Abstract: The present disclosure relates to a method for operating a multi-channel pipettor, comprising: creating an access plan having a plurality of transfer blocks, each comprising a source access and a destination access, wherein the creating includes: reading of position lists which contain the positions of all source and destination containers and assigning source containers to destination containers; performing a transfer analysis in which the source or destination accesses and the movements of the pipetting head and/or the container holders are determined by forming the difference between the current channel position and the source position or the destination position on the two-dimensional plane; and performing a transfer optimization, whereby the source or destination accesses and the movements of the pipetting head respectively required for the source or destination accesses are sorted into the transfer blocks; and operating the multi-channel pipettor on the basis of the created access plan.

Abstract: The present disclosure relates to a method for operating a multi-channel pipettor, comprising: creating an access plan having a plurality of transfer blocks, each comprising a source access and a destination access, wherein the creating includes: reading of position lists which contain the positions of all source and destination containers and assigning source containers to destination containers; performing a transfer analysis in which the source or destination accesses and the movements of the pipetting head and/or the container holders are determined by forming the difference between the current channel position and the source position or the destination position on the two-dimensional plane; and performing a transfer optimization, whereby the source or destination accesses and the movements of the pipetting head respectively required for the source or destination accesses are sorted into the transfer blocks; and operating the multi-channel pipettor on the basis of the created access plan.

Abstract: A thermoelectric module includes an inner circumferential surface, an axis and an outer circumferential surface. A plurality of semiconductor elements is disposed with thermoelectric material in the direction of the axis and between the inner circumferential surface and the outer circumferential surface and are electrically interconnected in an alternating manner. At least one part of the semiconductor elements has at least one inner frame part or an outer frame part. At least some of the inner frame parts form an interrupted inner circumferential surface or outer frame parts form an interrupted outer circumferential surface.

Abstract: A thermoelectric module includes an inner circumferential surface, an axis and an outer circumferential surface. A plurality of semiconductor elements is disposed with thermoelectric material in the direction of the axis and between the inner circumferential surface and the outer circumferential surface and are electrically interconnected in an alternating manner. At least one part of the semiconductor elements has at least one inner frame part or an outer frame part. At least some of the inner frame parts form an interrupted inner circumferential surface or outer frame parts form an interrupted outer circumferential surface.