Abstract: A device (16) and method for determining the wave height (H) of a solder wave (42) formed from liquid solder (41) and conveyed by a solder nozzle assembly (12) is provided. The device includes a resiliently flexible film body (18) for floating placement on the solder wave (42) and a measuring unit (38) for determining the position of the surface of the film body (18) floating on the solder wave relative to a reference point (39). The device has an evaluation unit (44) for determining the wave height (H) depending on the position of the film body (18). A wave soldering machine is also provided.

Abstract: The invention relates to a method for operating a soldering system for selective wave soldering comprising at least one solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump being designed to guide the liquid solder out from the solder reservoir through the solder nozzle for generating a standing wave from liquid solder.

Abstract: The invention relates to a method for operating a soldering system for selective wave soldering comprising at least one solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump being designed to guide the liquid solder out from the solder reservoir through the solder nozzle for generating a standing wave from liquid solder.

Abstract: The invention relates to a soldering device for removing solder pearls and/or solder balls from the lower face of a printed circuit board, in particular a soldering device for a soldering system for a selective wave soldering process, comprising a brush device for removing solder pearls and/or solder balls from the lower face of a printed circuit board. The brush device has a brush which can be driven about a drive axis and which is designed to remove the solder pearls and/or solder balls, wherein a moving device is provided, said brush device being arranged on the moving device such that the brush device can be moved relative to the printed circuit board in the direction of an X, Y, and Z axis.

Abstract: A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

Abstract: A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

Abstract: A cooling circuit for removing waste heat from a cooling device of an electromechanical converter is provided. The cooling circuit includes a chilling medium, a cooler for extracting heat from the chilling medium, a return connecting the cooling device of the converter to the cooler and conducts warm chilling medium, a feed connecting the cooler to the cooling device of the converter and conducts cool chilling medium, and an absorption chiller for extracting heat from the chilling medium. The absorption chiller is driven by the heat of the warm chilling medium that is in the return.

Abstract: A power plant including a turbine unit having a turbine, a generator connected to the turbine for power transmission, and a cooling device for cooling the generator is provided. The cooling device is provided to release waste heat from the generator to a device of the power plant. Waste heat may be used in the power plant process, thus attaining increased efficiency.