Abstract: Disclosed herein include antibodies or fragments thereof having specificity to a sarbecovirus spike protein. Also provided are compositions, methods, and kits for using said antibodies or fragments thereof for preventing or treating, for example a coronavirus infection.

Abstract: In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

Abstract: In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

Abstract: A multi-layer film adhesive for reducing squeeze out in a bonded joint is provided. The multi-layer film adhesive has a first adhesive layer having a first chemical property. The multi-layer film adhesive further has a second adhesive layer having a second chemical property, wherein the second chemical property is different from the first chemical property. The multi-layer film adhesive further has a third adhesive layer having a third chemical property, wherein the third chemical property is different from the first and second chemical properties. The first adhesive layer, the second adhesive layer, and the third adhesive layer form the multi-layer film adhesive.

Abstract: In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

Abstract: For multidimensional transducer array interconnection, circuit boards with electronics are stacked to form a surface for connection with the array. The surface of the circuit boards for connecting with the transducer array is metalized and diced. Rather than relying on small exposed traces, larger contact pads are formed by metalizing the surface and then dicing the surface. This forms an array of contact pads for connecting with the z-axis or other connectors for elements of the multidimensional transducer array.

Abstract: A memory alloy is used during manufacture of a transducer. The memory of the alloy may correct for deviations or bending during manufacture, such as a superelastic alloy returning an array to a flat state after being twisted during handling. The memory of the alloy may cause a desired change in array geometry during manufacture, such as a shape memory alloy twisting an array into a curved or helix due to applied heat. The array may be fixed in place by the memory alloy or bonding after positioning by the memory alloy, preventing further substantial alteration.

Abstract: For multidimensional transducer array interconnection, circuit boards with electronics are stacked to form a surface for connection with the array. The surface of the circuit boards for connecting with the transducer array is metalized and diced. Rather than relying on small exposed traces, larger contact pads are formed by metalizing the surface and then dicing the surface. This forms an array of contact pads for connecting with the z-axis or other connectors for elements of the multidimensional transducer array.

Abstract: Sub-performing elements of an ultrasound transducer array are detected. The power, such as current, used by or provided to the transmit driver is measured. By driving each element or group of elements separately, defective elements or groups of elements are detected from the amount of power used.

Abstract: In order to position and simultaneously operate both a magnetic resonance (MR) coil and an ultrasound transducer adjacent to a target volume while minimizing interference between the MR coil and the ultrasound transducer, hybrid ultrasound and magnetic resonance imaging (MRI) devices are provided. One of the hybrid ultrasound and MRI devices includes a transducer array, a communications interface connected with the transducer array, and a housing that electromagnetically shields and encloses the transducer array and the communications interface. An electrically conducting side of the housing receives a radio frequency (RF) signal from an MRI system and transmits the RF signal to an electrically conducting side of a housing of another of the hybrid ultrasound and MRI devices.

Abstract: A multi-layer film adhesive for reducing squeeze out in a bonded joint is provided. The multi-layer film adhesive has a first adhesive layer having a first chemical property. The multi-layer film adhesive further has a second adhesive layer having a second chemical property, wherein the second chemical property is different from the first chemical property. The multi-layer film adhesive further has a third adhesive layer having a third chemical property, wherein the third chemical property is different from the first and second chemical properties. The first adhesive layer, the second adhesive layer, and the third adhesive layer form the multi-layer film adhesive.

Abstract: A memory alloy is used during manufacture of a transducer. The memory of the alloy may correct for deviations or bending during manufacture, such as a superelastic alloy returning an array to a flat state after being twisted during handling. The memory of the alloy may cause a desired change in array geometry during manufacture, such as a shape memory alloy twisting an array into a curved or helix due to applied heat. The array may be fixed in place by the memory alloy or bonding after positioning by the memory alloy, preventing further substantial alteration.

Abstract: An ultrasound imaging standoff has a stiffer portion for contact with a volume transducer and a flexible portion filled with viscous fluid for conforming to the patient, resulting in fewer or no air gaps. Pressure is applied through the standoff to cause the connective tissue to flatten, resulting in less shadowing artifact.

Abstract: A memory alloy is used during manufacture of a transducer. The memory of the alloy may correct for deviations or bending during manufacture, such as a superelastic alloy returning an array to a flat state after being twisted during handling. The memory of the alloy may cause a desired change in array geometry during manufacture, such as a shape memory alloy twisting an array into a curved or helix due to applied heat. The array may be fixed in place by the memory alloy or bonding after positioning by the memory alloy, preventing further substantial alteration.

Abstract: In order to position and simultaneously operate both a magnetic resonance (MR) coil and an ultrasound transducer adjacent to a target volume while minimizing interference between the MR coil and the ultrasound transducer, hybrid ultrasound and magnetic resonance imaging (MRI) devices are provided. One of the hybrid ultrasound and MRI devices includes a transducer array, a communications interface connected with the transducer array, and a housing that electromagnetically shields and encloses the transducer array and the communications interface. An electrically conducting side of the housing receives a radio frequency (RF) signal from an MRI system and transmits the RF signal to an electrically conducting side of a housing of another of the hybrid ultrasound and MRI devices.

Abstract: Sub-performing elements of an ultrasound transducer array are detected. The power, such as current, used by or provided to the transmit driver is measured. By driving each element or group of elements separately, defective elements or groups of elements are detected from the amount of power used.

Abstract: A method for examining integrity of cement in a wellbore includes deploying an ultrasound transducer within a wellbore. One or more reference ultrasound images of the cement within the wellbore are acquired. A pushing pulse is emitted from the ultrasound transducer to elicit a displacement of the cement within the wellbore. A sequence of ultrasound images is acquired, over time, depicting the displacement of the cement within the wellbore elicited by the pushing pulse. A strain tensor map is generated from a difference between the one or more reference ultrasound images and the acquired sequence of ultrasound images. A degree of integrity of the cement within the wellbore is determined based on the generated strain tensor map.

Abstract: High intensity ultrasound is used for pipeline obstruction remediation. Ultrasound transducers are positioned around an outside of the pipeline. The transducers transmit acoustic energy into the obstruction. The acoustic energy heats the obstruction at a location spaced away from the walls of the pipeline. As the obstruction heats, an opening may be formed in the obstruction, relieving pressure build-up without releasing the plug.

Abstract: Magnetic resonance imaging frame rate is increased using ultrasound information. Magnetic resonance (MR) images may be provided at an increased frame rate relative to the MR acquisition. For times between acquisition of MR data, MR data may be created. To account for any change in position of tissue over time, ultrasound is used to track the location of tissue or other imaged structure. The ultrasound-based location information is used to indicate the position of intensities or values of the created MR data. MR images at a higher frame rate than the MR acquisition are generated, but with accuracy of relative position based on the ultrasound data.

Abstract: A method for disrupting an obstruction from a wellbore includes determining a location of an obstruction within a wellbore. An ultrasound transducer is deployed down an interior of a casing in the wellbore. Ultrasound energy is focused, using the ultrasound transducer, to the determined location of the obstruction and the obstruction is disrupted using the focused ultrasound energy.