Patents by Inventor Songsheng Tan

Songsheng Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7902414
    Abstract: A catalytic process for the selective production of para-xylene comprises the step of reacting an aromatic hydrocarbon selected from the group consisting of toluene, benzene and mixtures thereof with a feed comprising carbon monoxide and hydrogen in the presence of a selectivated catalyst. The process includes a catalyst selectivation phase and a para-xylene production phase. In the catalyst selectivation phase, the aromatic hydrocarbon and the feed are contacted with the catalyst under a first set of conditions effective to increase the para-selectivity of said catalyst. In the para-xylene production phase, the aromatic hydrocarbon and said feed are contacted with the catalyst under a second set of conditions different from the first set of conditions effective to selectively produce para-xylene.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: March 8, 2011
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: John D. Y. Ou, Zongxuan Hong, Songsheng Tan, Timothy E. McMinn
  • Publication number: 20080033067
    Abstract: A catalytic process for the selective production of para-xylene comprises the step of reacting an aromatic hydrocarbon selected from the group consisting of toluene, benzene and mixtures thereof with a feed comprising carbon monoxide and hydrogen in the presence of a selectivated catalyst. The process includes a catalyst selectivation phase and a para-xylene production phase. In the catalyst selectivation phase, the aromatic hydrocarbon and the feed are contacted with the catalyst under a first set of conditions effective to increase the para-selectivity of said catalyst. In the para-xylene production phase, the aromatic hydrocarbon and said feed are contacted with the catalyst under a second set of conditions different from the first set of conditions effective to selectively produce para-xylene.
    Type: Application
    Filed: October 3, 2007
    Publication date: February 7, 2008
    Inventors: John Ou, Zongxuan Hong, Songsheng Tan, Timothy McMinn
  • Publication number: 20040097769
    Abstract: A catalytic process for the selective production of para-xylene comprises the step of reacting an aromatic hydrocarbon selected from the group consisting of toluene, benzene and mixtures thereof with a feed comprising carbon monoxide and hydrogen in the presence of a selectivated catalyst. The process includes a catalyst selectivation phase and a para-xylene production phase. In the catalyst selectivation phase, the aromatic hydrocarbon and the feed are contacted with the catalyst under a first set of conditions effective to increase the para-selectivity of said catalyst. In the para-xylene production phase, the aromatic hydrocarbon and said feed are contacted with the catalyst under a second set of conditions different from the first set of conditions effective to selectively produce para-xylene.
    Type: Application
    Filed: November 14, 2002
    Publication date: May 20, 2004
    Inventors: John D. Y. Ou, Zongxuan Hong, Songsheng Tan, Timothy E. McMinn
  • Patent number: 6731853
    Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: May 4, 2004
    Assignee: Corning Incorporarted
    Inventors: Robert A. Boudreau, Chris P. Brophy, Lawrence Charles Hughes, Jr., Mark F. Krol, Deepukumar M. Nair, Songsheng Tan, Aniruddha S. Weling
  • Patent number: 6574399
    Abstract: An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: June 3, 2003
    Assignee: Corning Incorporated
    Inventors: Robert A. Boudreau, Songsheng Tan
  • Publication number: 20030086661
    Abstract: An optical receiver module includes a silicon wafer defining opposed first and second surfaces and having a transverse opening through the silicon wafer. The opening has at least two generally planar surfaces which intersect to form a V-shaped registration comer. An optical detector is secured to the first surface of the silicon wafer adjacent the opening, and an optical fiber has an end portion positioned within the transverse opening. The optical fiber has an outer surface in contact with the generally planar surfaces to position the end portion of the optical fiber within the opening. A fiber holder includes a pair of silicon chips, each having a V-groove. The optical fiber is positioned in the V-grooves and sandwiched between the silicon chips. The silicon chips are secured to the silicon wafer to retain the optical fiber.
    Type: Application
    Filed: November 2, 2001
    Publication date: May 8, 2003
    Inventors: Robert A. Boudreau, Songsheng Tan
  • Publication number: 20030086652
    Abstract: An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.
    Type: Application
    Filed: November 2, 2001
    Publication date: May 8, 2003
    Inventors: Robert A. Boudreau, Songsheng Tan
  • Patent number: 6490379
    Abstract: An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330,230, and/or 30) forming a transmission line (340) for propagating high frequency signals.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: December 3, 2002
    Assignee: Corning Incorporated
    Inventors: Robert A. Boudreau, Songsheng Tan, Christopher L. Henning, Karen I. Matthews
  • Publication number: 20020164107
    Abstract: An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330, 230, and/or 30) forming a transmission line (340) for propagating high frequency signals.
    Type: Application
    Filed: May 7, 2001
    Publication date: November 7, 2002
    Inventors: Robert A. Boudreau, Songsheng Tan, Christopher L. Henning, Karen I. Matthews
  • Publication number: 20020131752
    Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.
    Type: Application
    Filed: August 14, 2001
    Publication date: September 19, 2002
    Inventors: Robert A. Boudreau, Chris P. Brophy, Lawrence Charles Hughes, Mark F. Krol, Deepukumar M. Nair, Songsheng Tan, Aniruddha S. Weling
  • Patent number: 5880525
    Abstract: A passive alignment structure for a substantially planar substrate, which is an anodic aluminum oxide structure having a vertical profile with respect to a horizontal surface of said substantially planar substrate.
    Type: Grant
    Filed: January 27, 1995
    Date of Patent: March 9, 1999
    Assignee: The Whitaker Corporation
    Inventors: Robert Addison Boudreau, Terry Patrick Bowen, Hongtao Han, Songsheng Tan, John Robert Rowlette, Sr.
  • Patent number: 5533158
    Abstract: An optical interconnect comprises a metallized optical fiber electrostatically bonded to a thin film of an alkali-containing glass which is itself bonded to a planar surface of a semiconductive or conductive substrate. Another optical interconnect comprises an optical fiber having a thin film of an alkali-containing glass deposited thereon, wherein the fiber is electrostatically bonded to a planar surface of a semiconductive or conductive substrate. A process of bonding an optical fiber to a semiconductive or conductive substrate includes contacting the fiber with the substrate, applying a DC potential to the fiber-substrate combination, slowly heating the combination to a maximum temperature between 180.degree.-500.degree. C., maintaining the combination at the maximum temperature for a few minutes, cooling the combination to room temperature, and removing the DC potential.
    Type: Grant
    Filed: September 12, 1994
    Date of Patent: July 2, 1996
    Assignee: The Whitaker Corporation
    Inventors: Hongtao Han, Songsheng Tan