Patents by Inventor Stephen MARIANI

Stephen MARIANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9128679
    Abstract: According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable “D” interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: September 8, 2015
    Assignee: MERCURY COMPUTER SYSTEMS, INC.
    Inventors: Darryl J. McKenney, Daniel Toohey, Stephen Mariani, Michael Gust, Absu Methratta, Timothy Fleury, Steven Imperalli
  • Publication number: 20130058050
    Abstract: According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable “D” interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary embodiment, a circuit board having a depth-controlled interconnect slot is provided in conjunction with one or more solderable technology modules. The one or more solderable technology modules may include memory devices, power devices such as Point of Load Supplies (POLS), security devices and anti-tamper devices, capacitance devices, and other types of chips such as Field Programmable Gate Arrays (FPGAs). The solderable technology modules may be soldered into the slot to secure the modules in the slot and connect the modules to interconnects on the circuit board.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 7, 2013
    Applicant: MERCURY COMPUTER SYSTEMS, INC.
    Inventors: Darryl J. MCKENNEY, Daniel TOOHEY, Stephen MARIANI, Michael GUST, Absu METHRATTA, Timothy FLEURY, Steven IMPERALLI