Patents by Inventor Srinivasa DAMARAJU

Srinivasa DAMARAJU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor shield
    Patent number: 11422233
    Abstract: An assembly includes a housing arranged to house a sensor. The assembly includes a ring-shaped first shield supported by the housing. The assembly includes a second shield supported by the housing above the first shield and defining an outer perimeter greater than an inner perimeter, and less than an outer perimeter, of the first shield.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: August 23, 2022
    Assignees: Ford Global Technologies, LLC, Argo AI, LLC
    Inventors: Dustin Yautz, Kenneth Jackson, Srinivasa Damaraju, Ahmad Soufan
  • SENSOR SHIELD
    Publication number: 20200116828
    Abstract: An assembly includes a housing arranged to house a sensor. The assembly includes a ring-shaped first shield supported by the housing. The assembly includes a second shield supported by the housing above the first shield and defining an outer perimeter greater than an inner perimeter, and less than an outer perimeter, of the first shield.
    Type: Application
    Filed: October 16, 2018
    Publication date: April 16, 2020
    Applicants: Ford Global Technologies, LLC, Argo AI, LLC
    Inventors: Dustin Yautz, Kenneth Jackson, Srinivasa Damaraju, Ahmad Soufan
  • Thermal shield can for improved thermal performance of mobile devices
    Patent number: 10509447
    Abstract: The invention is directed to a novel solution for improving heat management in computing devices by using thermally active material integrated within a shield can disposed over an integrated circuit or printed circuit board. By integrating the thermally active material within the shield can, isothermal conditions can be maintained for a longer period of time, thereby extending the transient state of a heat-producing system for longer durations, while maintaining slim vertical profiles.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: December 17, 2019
    Assignee: Nvidia Corporation
    Inventors: Srinivasa Damaraju, Chandra Madichetty
  • THERMAL SHIELD CAN FOR IMPROVED THERMAL PERFORMANCE OF MOBILE DEVICES
    Publication number: 20170075396
    Abstract: The invention is directed to a novel solution for improving heat management in computing devices by using thermally active material integrated within a shield can disposed over an integrated circuit or printed circuit board. By integrating the thermally active material within the shield can, isothermal conditions can be maintained for a longer period of time, thereby extending the transient state of a heat-producing system for longer durations, while maintaining slim vertical profiles.
    Type: Application
    Filed: September 16, 2015
    Publication date: March 16, 2017
    Inventors: Srinivasa DAMARAJU, Chandra MADICHETTY