure of the implantable prosthetic valve.
    Type: Application
    Filed: November 28, 2018
    Publication date: April 4, 2019
    Applicant: Edwards Lifesciences Corporation
    Inventors: Ilia Hariton, Netanel Benichou, Yaacov Nitzan, Bella Felsen, Diana Nguyen-Thien-Nhon, Rajesh A. Khanna, Son V. Nguyen, Tamir S. Levi, Itai Pelled
  • Publication number: 20190091018
    Abstract: A method of crimping an implantable prosthetic valve can include placing protective material over at least a portion of the implantable prosthetic valve. The protective material can be configured to occupy space between open cells of a frame of the implantable prosthetic valve to prevent damage to a leaflet structure of the implantable prosthetic valve. The method can also include crimping the implantable prosthetic valve with the protective material on the implantable prosthetic valve, and removing the protective material from between the frame and the leaflet structure of the implantable prosthetic valve.
    Type: Application
    Filed: November 28, 2018
    Publication date: March 28, 2019
    Applicant: Edwards Lifesciences Corporation
    Inventors: Ilia Hariton, Netanel Benichou, Yaacov Nitzan, Bella Felsen, Diana Nguyen-Thien-Nhon, Rajesh A. Khanna, Son V. Nguyen, Tamir S. Levi, Itai Pelled
  • Patent number: 10242865
    Abstract: A method for depositing a dielectric layer that includes introducing a substrate into a process chamber of a deposition tool; and heating the substrate to a process temperature. The method may further include introducing precursors that include at least one dielectric providing gas species for a deposited layer and at least one hydrogen precursor gas into the process chamber of the deposition tool. The hydrogen precursor gas is introduced to the deposition chamber at a flow rate ranging from 50 sccm to 5000 sccm. The molar ratio for Hydrogen/Silicon gas precursor can be equal or greater than 0.05.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: March 26, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas J. Haigh, Jr., Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha
  • Patent number: 10236176
    Abstract: A method for depositing a dielectric layer that includes introducing a substrate into a process chamber of a deposition tool; and heating the substrate to a process temperature. The method may further include introducing precursors that include at least one dielectric providing gas species for a deposited layer and at least one hydrogen precursor gas into the process chamber of the deposition tool. The hydrogen precursor gas is introduced to the deposition chamber at a flow rate ranging from 50 sccm to 5000 sccm. The molar ratio for Hydrogen/Silicon gas precursor can be equal or greater than 0.05.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: March 19, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas J. Haigh, Jr., Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha
  • Patent number: 10226334
    Abstract: A method of implanting a prosthetic mitral valve assembly using a transapical procedure is disclosed. An incision is formed in the chest in the apex of the patient's heart. A delivery catheter containing the prosthetic mitral valve assembly is advanced over a guidewire into the patient's heart. The prosthetic mitral valve assembly is deployed from the delivery catheter into the native mitral valve. The prosthetic mitral valve assembly comprises a stent having a lower portion for placement between the leaflets of a native mitral valve and an upper portion having a flared end for placement above the annulus. The prosthetic mitral valve includes a valve portion having leaflets formed of pericardial tissue. A plurality of upwardly bent prongs are provided along an outer surface of the stent for preventing upward migration of the prosthetic mitral valve assembly after deployment.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: March 12, 2019
    Assignee: Edwards Lifesciences Corporation
    Inventors: Stanton J. Rowe, Mark Chau, Son V. Nguyen
  • Patent number: 10224283
    Abstract: A semiconductor device includes a metal-containing structure such as a copper-containing wire or plug and a composite capping layer formed over the metal-containing structure. The composite capping layer includes a manganese-containing layer disposed over the metal-containing structure, a silicon-containing low-k dielectric layer disposed over the manganese-containing layer, and an intermediate layer between the manganese-containing layer and the silicon-containing low-k dielectric layer. The intermediate layer is the reaction product of the manganese-containing layer and the silicon-containing low-k dielectric layer.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Donald F. Canaperi, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini
  • Patent number: 10224239
    Abstract: An upper layer is formed in a first interlayer dielectric (ILD) layer. The upper layer comprises a plurality of metal interconnects and one or more upper layer air gaps positioned between adjacent metal interconnects. A lower layer is formed in the first ILD layer. The lower layer comprises one or more vias, and one or more lower air gaps positioned between adjacent vias. The upper layer and the lower layer are formed in accordance with a dual-damascene process.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Richard A. Conti, Jessica Dechene, Susan S. Fan, Son V. Nguyen, Jeffrey C. Shearer
  • Patent number: 10224241
    Abstract: Low capacitance and high reliability interconnect structures and methods of manufacture are disclosed. The method includes forming a copper based interconnect structure in an opening of a dielectric material. The method further includes forming a capping layer on the copper based interconnect structure. The method further includes oxidizing the capping layer and any residual material formed on a surface of the dielectric material. The method further includes forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer. The method further includes removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: March 5, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga K. Shobha
  • Publication number: 20190053894
    Abstract: An implantable prosthetic valve can include a radially expandable and collapsible annular frame having an inflow end and an outflow end. A leaflet structure can be positioned within the frame. An annular inner skirt can be positioned around an inner surface of the frame, wherein the inner skirt includes an outflow edge portion secured to the frame and an inflow edge portion that wraps around the inflow end of the frame and extends at least partially along an outer surface of the frame, with the inflow edge portion being secured to the frame. An outer skirt can be positioned around the outer surface of the frame, wherein the outer skirt comprises an outflow edge portion secured to the frame and an inwardly folded inflow edge portion that is secured to the inflow edge portion of the inner skirt.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 21, 2019
    Inventors: Tamir S. Levi, Son V. Nguyen