Patents by Inventor Songsheng Tan
Songsheng Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7902414Abstract: A catalytic process for the selective production of para-xylene comprises the step of reacting an aromatic hydrocarbon selected from the group consisting of toluene, benzene and mixtures thereof with a feed comprising carbon monoxide and hydrogen in the presence of a selectivated catalyst. The process includes a catalyst selectivation phase and a para-xylene production phase. In the catalyst selectivation phase, the aromatic hydrocarbon and the feed are contacted with the catalyst under a first set of conditions effective to increase the para-selectivity of said catalyst. In the para-xylene production phase, the aromatic hydrocarbon and said feed are contacted with the catalyst under a second set of conditions different from the first set of conditions effective to selectively produce para-xylene.Type: GrantFiled: October 3, 2007Date of Patent: March 8, 2011Assignee: ExxonMobil Chemical Patents Inc.Inventors: John D. Y. Ou, Zongxuan Hong, Songsheng Tan, Timothy E. McMinn
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Publication number: 20080033067Abstract: A catalytic process for the selective production of para-xylene comprises the step of reacting an aromatic hydrocarbon selected from the group consisting of toluene, benzene and mixtures thereof with a feed comprising carbon monoxide and hydrogen in the presence of a selectivated catalyst. The process includes a catalyst selectivation phase and a para-xylene production phase. In the catalyst selectivation phase, the aromatic hydrocarbon and the feed are contacted with the catalyst under a first set of conditions effective to increase the para-selectivity of said catalyst. In the para-xylene production phase, the aromatic hydrocarbon and said feed are contacted with the catalyst under a second set of conditions different from the first set of conditions effective to selectively produce para-xylene.Type: ApplicationFiled: October 3, 2007Publication date: February 7, 2008Inventors: John Ou, Zongxuan Hong, Songsheng Tan, Timothy McMinn
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Publication number: 20040097769Abstract: A catalytic process for the selective production of para-xylene comprises the step of reacting an aromatic hydrocarbon selected from the group consisting of toluene, benzene and mixtures thereof with a feed comprising carbon monoxide and hydrogen in the presence of a selectivated catalyst. The process includes a catalyst selectivation phase and a para-xylene production phase. In the catalyst selectivation phase, the aromatic hydrocarbon and the feed are contacted with the catalyst under a first set of conditions effective to increase the para-selectivity of said catalyst. In the para-xylene production phase, the aromatic hydrocarbon and said feed are contacted with the catalyst under a second set of conditions different from the first set of conditions effective to selectively produce para-xylene.Type: ApplicationFiled: November 14, 2002Publication date: May 20, 2004Inventors: John D. Y. Ou, Zongxuan Hong, Songsheng Tan, Timothy E. McMinn
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Patent number: 6731853Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.Type: GrantFiled: August 14, 2001Date of Patent: May 4, 2004Assignee: Corning IncorporartedInventors: Robert A. Boudreau, Chris P. Brophy, Lawrence Charles Hughes, Jr., Mark F. Krol, Deepukumar M. Nair, Songsheng Tan, Aniruddha S. Weling
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Patent number: 6574399Abstract: An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.Type: GrantFiled: November 2, 2001Date of Patent: June 3, 2003Assignee: Corning IncorporatedInventors: Robert A. Boudreau, Songsheng Tan
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Publication number: 20030086661Abstract: An optical receiver module includes a silicon wafer defining opposed first and second surfaces and having a transverse opening through the silicon wafer. The opening has at least two generally planar surfaces which intersect to form a V-shaped registration comer. An optical detector is secured to the first surface of the silicon wafer adjacent the opening, and an optical fiber has an end portion positioned within the transverse opening. The optical fiber has an outer surface in contact with the generally planar surfaces to position the end portion of the optical fiber within the opening. A fiber holder includes a pair of silicon chips, each having a V-groove. The optical fiber is positioned in the V-grooves and sandwiched between the silicon chips. The silicon chips are secured to the silicon wafer to retain the optical fiber.Type: ApplicationFiled: November 2, 2001Publication date: May 8, 2003Inventors: Robert A. Boudreau, Songsheng Tan
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Publication number: 20030086652Abstract: An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.Type: ApplicationFiled: November 2, 2001Publication date: May 8, 2003Inventors: Robert A. Boudreau, Songsheng Tan
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Patent number: 6490379Abstract: An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330,230, and/or 30) forming a transmission line (340) for propagating high frequency signals.Type: GrantFiled: May 7, 2001Date of Patent: December 3, 2002Assignee: Corning IncorporatedInventors: Robert A. Boudreau, Songsheng Tan, Christopher L. Henning, Karen I. Matthews
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Publication number: 20020164107Abstract: An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330, 230, and/or 30) forming a transmission line (340) for propagating high frequency signals.Type: ApplicationFiled: May 7, 2001Publication date: November 7, 2002Inventors: Robert A. Boudreau, Songsheng Tan, Christopher L. Henning, Karen I. Matthews
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Publication number: 20020131752Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.Type: ApplicationFiled: August 14, 2001Publication date: September 19, 2002Inventors: Robert A. Boudreau, Chris P. Brophy, Lawrence Charles Hughes, Mark F. Krol, Deepukumar M. Nair, Songsheng Tan, Aniruddha S. Weling
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Patent number: 5880525Abstract: A passive alignment structure for a substantially planar substrate, which is an anodic aluminum oxide structure having a vertical profile with respect to a horizontal surface of said substantially planar substrate.Type: GrantFiled: January 27, 1995Date of Patent: March 9, 1999Assignee: The Whitaker CorporationInventors: Robert Addison Boudreau, Terry Patrick Bowen, Hongtao Han, Songsheng Tan, John Robert Rowlette, Sr.
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Patent number: 5533158Abstract: An optical interconnect comprises a metallized optical fiber electrostatically bonded to a thin film of an alkali-containing glass which is itself bonded to a planar surface of a semiconductive or conductive substrate. Another optical interconnect comprises an optical fiber having a thin film of an alkali-containing glass deposited thereon, wherein the fiber is electrostatically bonded to a planar surface of a semiconductive or conductive substrate. A process of bonding an optical fiber to a semiconductive or conductive substrate includes contacting the fiber with the substrate, applying a DC potential to the fiber-substrate combination, slowly heating the combination to a maximum temperature between 180.degree.-500.degree. C., maintaining the combination at the maximum temperature for a few minutes, cooling the combination to room temperature, and removing the DC potential.Type: GrantFiled: September 12, 1994Date of Patent: July 2, 1996Assignee: The Whitaker CorporationInventors: Hongtao Han, Songsheng Tan