Patents by Inventor Soumyadyuti Samai

Soumyadyuti Samai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250091897
    Abstract: The disclosure relates to porous garnet ribbons and methods of making such porous garnet ribbons.
    Type: Application
    Filed: December 2, 2024
    Publication date: March 20, 2025
    Inventors: Aaron David DeGeorge, Barbara Anna Oyer, Soumyadyuti Samai, Zhen Song, Cameron Wayne Tanner, Patrick David Tepesch
  • Patent number: 12202737
    Abstract: The disclosure relates to porous garnet ribbons and methods of making such porous garnet ribbons.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: January 21, 2025
    Assignee: CORNING INCORPORATED
    Inventors: Aaron David DeGeorge, Barbara Anna Oyer, Soumyadyuti Samai, Zhen Song, Cameron Wayne Tanner, Patrick David Tepesch
  • Publication number: 20240179837
    Abstract: A printed circuit board (PCB) composite material includes a polymer layer and a fiber layer encapsulated within the polymer layer. The fiber layer includes a first monolayer of continuous silica fibers longitudinally co-aligned in a first direction. Each continuous silica fiber in the first monolayer extends without discontinuity through the polymer layer such that opposed ends of each continuous silica fiber are adjacent to a perimeter of the polymer layer. The PCB composite material has a dielectric loss tangent of less than or equal to about 0.0015 at 15 GHz or higher frequency. A printed circuit board (PCB) includes the PCB composite material and at least one conductive layer disposed on a side of the PCB composite material.
    Type: Application
    Filed: November 27, 2023
    Publication date: May 30, 2024
    Inventors: Joseph Edward McCarthy, Geraint Owen, Soumyadyuti Samai, Meiyu Zhai
  • Publication number: 20230140520
    Abstract: The disclosure relates to porous garnet ribbons and methods of making such porous garnet ribbons.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 4, 2023
    Inventors: Aaron David DeGeorge, Barbara Anna Oyer, Soumyadyuti Samai, Zhen Song, Cameron Wayne Tanner, Patrick David Tepesch