Abstract: A woven fabric for seats is made of warps and wefts woven into a pattern with a ratio of 1:1, wherein the warps density is 8 strips per unit length and the wefts density is 9.2 strips per unit length. The warps and wefts are both made of polyester and linen, wherein the polyester comprises 94% by weight and the linen comprises 6% by weight.

Abstract: An image processing method and an information processing device are provided. The information processing device may include a processor, which may be configured to: construct a three-dimensional face model based on a face object in a two-dimensional image; determine a correspondence between the constructed three-dimensional face model and the face object in the two-dimensional image; determine, based on the correspondence, an area of interest of a key point in the two-dimensional image using an area of interest near a corresponding key point in the three-dimensional face model; and extract an image feature from the determined area of interest in the two-dimensional image as an image feature of the key point.

Abstract: A method of forming a semiconductor device comprises forming a patterned masking material comprising parallel structures and parallel trenches extending at a first angle from about 30° to about 75° relative to a lateral direction. A mask is provided over the patterned masking material and comprises additional parallel structures and parallel apertures extending at a second, different angle from about 0° to about 90° relative to the lateral direction. The patterned masking material is further patterned using the mask to form a patterned masking structure comprising elongate structures separated by the parallel trenches and additional parallel trenches. Exposed portions of a hard mask material underlying the patterned masking structure are subjected to ARDE to form a patterned hard mask material. Exposed portions of a semiconductive material underlying the patterned hard mask material are removed to form semiconductive pillar structures. Semiconductor devices and electronic systems are also described.

Abstract: A method of forming a semiconductor device comprises forming a patterned masking material comprising parallel structures and parallel trenches extending at a first angle from about 30° to about 75° relative to a lateral direction. A mask is provided over the patterned masking material and comprises additional parallel structures and parallel apertures extending at a second, different angle from about 0° to about 90° relative to the lateral direction. The patterned masking material is further patterned using the mask to form a patterned masking structure comprising elongate structures separated by the parallel trenches and additional parallel trenches. Exposed portions of a hard mask material underlying the patterned masking structure are subjected to ARDE to form a patterned hard mask material. Exposed portions of a semiconductive material underlying the patterned hard mask material are removed to form semiconductive pillar structures. Semiconductor devices and electronic systems are also described.

Abstract: A method of forming a semiconductor device comprises forming a patterned masking material comprising parallel structures and parallel trenches extending at a first angle from about 30° to about 75° relative to a lateral direction. A mask is provided over the patterned masking material and comprises additional parallel structures and parallel apertures extending at a second, different angle from about 0° to about 90° relative to the lateral direction. The patterned masking material is further patterned using the mask to form a patterned masking structure comprising elongate structures separated by the parallel trenches and additional parallel trenches. Exposed portions of a hard mask material underlying the patterned masking structure are subjected to ARDE to form a patterned hard mask material. Exposed portions of a semiconductive material underlying the patterned hard mask material are removed to form semiconductive pillar structures. Semiconductor devices and electronic systems are also described.

Abstract: A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit (10) for separating a flip-chip (200) from a carrier (100) and providing the flip-chip (200), the supply unit (10) including flipping device (11); a transfer unit (20) for receiving the flip-chip (200) from the flipping device (11); a position adjustment unit (30) for adjusting the positions of flip-chips (200) on the transfer unit (20); a bonding unit (40) for bonding the flip-chips (200) on the transfer unit (20) onto a substrate (400); a transportation unit (50) for transporting the transfer unit (20); and a control unit (60) for controlling the movement of the preceding units. The transfer unit (20) is capable of receiving multiple flip-chips (200) and allows the flip-chips (200) to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput.

Abstract: A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area (110) for providing a chip (113) and a substrate pick-and-place area (120) for placing a substrate (123), the blue tape pick-and-place area (110) and the substrate pick-and-place area (120) being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (210), a chip alignment and fine-tuning area (220), and a chip batch-bonding area (230) in a direction running from the blue tape pick-and-place area (110) to the substrate pick-and-place area (120).

Abstract: A woven fabric for seats is made of warps and wefts woven into a pattern with a ratio of 1:1, wherein the warps density is 8 strips per unit length and the wefts density is 9.2 strips per unit length. The warps and wefts are both made of polyester and linen, wherein the polyester comprises 94% by weight and the linen comprises 6% by weight.

Abstract: A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.

Abstract: This disclosure relates to a method and a device for planning route, a server and a robot. To satisfy the demand for outbound communication of a robot during its traveling process, in the method, a preset threshold may be preset according to communication quality requirements of communication parties, and then a region where communication signal strength is stronger than the preset threshold is selected out. The selected region is regarded as a route planning basis for route planning, so that communication signal strength on the planned route is stronger than the preset threshold. Thus smooth communication of the robot with the outside in the traveling process based on the planned route is achieved.

Abstract: A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

Abstract: A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

Abstract: A voltage converter (FIG. 4) for a power supply circuit is disclosed. The voltage converter comprises a control circuit (400) coupled to receive an enable (EN) signal. The control circuit produces a first control signal (PWM) to provide a load current (IL) in response to the enable signal. A sample and hold circuit (408) is arranged to produce a third control signal (CSP) to emulate the load current and a fourth control signal (CSN?) to sample and hold value of the third control signal. A comparator circuit (416) is arranged to compare the third and fourth control signals and produce the enable signal in response to a result of the comparison.

Abstract: A circuit includes an inductor that receives a switched input voltage to provide an output for driving a load. A driver circuit drives the switched input voltage to the inductor in response to input pulses. A ramp circuit coupled to the inductor generates a ramp signal emulating current of the inductor. A control circuit generates the input pulses to control the driver circuit based on the ramp signal and the output for driving the load. A transient monitoring circuit monitors the output with respect to a predetermined threshold and adjusts the ramp circuit based on the output relative to the predetermined threshold to control the emulated current of the inductor to facilitate jitter and load transient performance.

Abstract: A circuit for controlling a switched-mode DC-DC converter. An inductor is connected between a switching node and an output node, and an output capacitor is connected in series with the inductor. An RC circuit is connected in parallel with the inductor to compensate for ripple voltage. In a discontinuous current mode, a pulse is applied to the switching node and then removed. In this mode, an RC time constant for the RC circuit is increased during the falling edge of a difference signal such that the difference signal does not drop below zero.

Abstract: A voltage adjusting circuit includes a voltage regulator module, a control chip, a platform controller hub (PCH), a basic input-output system (BIOS), a number of switching units, and a number of resistors. The voltage adjusting circuit is utilized to receive a voltage signal to supply a working voltage to a liquid crystal display (LCD). The voltage adjusting circuit controls switching units to turn on or turn off, and changes the current of the control chip, and further outputs different voltages to different LCDs. The disclosure further provides an all-in-one computer including the voltage adjusting circuit.

Abstract: A control circuit includes a platform controller hub (PCH), a basic input/output system (BIOS), an electronic switch, and first and second resistors. A management engine interface is loaded in the PCH. The BIOS is connected to the PCH to control the signals output from a general input/output (GPIO) pin of the PCH. A power supply is connected to a serial pin of the PCH through the electronic switch. The GPIO pin of the PCH controls on or off of the electronic switch.

Abstract: A motherboard includes a video signal switching circuit. The video signal switching circuit includes a video signal output unit, a video interface, a detecting unit, a control unit, and a signal conversion unit. The video signal output unit is used to output a first video signal. When the detecting unit detects that a first cable is connected to the video interface, the control unit outputs a first control signal to the signal conversion unit, the signal conversion unit does not operate, and the video interface receives the first video signal. When the detecting unit detects that a second cable is connected to the video interface, the control unit outputs a second control signal to the signal conversion unit, the signal conversion unit operates and converts the first video signal into a second video signal, and the video interface receives the second video signal.

Abstract: Disclosed are methods and resulting structures which provide an opening for epitaxial growth, the opening having an associated projection for reducing the size of the contact area on a substrate at which growth begins. During growth, the epitaxial material grows vertically from the contact area and laterally over the projection. The projection provides a stress relaxation region for the lateral growth to reduce dislocation and stacking faults at the side edges of the grown epitaxial material.