Patents by Inventor Sukhun YOO

Sukhun YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9876893
    Abstract: A mobile terminal and a mobile terminal audio signal processing system including the same are disclosed. The mobile terminal includes a first body including an opening, a main circuit board, and a main earphone jack, a first audio signal processing body including a first circuit board, on which a sub-sound module receiving a digital audio signal from the first body and converting the digital audio signal into an analog audio signal is mounted, and a sub-earphone jack outputting the analog audio signal, and a controller outputting a first audio signal to the sub-earphone jack and outputting a second audio signal to the main earphone jack. The first audio signal processing body is a first state where the first audio signal processing body is coupled with the opening, or a second state where the first audio signal processing body is separated from the first body.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: January 23, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Sukhun Yoo, Jongwon Seo, Seoungmyun Oh, Jonghwan Lee, Jihoon Kim, Minyong Jung
  • Publication number: 20170237845
    Abstract: A mobile terminal and a mobile terminal audio signal processing system including the same are disclosed. The mobile terminal includes a first body including an opening, a main circuit board, and a main earphone jack, a first audio signal processing body including a first circuit board, on which a sub-sound module receiving a digital audio signal from the first body and converting the digital audio signal into an analog audio signal is mounted, and a sub-earphone jack outputting the analog audio signal, and a controller outputting a first audio signal to the sub-earphone jack and outputting a second audio signal to the main earphone jack. The first audio signal processing body is a first state where the first audio signal processing body is coupled with the opening, or a second state where the first audio signal processing body is separated from the first body.
    Type: Application
    Filed: July 15, 2016
    Publication date: August 17, 2017
    Applicant: LG ELECTRONICS INC.
    Inventors: Sukhun YOO, Jongwon SEO, Seoungmyun OH, Jonghwan LEE, Jihoon KIM