Abstract: In some embodiments, an integrated circuit (IC) includes multiple packages that are separate from one another. Each package includes a pad, and a core via is electrically coupled to the pads of the separate packages to electrically couple the packages to one another. At least one of the pads includes an oblong shape to match its impedance with the impedance of the core via.

Abstract: A printed circuit board includes a grid of pads and tracks. The grid of pads includes a first pair of adjacent signal pads arranged in a first column and a second pair of adjacent signal pads arranged in a first row. A first signal pad of the second pair is arranged in the first column. The grid of pads also includes a third pair of adjacent signal pads arranged in a second row. A second signal pad of the first pair is arranged in the second row. The grid of pads further includes a fourth pair of adjacent signal pads arranged in a second column. A third signal pad of the third pair is arranged in the second column. A fourth signal pad of the fourth pair is arranged in the first row. The tracks are electrically coupled to the first, second, third, and fourth pairs.