Patents by Inventor Suguru SAITO

Suguru SAITO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200049959
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Application
    Filed: July 10, 2019
    Publication date: February 13, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yusuke MORIYA, Masanori IWASAKI, Takashi OINOUE, Yoshiya HAGIMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Publication number: 20200035739
    Abstract: A semiconductor device including a device substrate and a readout circuit substrate. The device substrate includes a device region and a peripheral region. In the device region, a wiring layer and a first semiconductor layer including a compound semiconductor material are stacked. The peripheral region is disposed outside the device region. The readout circuit substrate faces the first semiconductor layer with the wiring layer in between, and is electrically coupled to the first semiconductor layer through the wiring layer. The peripheral region of the device substrate has a junction surface with the readout circuit substrate.
    Type: Application
    Filed: April 16, 2018
    Publication date: January 30, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Suguru SAITO, Nobutoshi FUJII, Ryosuke MATSUMOTO, Yoshifumi ZAIZEN, Shuji MANDA, Shunsuke MARUYAMA, Hideo SHIMIZU
  • Patent number: 10534162
    Abstract: Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. In particular, one or more air grooves formed in surfaces of the substrates reduces an influence of air inside a void portion between adjacent lenses of a layered lens structure.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: January 14, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Hirotaka Yoshioka, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Publication number: 20200014262
    Abstract: A rotor that includes a permanent magnet; and a rotor core that has a magnet placement hole in which the permanent magnet is disposed, wherein the stress relaxation magnetic flux suppression hole is formed such that a total width of a minimum width of a first magnetic flux passage between a portion of the stress relaxation magnetic flux suppression hole on a first side in the longitudinal direction and the magnet placement hole and a minimum width of a second magnetic flux passage between a portion of the stress relaxation magnetic flux suppression hole on a second side in the longitudinal direction and the magnet placement hole is less than a total length of a length of the first magnetic flux passage in the longitudinal direction and a length of the second magnetic flux passage in the longitudinal direction.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 9, 2020
    Applicants: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yukiyasu SUGIURA, Masayuki IKEMOTO, Naoto SAITO, Suguru GANGI, Shinya SANO
  • Publication number: 20200006415
    Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
    Type: Application
    Filed: September 9, 2019
    Publication date: January 2, 2020
    Applicant: Sony Corporation
    Inventors: Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Masanori IWASAKI, Toshihiko HAYASHI, Shuzo SATO, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Publication number: 20190378870
    Abstract: The present technology relates to an imaging device, an electronic apparatus, and a method of manufacturing an imaging device capable of thinning a semiconductor on a terminal extraction surface while maintaining a strength of a semiconductor chip. There is provided an imaging device including: a first substrate having a pixel region in which pixels are two-dimensionally arranged, the pixels performing photoelectric conversion of light; and a second substrate in which a through silicon via is formed, in which a dug portion is formed in a back surface of the second substrate opposite to an incident side of light of the second substrate, and a redistribution layer (RDL) connected to a back surface of the first substrate is formed in the dug portion. The present technology can be applied to, for example, a semiconductor package including a semiconductor chip.
    Type: Application
    Filed: February 8, 2018
    Publication date: December 12, 2019
    Inventors: SUGURU SAITO, NOBUTOSHI FUJII
  • Publication number: 20190369355
    Abstract: There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.
    Type: Application
    Filed: January 16, 2018
    Publication date: December 5, 2019
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Munekatsu FUKUYAMA, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Masanori IWASAKI, Toshihiko HAYASHI, Shuzo SATO, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Yusuke MORIYA, Minoru ISHIDA
  • Patent number: 10431618
    Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: October 1, 2019
    Assignee: Sony Corporation
    Inventors: Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Masanori Iwasaki, Toshihiko Hayashi, Shuzo Sato, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Patent number: 10379325
    Abstract: An optical system includes a negative lens satisfying the following conditional expressions: 30??d?40, 1.225?[nd?(14.387/?d)]?1.276, and 0.4300?[?gF?(2.9795/?d)]?0.5010, where ?d is an Abbe number of the negative lens, ?gF is a partial dispersion ratio of the negative lens at a g-line and an F-line, and nd is a refractive index of the negative lens at a d-line.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: August 13, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shunji Iwamoto, Shinichiro Saito, Satoshi Maetaki, Takahiro Hatada, Suguru Inoue
  • Patent number: 10379323
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: August 13, 2019
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke Moriya, Masanori Iwasaki, Takashi Oinoue, Yoshiya Hagimoto, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Patent number: 10353185
    Abstract: A conversion lens having a negative refractive power includes a positive lens GP. The positive lens GP satisfies all the following conditional expressions: 30??d?40, 1.225?[nd?(14.387/?d)]?1.276, and 0.4300?[?gF?(2.9795/?d)]?0.5010, where ?d is an Abbe number of the positive lens GP, ?gF is a partial dispersion ratio of the positive lens GP for g-line and F-line, and nd is a refractive index of the positive lens GP for d-line.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: July 16, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shunji Iwamoto, Shinichiro Saito, Satoshi Maetaki, Takahiro Hatada, Suguru Inoue
  • Publication number: 20190162939
    Abstract: An optical system is constituted of a first lens unit having a positive refractive power, a second lens unit having a positive refractive power and moving when focusing is performed, and a third lens unit which are arranged in this order from an object side to an image side, and distances between neighboring lens units are changed when focusing is performed. In the optical system, a back focus, arrangement of the second lens unit, and the like are appropriately set.
    Type: Application
    Filed: November 16, 2018
    Publication date: May 30, 2019
    Inventors: Shinichiro Saito, Makoto Nakahara, Suguru Inoue, Akira Mizuma, Masakazu Yamagishi
  • Publication number: 20190162932
    Abstract: An optical system includes a first lens unit having positive refractive power, a second lens unit, and a third lens unit having negative refractive power arranged in order from an object side to an image side. The second lens unit moves in focusing, thereby changing a distance between adjacent lens units. The first lens unit includes a positive lens, and the third lens unit includes a negative lens. A focal length of the positive lens, a focal length of the negative lens, a focal length of the third lens unit, and a back focus of the optical system are appropriately set.
    Type: Application
    Filed: November 15, 2018
    Publication date: May 30, 2019
    Inventors: Shinichiro Saito, Makoto Nakahara, Suguru Inoue, Akira Mizuma, Masakazu Yamagishi
  • Publication number: 20190155003
    Abstract: An optical system includes a first lens unit B1 having a positive refractive power, a second lens unit B2, and a third lens unit B3 disposed in order from an object side to an image side. The second lens unit B2 moves in focusing so that an interval between adjacent lens units among the first, second, and third lens units changes. The first lens unit B1 includes a positive lens G1p disposed closest to the object side and a negative lens G1n being a closest negative lens with respect to the object side. The optical system satisfies a predetermined condition.
    Type: Application
    Filed: November 1, 2018
    Publication date: May 23, 2019
    Inventors: Shinichiro Saito, Makoto Nakahara, Suguru Inoue, Akira Mizuma, Masakazu Yamagishi
  • Patent number: 10192924
    Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: January 29, 2019
    Assignee: Sony Corporation
    Inventors: Takeshi Yanagita, Suguru Saito, Kaoru Koike
  • Publication number: 20190004293
    Abstract: A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 3, 2019
    Inventors: Kunihiko HIKICHI, Koichi TAKEUCHI, Toshihiro KUROBE, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Publication number: 20180277587
    Abstract: An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light condensing section, the photodetection section including a photoelectric conversion element, the light condensing section condensing incident light toward the photodetection section, the first pixel and the second pixel being adjacent to each other and each having a step part on a photodetection surface of the photodetection section, in which at least a part of a wall surface of the step part is covered with a first light shielding section.
    Type: Application
    Filed: May 30, 2018
    Publication date: September 27, 2018
    Applicant: SONY CORPORATION
    Inventors: Takeshi YANAGITA, Suguru SAITO, Kaoru KOIKE
  • Publication number: 20180259749
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Application
    Filed: July 15, 2016
    Publication date: September 13, 2018
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke MORIYA, Masanori IWASAKI, Takashi OINOUE, Yoshiya HAGIMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Publication number: 20180246258
    Abstract: Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.
    Type: Application
    Filed: July 19, 2016
    Publication date: August 30, 2018
    Inventors: Toshiaki SHIRAIWA, Masaki OKAMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Minoru ISHIDA
  • Publication number: 20180217361
    Abstract: Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. In particular, one or more air grooves formed in surfaces of the substrates reduces an influence of air inside a void portion between adjacent lenses of a layered lens structure.
    Type: Application
    Filed: July 19, 2016
    Publication date: August 2, 2018
    Inventors: Hirotaka YOSHIOKA, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA