Patents by Inventor Stanley Katsuyoshi Wakamiya
Stanley Katsuyoshi Wakamiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11693047Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.Type: GrantFiled: July 2, 2021Date of Patent: July 4, 2023Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Tessandra Anne Sage, Stanley Katsuyoshi Wakamiya, Jonathan Francis Van Dyke, Kevin Collao, Joshua P. Osborne
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Patent number: 11639957Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.Type: GrantFiled: July 2, 2021Date of Patent: May 2, 2023Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Kelsey McCusker, Stanley Katsuyoshi Wakamiya, Jonathan Shane Atienza, Jonathan Francis Van Dyke, Kevin Collao
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Publication number: 20230003791Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.Type: ApplicationFiled: July 2, 2021Publication date: January 5, 2023Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: KELSEY McCUSKER, STANLEY KATSUYOSHI WAKAMIYA, JONATHAN SHANE ATIENZA, JONATHAN FRANCIS VAN DYKE, KEVIN COLLAO
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Publication number: 20230003788Abstract: One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.Type: ApplicationFiled: July 2, 2021Publication date: January 5, 2023Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: TESSANDRA ANNE SAGE, STANLEY KATSUYOSHI WAKAMIYA, JONATHAN FRANCIS VAN DYKE, KEVIN COLLAO, JOSHUA P. OSBORNE
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Patent number: 10645845Abstract: An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.Type: GrantFiled: April 12, 2018Date of Patent: May 5, 2020Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Stanley Katsuyoshi Wakamiya, Elie K. Track, Steven Ward Van Sciver, Kelsey McCusker
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Publication number: 20190320557Abstract: An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.Type: ApplicationFiled: April 12, 2018Publication date: October 17, 2019Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, STANLEY KATSUYOSHI WAKAMIYA, ELIE K. TRACK, STEVEN WARD VAN SCIVER, KELSEY MCCUSKER
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Patent number: 10438867Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.Type: GrantFiled: March 8, 2018Date of Patent: October 8, 2019Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Leonard George Chorosinski, Harlan Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
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Publication number: 20190279916Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.Type: ApplicationFiled: March 8, 2018Publication date: September 12, 2019Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, HARLAN CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA, KEITH R. KIRKWOOD
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Patent number: 10342151Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.Type: GrantFiled: November 1, 2018Date of Patent: July 2, 2019Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya
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Publication number: 20190082551Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.Type: ApplicationFiled: November 1, 2018Publication date: March 14, 2019Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, H. CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA
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Patent number: 10159161Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.Type: GrantFiled: November 17, 2015Date of Patent: December 18, 2018Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya
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Patent number: 9681533Abstract: An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.Type: GrantFiled: November 17, 2015Date of Patent: June 13, 2017Assignee: Northrop Grumman Systems CorporationInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
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Publication number: 20170142820Abstract: An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.Type: ApplicationFiled: November 17, 2015Publication date: May 18, 2017Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, H. CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA, KEITH R. KIRKWOOD
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Publication number: 20170142836Abstract: A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.Type: ApplicationFiled: November 17, 2015Publication date: May 18, 2017Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
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Publication number: 20170142856Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.Type: ApplicationFiled: November 17, 2015Publication date: May 18, 2017Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, H. CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA
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Patent number: 9648749Abstract: A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.Type: GrantFiled: November 17, 2015Date of Patent: May 9, 2017Assignee: Northrop Grumman Systems CorporationInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
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Patent number: 7866936Abstract: A system and method for transferring mail between containers in an orderly and secure manner. The system and method utilize ejection rods to lift mail from an input tray into a transfer box assembly that deposits the mail into an output tray in an orderly, stable and secure manner, ensuring that mail is not shuffled or lost during the transfer process.Type: GrantFiled: May 1, 2007Date of Patent: January 11, 2011Assignee: Northrop Grumman Systems CorporationInventors: Karl Lewis Schuck, Jacob L. Timm, Stanley Katsuyoshi Wakamiya, Patrick Cowgill, Stephanie Lauretano Miskiewicz, Charles Stewart Shaw
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Publication number: 20080271971Abstract: A system and method for transferring mail between containers in an orderly and secure manner. The system and method utilize ejection rods to lift mail from an input tray into a transfer box assembly that deposits the mail into an output tray in an orderly, stable and secure manner, ensuring that mail is not shuffled or lost during the transfer process.Type: ApplicationFiled: May 1, 2007Publication date: November 6, 2008Applicant: Northrop Grumman Systems CorporationInventors: Karl Lewis Schuck, Jacob L. Timm, Stanley Katsuyoshi Wakamiya, Patrick Cowgill, Stephanie Lauretano Miskiewicz, Charles Stewart Shaw
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Patent number: 6950724Abstract: The mail sorting systems and methods of the invention can be used to provide a mail carrier with a batch of mail that is arranged in delivery point order and separated by delivery point. Advantageously, the systems and methods employ an expandable, transportable container having a number of expandable compartments. Each expandable compartment holds the mail for a single delivery point.Type: GrantFiled: October 31, 2003Date of Patent: September 27, 2005Assignee: Northrop Grumman CorporationInventors: Daryl Sunny Mileaf, Charles Stewart Shaw, Stanley Katsuyoshi Wakamiya