Abstract: A method of constructing a fiber-optic gyroscope includes optically coupling first and second optical fibers to an optical path of an interferometer having an outer surface, coupling at least a portion of the first and second fibers to the outer surface, and optically coupling the first and second fibers to an optical path of an integrated optics chip (IOC).

Abstract: A method of constructing a fiber-optic gyroscope includes optically coupling first and second optical fibers to an optical path of an interferometer having an outer surface, coupling at least a portion of the first and second fibers to the outer surface, and optically coupling the first and second fibers to an optical path of an integrated optics chip (IOC).

Abstract: A fiber optic coil assembly and a method of winding the same include a fiber optic coil configured to eliminate a jog zone, which is found in conventionally fiber optic coil assemblies and tends to weaken the coil. The fiber optic coil assembly includes at least two layers of coil. A first layer is cylindrically wound in a first rotational direction and in a first linear direction and includes coil diameters located substantially parallel to one another and extending over the first linear direction. A first lead portion extends from an end of the first layer through an opening defined by the wound first layer. A second layer is formed in a similar manner as the first layer, except it is wound in an opposite rotational direction. Additional layers may be included consistent with the winding process of the first or the second layer, respectively.

Abstract: An octupole winding pattern for winding a fiber optic coil includes at least two layers of an eight-layer winding pattern having an end fiber optic coil diameter formed in an opposite direction as a substantial portion of a remaining portion of the respective layer. The selectively arranged octupole winding pattern may be used in a fiber optic gyroscope. A spool onto which the fiber optic coil is wound may be removable. Preferably, the octupole winding pattern is advantageously arranged to provide a substantial amount of optical symmetry with respect to a winding centerline of the fiber optic coil. In addition, the octupole winding pattern provides a substantial amount of geometric, mechanical, and thermal symmetry.

Abstract: A fiber optic coil assembly and a method of winding the same include a fiber optic coil configured to eliminate a jog zone, which is found in conventionally fiber optic coil assemblies and tends to weaken the coil. The fiber optic coil assembly includes at least two layers of coil. A first layer is cylindrically wound in a first rotational direction and in a first linear direction and includes coil diameters located substantially parallel to one another and extending over the first linear direction. A first lead portion extends from an end of the first layer through an opening defined by the wound first layer. A second layer is formed in a similar manner as the first layer, except it is wound in an opposite rotational direction. Additional layers may be included consistent with the winding process of the first or the second layer, respectively.

Abstract: The present invention provides an assembly that may be used to clean the external surfaces of fiber optic cable. The assembly includes a baffle housing, a plasma source, a cable guide, and brackets to position the baffle and plasma source. The baffle housing defines a plasma inlet, an outlet, a cable passageway, and a chamber, wherein the chamber is in fluid communication with the plasma inlet, the outlet, and the cable passageway. The plasma source is disposed so as to emit a plasma gas into the housing through the plasma inlet, into the chamber, and out of the housing through the outlet. The chamber is shaped so as to generate turbidity in the plasma gas therein thus the plasma gas contacts all surfaces of a fiber optic cable in the chamber. The assembly uses a plasma source that provides an air plasma gas at atmospheric pressure.

Abstract: The present invention provides an assembly that may be used to clean the external surfaces of fiber optic cable. The assembly includes a baffle housing, a plasma source, a cable guide, and brackets to position the baffle and plasma source. The baffle housing defines a plasma inlet, an outlet, a cable passageway, and a chamber, wherein the chamber is in fluid communication with the plasma inlet, the outlet, and the cable passageway. The plasma source, is disposed so as to emit a plasma gas into the housing through the plasma inlet, into the chamber, and out of the housing through the outlet. The chamber is shaped so as to generate turbidity in the plasma gas therein thus the plasma gas contacts all surfaces of a fiber optic cable in the chamber. The assembly uses a plasma source that provides an air plasma gas at atmospheric pressure.

Abstract: A method of securing a substrate in a semiconductor processing machine. The method includes moving latch bodies between latched and unlatched positions while permitting contact between a clamping member of each latch body and the substrate only if the latch bodies are substantially in the latched position. In the latched position, the clamping members apply a clamping force effective to secure the substrate. Generally, contact is prevented by engagement between a support member and an ramp that is inclined such that the clamping member descends toward the substrate as the latch body moves from the unlatched position to the latched position and only contacts the substrate as the latched position is established.

Abstract: A method of securing a substrate in a semiconductor processing machine. The method includes moving latch bodies between latched and unlatched positions while permitting contact between a clamping member of each latch body and the substrate only if the latch bodies are substantially in the latched position. In the latched position, the clamping members apply a clamping force effective to secure the substrate. Generally, contact is prevented by engagement between a support member and an ramp that is inclined such that the clamping member descends toward the substrate as the latch body moves from the unlatched position to the latched position and only contacts the substrate as the latched position is established.

Abstract: A wafer handling system and a method of retrofitting the system to an existing wafer handling apparatus are provided that make possible a method of handling wafers by contacting only a narrow area of not more than two millimeters wide adjacent the edge of the wafer, which is particularly useful for backside deposition where device side contact defines an area of exclusion that renders the wafer unusable in that area. The system provides a chuck on a wafer transfer arm that holds a wafer by gravity on a segmented, upwardly facing annular surface. A compatible annular surface is provided on an aligning station chuck so that wafers can be transferred by contact only with the exclusion area of the wafer surface. A load arm has two similarly compatible chucks further provided with pneumatically actuated grippers to allow the wafer to be loaded into a vertical processing apparatus.

Abstract: A semiconductor wafer holding assembly that secures a semiconductor wafer for wafer handling by a semiconductor processing machine. The wafer holding assembly includes a clamp ring that is mounted to a support frame and that has a wafer-engaging surface. A plurality of latch assemblies are mounted about the periphery of the clamp ring and adjacent to the wafer-engaging surface. Each latch assembly includes a latch body that carries a clamping roller assembly and a supporting roller assembly. A rolling element of the supporting roller assembly rolls along a circular path on an inclined surface on the clamp ring as the latch body is rotated through a pivot arc between an unlatched position and a latched position. Unless the latch body is positioned in the latched position, the rolling engagement between the supporting roller assembly and the inclined surface suspends the rolling element of the clamping roller assembly above the wafer surface until the latch body is in the latched position.

Abstract: A semiconductor wafer holding assembly that secures a semiconductor wafer for wafer handling by a semiconductor processing machine. The wafer holding assembly includes a clamp ring that is mounted to a support frame and that has a wafer-engaging surface. A plurality of latch assemblies are mounted about the periphery of the clamp ring and adjacent to the wafer-engaging surface. Each latch assembly includes a latch body that carries a clamping roller assembly and a supporting roller assembly. A rolling element of the supporting roller assembly rolls along a circular path on an inclined surface on the clamp ring as the latch body is rotated through a pivot arc between an unlatched position and a latched position. Unless the latch body is positioned in the latched position, the rolling engagement between the supporting roller assembly and the inclined surface suspends the rolling element of the clamping roller assembly above the wafer surface until the latch body is in the latched position.

Abstract: A wafer handling system and a method of retrofitting the system to an existing wafer handling apparatus are provided that make possible a method of handling wafers by contacting only a narrow area of not more than two millimeters wide adjacent the edge of the wafer, which is particularly useful for backside deposition where device side contact defines an area of exclusion that renders the wafer unusable in that area. The system provides a chuck on a wafer transfer arm that holds a wafer by gravity on a segmented, upwardly facing annular surface. A compatible annular surface is provided on an aligning station chuck so that wafers can be transferred by contact only with the exclusion area of the wafer surface. A load arm has two similarly compatible chucks further provided with pneumatically actuated grippers to allow the wafer to be loaded into a vertical processing apparatus.

Abstract: A method and apparatus for depositing a film by chemical vapor deposition comprises a showerhead for dispersing reactant gases into the processing space wherein the showerhead has a first space therein operable for receiving and dispersing the first reacting gas, and has a second space therein, generally isolated from the first space, and operable for receiving and dispersing the second reactant gas separate from the first gas dispersion for maintaining segregation of reactant gases and generally preventing premature mixture of the gases prior to their introduction into the processing space to prevent premature deposition in the system.

Abstract: A method and apparatus for depositing a film by chemical vapor deposition comprises a showerhead for dispersing reactant gases into the processing space wherein the showerhead has a first space therein operable for receiving and dispersing the first reacting gas, and has a second space therein, generally isolated from the first space, and operable for receiving and dispersing the second reactant gas separate from the first gas dispersion for maintaining segregation of reactant gases and generally preventing premature mixture of the gases prior to their introduction into the processing space to prevent premature deposition in the system.