Abstract: A computer system having a plurality of virtual machines is provided. Each virtual machine in the computer system has an associated policy (rules) database and database (policy table) for storing rules and a database lookup associated with the policy database. One policy database/database lookup pair per virtual machine allows each virtual machine to have a different set of packet processing rules and security policies for handling the same key. In addition, the policy database associated with one virtual machine may be updated and the database lookup associated with the policy database re-generated independently without requiring any update of the policy database lookups associated with any of the other policy databases in the computer system.

Abstract: A method and system is provided whereby the environment of the container grown plant is controlled to replicate a natural environment. Since container grown plants are not in direct contact with the soil in the earth, a container grown plant can develop its own local electrical field and static charge that can hinder the development of the plant. A plant media grounding device is provided in which copper prongs fit into a housing that is connected to a power cord. The prongs are inserted at the plant's base in the growing media. The power cord is plugged into an outlet. The plant then becomes grounded to the earth ground of the building's power distribution system. In a further embodiment, the plant media grounding device may further include a variety of sensors in order to monitor the progress of the plant and the plant's environment.

Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a process of generating equalization data and a design structure for multilayer electronic structures is presented.

Abstract: A mobile storage and work cart is described that includes a reconfigurable frame, a plurality of casters extending from the reconfigurable frame and operable for moving the cart, and a work surface attached to the reconfigurable frame and forming a top of the cart. The reconfigurable frame is operable to adjust a height of the work surface.

Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into multilayer cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer structure and a method of manufacture are presented.

Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a process of generating equalization data and a design structure for multilayer electronic structures is presented.

Abstract: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer electronic structure and a method of manufacture is presented.

Abstract: A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace.

Abstract: A method and apparatus implement reduced noise coupling effects on single ended clocks, and a design structure on which the subject circuit resides is provided. A clock receiver includes a clock voltage reference that is generated from received clock peaks and valleys of a received input clock signal. The received clock peaks (VT) and the received clock valleys (VB) are continuously sampled. The clock voltage reference is set, for example, equal to an average of VT and VB; or ((VT+VB)/2).

Abstract: A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition (PVD) process. A solder mask is applied. Mechanically cleaning removes the sputtered copper coating in areas of the outer layer that are not protected by the solder mask.

Abstract: A method and structure are provided for implementing flexible circuits of various electronic packages and circuit applications. A meshed reference plane includes a variable mesh pitch arranged for control of mechanical flexibility. A dielectric core separates a signal layer from the variable pitch meshed reference plane. An electrically conductive coating covers the surface of the variable pitch meshed reference plane yielding substantially constant signal impedance for the signal layer.

Abstract: A mobile storage and work cart is described that includes a reconfigurable frame, a plurality of casters extending from the reconfigurable frame and operable for moving the cart, and a work surface attached to the reconfigurable frame and forming a top of the cart. The reconfigurable frame is operable to adjust a height of the work surface.

Abstract: In a virtualization system having a plurality of virtual machines, each virtual machine has an associated policy database and database lookup pair. With a policy database/database lookup pair per virtual machine, each virtual machine may utilize different accelerated flow classification policies, security policies and packet processing rules.

Abstract: A method and apparatus are provided for implementing automatic-calibration of a Time Domain Reflectometer (TDR) probing apparatus. A calibration procedure is performed automatically each time a TDR probe is moved from a device under test (DUT). A current calibration TDR waveform is obtained and compared with a reference calibration TDR waveform, checking for deviations between the current and reference measurements. If a deviation is detected, then the user is notified and calibration is failed.

Abstract: A method of providing content to be presented on a terminal, said method comprising: taking as an input a first document in a first document language, the first document language using markup tags to define elements of the document, said first document language including a first set of element types, translating the first document into a second document in a second document language, the second document language using markup tags, text or document codings to define elements of the second document, said second document language including a second set of element types, wherein the first set of element types includes a first element type, for which an equivalent element type is not present in said second set, and wherein the first document includes a section including said first element type and at least one attribute of the element type, the method comprising processing said first section in the first document, and generating a corresponding second section in said second document, said second section including

Abstract: A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition (PVD) process. A solder mask is applied. Mechanically cleaning removes the sputtered copper coating in areas of the outer layer that are not protected by the solder mask.

Abstract: A method and apparatus are provided for implementing characteristic impedance discontinuity reduction in customized high-speed flexible circuit applications. A curved artwork region is selected and selected cells are scanned. An area on opposite sides of a signal wire within each cell is determined. The identified areas are compared using a user defined delta value. If the compared areas differ greater than the user defined delta value, then a coordinate change is computed for moving the signal wire to reduce characteristic impedance discontinuity.

Abstract: A method and apparatus are provided for implementing automatic-calibration of a Time Domain Reflectometer (TDR) probing apparatus. A calibration procedure is performed automatically each time a TDR probe is moved from a device under test (DUT). A current calibration TDR waveform is obtained and compared with a reference calibration TDR waveform, checking for deviations between the current and reference measurements. If a deviation is detected, then the user is notified and calibration is failed.

Abstract: A method, apparatus and computer program product are provided for implementing high frequency return current paths utilizing decoupling capacitors within electronic packages. Electronic package physical design data are received for identifying a board layout. For each of a plurality of cells in a grid of a set cell size within the identified board layout, a respective number of signal vias are identified. A ratio of signal vias to return current paths is calculated for each of the plurality of cells. Each cell having a calculated ratio greater than a target ratio is identified. One or more decoupling capacitors are selectively added within each of the identified cells to provide high frequency return current paths.

Abstract: A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.