Patents by Inventor Su Jung JUNG

Su Jung JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210091163
    Abstract: A display device includes a substrate, a first conductive layer on the substrate, the first conductive layer including a data signal line, a first insulating layer on the first conductive layer, a semiconductor layer on the first insulating layer, the semiconductor layer including a first semiconductor pattern, a second insulating layer on the semiconductor layer, and a second conductive layer on the second insulating layer, the second conductive layer including a gate electrode disposed to overlap the first semiconductor pattern, a transistor first electrode disposed to overlap a part of the first semiconductor pattern, wherein the transistor first electrode is electrically connected to the data signal line through a contact hole that penetrates the first and second insulating layers, and a transistor second electrode disposed to overlap another part of the first semiconductor pattern.
    Type: Application
    Filed: June 4, 2020
    Publication date: March 25, 2021
    Applicant: Samsung Display Co., LTD.
    Inventors: Seung Sok SON, Woo Geun LEE, Seul Ki KIM, Kap Soo YOON, Hyun Woong BAEK, Jae Hyun LEE, Su Jung JUNG, Jung Kyoung CHO, Seung Ha CHOI, June Whan CHOI
  • Publication number: 20210036032
    Abstract: A display device includes pixel circuits disposed in a display area and a driving circuit disposed in the peripheral area. The driving circuit includes a first transistor and each pixel circuit includes a second transistor. The first transistor includes a first active pattern disposed on the substrate, a first gate insulation layer having a first outer portion disposed on the first active pattern, and a first gate electrode disposed on the first gate insulation layer. The second transistor includes a second active pattern disposed on the substrate, a second gate insulation layer having a second outer portion disposed on the second active pattern, and a second gate electrode disposed on the second gate insulation layer. The first outer portion doesn't overlap the first gate electrode and has a first width. The second outer portion doesn't overlap the second gate electrode and has a second width smaller than the first width.
    Type: Application
    Filed: June 9, 2020
    Publication date: February 4, 2021
    Inventors: KWANG SOO LEE, HYUN KIM, KAP SOO YOON, SU JUNG JUNG
  • Publication number: 20210036076
    Abstract: A display device includes a substrate having a display area and a pad area. A gate conductive layer disposed on the substrate includes a gate conductive metal layer and a gate capping layer. The gate conductive layer forms a gate electrode in the display area and a wire pad in the pad area that is exposed by a pad opening. An interlayer insulating film disposed on the gate conductive layer covers the gate electrode. A data conductive layer disposed on the interlayer insulating film in the display area includes source and drain electrodes. A passivation layer disposed on the data conductive layer covers the source and drain electrodes. A via layer is disposed on the passivation layer. A pixel electrode is disposed on the via layer. The pixel electrode is connected to the source electrode through a contact hole penetrating the via layer and the passivation layer.
    Type: Application
    Filed: June 8, 2020
    Publication date: February 4, 2021
    Inventors: Seul Ki KIM, Seung Sok SON, Kap Soo YOON, Woo Geun LEE, Su Jung JUNG, Seung Ha CHOI
  • Patent number: 10811583
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: October 20, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byung Mok Kim, Su Jung Jung, Yu Dong Kim, Gun Kyo Lee
  • Patent number: 10388841
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: August 20, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 10310340
    Abstract: A Liquid crystal display device and manufacturing method thereof are provided. According to an exemplary embodiment of the present disclosure, an LCD device includes: a first substrate including a display area and a non-display area disposed outside of the display area; a gate electrode disposed on the first substrate and including a first-layer gate electrode and a second-layer gate electrode disposed on the first-layer gate electrode; a pixel electrode disposed on the same layer as the first-layer gate electrode; a source electrode and a drain electrode disposed on the gate electrode to be spaced from each other; and a contact connecting the drain electrode and the pixel electrode and including a first-layer contact, which is disposed on the same layer as the pixel electrode, and a second-layer contact, which is disposed on the first-layer contact.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: June 4, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Keum Hee Lee, Man Jin Kim, Yu Jun Kim, Chang Yeol Lee, Su Jung Jung, Ji Young Jeong
  • Patent number: 10270021
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: April 23, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Gun Kyo Lee, Su Jung Jung, Yu Dong Kim, Byung Mok Kim
  • Publication number: 20190067544
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member.
    Type: Application
    Filed: October 31, 2018
    Publication date: February 28, 2019
    Inventors: Byung Mok KIM, Su Jung JUNG, Yu Dong KIM, Gun Kyo LEE
  • Publication number: 20180130934
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 10, 2018
    Inventors: Byung Mok KIM, Hiroshi KODAIRA, Su Jung JUNG, Bo Hee KANG, Young Jin NO, Yuichiro TANDA, Satoshi OZEKI
  • Patent number: 9893259
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: February 13, 2018
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 9812628
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: November 7, 2017
    Assignee: LG INNOTEK CO., LTD
    Inventors: Su Jung Jung, Byung Mok Kim, Young Jun Cho, Seo Yeon Kwon
  • Publication number: 20170205656
    Abstract: A Liquid crystal display device and manufacturing method thereof are provided. According to an exemplary embodiment of the present disclosure, an LCD device includes: a first substrate including a display area and a non-display area disposed outside of the display area; a gate electrode disposed on the first substrate and including a first-layer gate electrode and a second-layer gate electrode disposed on the first-layer gate electrode; a pixel electrode disposed on the same layer as the first-layer gate electrode; a source electrode and a drain electrode disposed on the gate electrode to be spaced from each other; and a contact connecting the drain electrode and the pixel electrode and including a first-layer contact, which is disposed on the same layer as the pixel electrode, and a second-layer contact, which is disposed on the first-layer contact.
    Type: Application
    Filed: January 4, 2017
    Publication date: July 20, 2017
    Inventors: Keum Hee LEE, Man Jin KIM, Yu Jun KIM, Chang Yeol LEE, Su Jung JUNG, Ji Young JEONG
  • Patent number: 9634215
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: April 25, 2017
    Assignee: LG Innotek Co., Ltd.
    Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon
  • Publication number: 20160133810
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.
    Type: Application
    Filed: December 29, 2015
    Publication date: May 12, 2016
    Inventors: Su Jung JUNG, Byung Mok KIM, Young Jun CHO, Seo Yeon KWON
  • Publication number: 20160043296
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Application
    Filed: October 16, 2015
    Publication date: February 11, 2016
    Inventors: Su Jung JUNG, Yon Tae MOON, Young Jun CHO, Son Kyo HWANG, Byung Mok KIM, Seo Yeon KWON
  • Patent number: 9257626
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: February 9, 2016
    Assignee: LG Innotek Co., Ltd.
    Inventors: Su Jung Jung, Byung Mok Kim, Young Jun Cho, Seo Yeon Kwon
  • Patent number: 9196814
    Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: November 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon
  • Publication number: 20150069445
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.
    Type: Application
    Filed: September 23, 2014
    Publication date: March 12, 2015
    Inventors: Su Jung JUNG, 8yung Mok KIM, Young Jun CHO, Seo Yean KWON
  • Patent number: 8899811
    Abstract: Disclosed is a light emitting device module, which includes a circuit board having at least two cavities, a reflective layer formed on a surface of each cavity, and a light emitting device package disposed in each cavity. The light emitting device package includes a package body and a light emitting device disposed on the package body, the light emitting device being electrically connected to a first lead frame and a second lead frame.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: December 2, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Su Jung Jung
  • Patent number: 8872414
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: October 28, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Su Jung Jung, Byung Mok Kim, Young Jun Cho, Seo Yeon Kwon