Abstract: Examples are disclosed that relate to methods, computing devices, and head-mounted display (HMD) devices for regulating a surface temperature of a device. In one example, a method comprises determining the surface temperature of a surface of the device, determining an energy accumulator value indicating cumulative energy received by a user via the surface of the device, and using a dynamic temperature limit function to calculate a temperature limit as a function of the energy accumulator value. The method also comprises comparing the surface temperature to the temperature limit. When the surface temperature has not reached the temperature limit, the method comprises incrementing the energy accumulator value. When the surface temperature has reached the temperature limit, the method comprises initiating a thermal mitigation action to cool the surface.

Abstract: Examples are disclosed that relate to methods, computing devices, and head-mounted display (HMD) devices for regulating a surface temperature of a device. In one example, a method comprises determining the surface temperature of a surface of the device, determining an energy accumulator value indicating cumulative energy received by a user via the surface of the device, and using a dynamic temperature limit function to calculate a temperature limit as a function of the energy accumulator value. The method also comprises comparing the surface temperature to the temperature limit. When the surface temperature has not reached the temperature limit, the method comprises incrementing the energy accumulator value. When the surface temperature has reached the temperature limit, the method comprises initiating a thermal mitigation action to cool the surface.

Abstract: A system for increasing the temperature of a display element includes a heat source configured to perform a user experience function independent of generating heat. The system also includes a thermally conductive element that is coupled to the heat source and is positioned proximate to the display element, forming a thermally conductive path between the heat source and the display element. A method for increasing the temperature of a display element includes generating heat by operating a heat source to perform a user experience function independent of generating heat, and dispersing the heat from the heat source to the display element via a thermally conductive path formed by a thermally conductive element coupled to the heat source and positioned proximate to the display element.

Abstract: Techniques disclosed herein relate to using thermally conductive textiles for heat dissipation from wearable electronic devices. An exemplary thermally conductive textile may be constructed from an elasticated band for encircling a body part of a user (e.g., a user's head) and one or more thermally conductive wires that are affixed to the elasticated band in a wave pattern. The thermally conductive wires being arranged in the wave pattern allows for the thermally conductive wires to freely stretch and contract as forces are exerted on the elasticated band. Thus, the thermally conductive textile described herein exhibit elastic properties that are predominantly governed by the elasticated band while also exhibiting thermal properties that are predominantly governed by the thermally conductive wires. The thermally conductive textiles may also include locking fibers to restrict deformation of the wave pattern of the thermally conductive wires.

Abstract: Devices having multiple layers of paint for enhanced thermal performance. Individual paint-layers have specific properties within specific wavelength-ranges. An exemplary device includes an emissive outer layer that has a high emissivity in a first wavelength-range to increase thermal radiation and a high transmittance in a second wavelength-range to reduce solar gain. Underneath the emissive outer layer is a color matching layer that has a high transmittance in the second wavelength-range and absorbs at least some visible light. Underneath the color matching layer is a reflective sublayer that has a high reflectivity in the second wavelength-range. EM radiation within the second wavelength-range passes through the emissive outer layer and color matching layer before being reflected by the reflective sublayer back into the atmosphere. Thus, solar gain is reduced due to the solar energy within the second wavelength range being reflected off of the device—rather than absorbed as thermal energy.

Abstract: Techniques disclosed herein relate to exploiting photovoltaic effects to improve the thermal management capabilities for wearable electronic devices. In an exemplary embodiment, a wearable electronic device includes photovoltaic cells disposed over a housing assembly that encloses heat-emitting electronic components. The photovoltaic cells block solar radiation from reaching an exterior surface of the housing assembly—thereby reducing the solar gain thereof. Electrical energy that is generated by the photovoltaic cells is utilized in some manner that is determined to be currently appropriate based on various current-state factors of the wearable electronic device.

Abstract: Various implementations relating to an illumination package including an edge-emitting laser diode (EELD) are disclosed. In one embodiment, an illumination package includes a heat spreader including a base and a stub that extends from the base, an EELD configured to generate illumination light, the EELD being mounted to a side surface of the stub, and a substrate coupled to the base at a location spaced from the EELD, the substrate being electrically connected to the EELD.

Abstract: Various embodiments relating to a time-of-flight (TOF) depth camera including a vertical-cavity surface emitting laser (VCSEL) array device are disclosed. In one embodiment, a TOF depth camera includes a heat sink having a mounting surface, an illumination module mounted to the mounting surface, and an image sensor mounted to the mounting surface. The illumination module includes a printed circuit board (PCB), a VCSEL array device configured to generate illumination light to illuminate an image environment, and a driver configured to deliver an operating current to the VCSEL array device. The VCSEL array device and the driver are mounted to the PCB. The image sensor is configured to detect at least a portion of illumination light reflected from the image environment.

Abstract: Various implementations relating to an illumination package including an edge-emitting laser diode (EELD) are disclosed. In one embodiment, an illumination package includes a heat spreader including a base and a stub that extends from the base, an EELD configured to generate illumination light, the EELD being mounted to a side surface of the stub, and a substrate coupled to the base at a location spaced from the EELD, the substrate being electrically connected to the EELD.

Abstract: Various embodiments relating to a time-of-flight (TOF) depth camera including a vertical-cavity surface emitting laser (VCSEL) array device are disclosed. In one embodiment, a TOF depth camera includes a heat sink having a mounting surface, an illumination module mounted to the mounting surface, and an image sensor mounted to the mounting surface. The illumination module includes a printed circuit board (PCB), a VCSEL array device configured to generate illumination light to illuminate an image environment, and a driver configured to deliver an operating current to the VCSEL array device. The VCSEL array device and the driver are mounted to the PCB. The image sensor is configured to detect at least a portion of illumination light reflected from the image environment.

Abstract: Embodiments are disclosed that relate to reducing inductive losses and controlling driver and laser diode temperatures in an optical assembly comprising a laser diode. For example, one disclosed embodiment provides an optical assembly comprising a printed circuit board, and a laser diode package and laser diode driver mounted to the printed circuit board. Further, a heat sink is coupled to the laser diode driver and configured to provide a first thermal path for conducting heat from the laser diode driver. Additionally, a coupler may further be coupled to the laser diode package and printed circuit board, wherein the coupler is configured to provide a second, different thermal path for conducting heat from the laser diode package.

Abstract: Embodiments are disclosed that relate to reducing inductive losses and controlling driver and laser diode temperatures in an optical assembly comprising a laser diode. For example, one disclosed embodiment provides an optical assembly comprising a printed circuit board, and a laser diode package and laser diode driver mounted to the printed circuit board. Further, a heat sink is coupled to the laser diode driver and configured to provide a first thermal path for conducting heat from the laser diode driver. Additionally, a coupler may further be coupled to the laser diode package and printed circuit board, wherein the coupler is configured to provide a second, different thermal path for conducting heat from the laser diode package.

Abstract: A test fixture and method for mechanical testing of production samples of semiconductor chips that have been packaged and mounted on a printed circuit board. The sample is isolated and attached to a loading arm using an adhesive. The test fixture includes at least four plates disposed in a spaced-apart relationship along a testing axis. At least six rods are used to maintain this alignment. A first rod set of at least three rods is fixed in a first direction along the testing axis. The first rod set extends parallel to the testing axis through openings formed in a second plate to the third plate, to which the first rod set is fixed in at least a second direction along the testing axis, the second direction being opposite to the first direction. Similarly, a second set of at least three rods are fixed in the first direction to a second plate, extend along the testing axis through openings formed in the third plate, and are fixed in a second direction to the fourth plate.

Abstract: A test fixture and method for mechanical testing of production samples of semiconductor chips that have been packaged and mounted on a printed circuit board. The sample is isolated and attached to a loading arm using an adhesive. The test fixture includes at least four plates disposed in a spaced-apart relationship along a testing axis. At least six rods are used to maintain this alignment. A first rod set of at least three rods is fixed in a first direction along the testing axis. The first rod set extends parallel to the testing axis through openings formed in a second plate to the third plate, to which the first rod set is fixed in at least a second direction along the testing axis, the second direction being opposite to the first direction. Similarly, a second set of at least three rods are fixed in the first direction to a second plate, extend along the testing axis through openings formed in the third plate, and are fixed in a second direction to the fourth plate.