Abstract: A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler.

Abstract: A novel read head includes a substrate having a trailing face and a leading face opposite the trailing face. The substrate includes a first hole therethrough that extends continuously from the trailing face to the leading face. The read head also includes a read transducer disposed on the trailing face, and a first plurality of electrically conductive trailing connection pads disposed on the trailing face. A first insulative layer is disposed on an inner surface of the first hole. A first electrically conductive filler is disposed in the first hole but is insulated from the substrate by the first insulative layer. A first electrically conductive leading connection pad is disposed on the leading face and is electrically connected to the first conductive filler.