Abstract: An approach to provide a semiconductor structure for a phase change memory cell with a first liner material surrounding a sidewall of a hole in a dielectric material where the hole in the dielectric is on a bottom electrode in the dielectric material. The semiconductor structure includes a layer of a second liner material on the first liner material, where the second liner material has an improved contact resistance to a phase change material. The semiconductor structure includes the phase change material abutting the layer of the second liner material on the first liner material. The phase change material fills the hole in the dielectric material. The second liner material that is between the phase change material and the first liner material provides a lower contact resistivity with the phase change material in the crystalline phase than the first liner material.

Abstract: A semiconductor device includes a plurality of memory blocks each including a plurality of memory cells, a circuit group performing a program operation, a read operation and an erase operation on a selected memory block, among the plurality of memory blocks, and a control circuit controlling the circuit group to program the memory cells of the selected memory block in a healing pattern. The healing pattern is programmed before a subsequent program operation is performed on the selected memory block. The memory cells of the healing pattern include erased memory cells and programmed memory cells arranged alternately.

Abstract: A semiconductor device includes a plurality of memory blocks each including a plurality of memory cells, a circuit group performing a program operation, a read operation and an erase operation on a selected memory block, among the plurality of memory blocks, and a control circuit controlling the circuit group to program the memory cells of the selected memory block in a healing pattern, before the program operation is performed on the selected memory block, wherein the memory cells of the healing pattern include erased memory cells and programmed memory cells arranged alternately.

Abstract: A read method of a semiconductor memory device includes performing a read operation on target cells by using a first read voltage, terminating the read operation on the target cells if, as a result of the read operation on the target cells, error correction is feasible, performing a read operation on first cells next to the target cells along a first direction if, as a result of the read operation on the target cells, error correction is unfeasible, performing the read operation again on the target cells by selecting one of a plurality of read voltages in response to a result of the read operation on the first cells and by using the selected read voltage for reading data of the target cells, and terminating the read operation on the target cells if error correction is feasible.

Abstract: A semiconductor memory device includes a plurality of memory blocks formed over a substrate including source regions and separated from each other by a slit, a plurality of bit lines coupled to the strings of the memory blocks and disposed over the memory blocks, and source contact lines formed within the slits, coupled to the source regions, respectively, and disposed in a direction to cross the plurality of bit lines.

Abstract: A programming method of a nonvolatile memory device includes inputting even data and odd data to be programmed into even memory cells coupled to even bit lines and odd memory cells coupled to odd bit lines, respectively, setting a sense signal as a first sense signal or a second sense signal having a lower voltage level than the first sense signal, based on odd data of odd memory cells adjacent to each of the even memory cells to be programmed, programming the even data into the even memory cells by supplying a program voltage, performing a program verify operation on each of the even memory cells in response to the set sense signal, and programming the odd data into the odd memory cells by supplying a program voltage.

Abstract: A semiconductor memory device includes a plurality of memory blocks formed over a substrate including source regions and separated from each other by a slit, a plurality of bit lines coupled to the strings of the memory blocks and disposed over the memory blocks, and source contact lines formed within the slits, coupled to the source regions, respectively, and disposed in a direction to cross the plurality of bit lines.

Abstract: A read method of a semiconductor memory device includes performing a read operation on target cells by using a first read voltage, terminating the read operation on the target cells if, as a result of the read operation on the target cells, error correction is feasible, performing a read operation on first cells next to the target cells along a first direction if, as a result of the read operation on the target cells, error correction is unfeasible, performing the read operation again on the target cells by selecting one of a plurality of read voltages in response to a result of the read operation on the first cells and by using the selected read voltage for reading data of the target cells, and terminating the read operation on the target cells if error correction is feasible.

Abstract: A programming method of a nonvolatile memory device includes inputting even data and odd data to be programmed into even memory cells coupled to even bit lines and odd memory cells coupled to odd bit lines, respectively, setting a sense signal as a first sense signal or a second sense signal having a lower voltage level than the first sense signal, based on odd data of odd memory cells adjacent to each of the even memory cells to be programmed, programming the even data into the even memory cells by supplying a program voltage, performing a program verify operation on each of the even memory cells in response to the set sense signal, and programming the odd data into the odd memory cells by supplying a program voltage.