Abstract: A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such that corners of the body segments do not include the trapped air.

Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.

Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.

Abstract: A support member attached to a support surface is rotated about a threaded stud to change the distance between an object on the support member and the support surface. The support member is fixed relative to the stud when the desired distance is attained, and a nut is fastened onto the stud, thereby trapping the object between the nut and the support member, and fixing the distance between the object and the support surface.

Abstract: The disclosure involves a material handling machine, e.g., a crane, having a control circuit switch and a power limit switch. Disclosed is a new weight assembly having first and second weights. The control switch is maintained at a position by the first weight and the power switch is maintained at a position by the second weight which is positioned above the first weight. The weights are telescoped to one another so that vertical weight alignment is assured as the crane hoist bottom block contacts and lifts the first weight. If the bottom block continues its upward travel past a maximum desired elevation, the first weight (urged by the bottom block) lifts the second weight, permitting the power limit switch to trip and preventing the bottom block from continuing upward. And the new assembly is ideal where the space available for limit switch weights is restricted.