Abstract: A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is formed as a loop antenna array configured to transmit and receive RFID signals. Further, the RFID tag includes a first test pad and second test pad formed on the integrated circuit die with the first test pad coupled to a first end of the antenna by a first interconnect and a second test pad coupled to the second end of the antenna by a second interconnect.

Abstract: A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is configured to transmit and receive RFID signals. Further, the antenna and the interconnects of the circuitry are formed of a same metal, and fabricated using a same semiconductor process.

Abstract: A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is configured to transmit and receive RFID signals. Further, the antenna and the interconnects of the circuitry are formed of a same metal, and fabricated using a same semiconductor process.

Abstract: A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is configured to transmit and receive RFID signals. Further, the antenna and the interconnects of the circuitry are formed of a same metal, and fabricated using a same semiconductor process.

Abstract: An electronic device including a semiconductor die, which has a top surface that is configured to operate as a printed circuit board so as to provide connections for at least one passive component, in particular a passive surface mounted device (SMD).

Abstract: A control apparatus for controlling a three phase load apparatus. The control apparatus includes a voltage source inverter having a first pair of transistors, a second pair of transistors, and a third pair of transistors. Each such pair of transistors is connected serially between the terminals of a voltage source. The activation of a first transistor in each such pair of such transistors is effected by the application thereto of a first activation voltage, a second activation voltage and a third activation voltage, respectively, causing a first phase voltage, a second phase voltage and a third phase voltage, to be applied to a respective one of the three parts of the three-phase load apparatus. The selection and duration of activation of such first transistors during each of a continuing series of equal time periods T.sub.p is symmetrical about the mid-point of each of the time periods, and is represented by six non-zero vectors and two zero vectors.