Abstract: A flexible display panel of a display device includes a first side with a display unit, and a second side opposite to the first side. A bending guide includes an external guide that faces part of the first side and has a first curved side, and an internal guide that faces part of the second side and has a second curved side. A slider that slides on the bending guide is attached to one end portion of the flexible display panel. A radius of the first curved side is greater than a radius of the second curved side. When the slider moves toward the bending guide, the first side contacts the first curved side and is bent by the first curved side, and when the slider moves away from the bending guide, the second side contacts the second curved side and is bent by the second curved side.

Abstract: A display device according to an embodiment of the present inventive concept includes: a substrate that includes a main display portion and first side portions connected with the main display portion; scan lines and data lines that are disposed on the substrate; pixels that are connected with the scan lines and the data lines; data voltage transmission lines that are respectively connected with the data lines; connection wires that are connected with the data voltage transmission lines; sub-connection wires that are connected with the connection wires; and a driver that is connected with the sub-connection wires, wherein the order of alignment of the data line connected with the connection wires and the order of alignment of the sub-connection wires connected with the connection wires are the same.

Abstract: A display device includes a first display area and a second display area adjacent to the first display area in a first direction, driving elements, light-emitting elements including a pixel electrode electrically connected to a corresponding one of the driving elements, signal wirings that transfer a driving signal to the driving elements, and connection wirings that transfer a driving signal to signal wirings disposed in the second display area. At least one of the connection wirings includes a first signal-transferring portion extending in the first direction, a second signal-transferring portion extending in a second direction, and dummy portions extending in a direction intersecting the first and second signal-transferring portions. The pixel electrode overlaps a gap between dummy portions of adjacent connection wirings in an area where the connection wirings are disposed.

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

Abstract: An embodiment provides a lighting device comprising: a body having a first opening at a central part thereof; a light source member, which is disposed on the body and includes a circuit board having a plurality of light-emitting elements arranged thereon; and a cover disposed on the light source member and coupled to the body, wherein the circuit board comprises at least one second opening vertically overlapping the first opening and at least one first protrusion protruding toward the inside of the second opening from a side surface of the second opening, and at least one of the light-emitting elements is mounted on the first protrusion.

Abstract: The present invention relates to a quencher having a quenching effect on a fluorescent material exhibiting luminescence characteristics at an excited energy level, and various uses thereof.

Abstract: There is provided a sole for footwear with a bottom surface comprising: a primary surface and one or more positioning face, wherein: the one or more positioning faces are at an angle to the primary surface; engaging a ground with the primary surface causes a wearer of the footwear to take a natural stance; engaging the ground with the one or more positioning faces causes the wearer to take one or more athletic stances; and the wearer switches between the natural stance and the one or more athletic stances by shifting their weight.

Abstract: A display device includes a substrate, a light-emitting element layer disposed on the substrate, a first encapsulation layer and a second encapsulation layer which are disposed on the light-emitting element layer, and a buffer layer which covers the first encapsulation layer and the second encapsulation layer. The second encapsulation layer includes a first film, a second film disposed on the first film, and a third film disposed between the first film and the second film, and a side surface of the third film is disposed more inward than a side surface of the first film and a side surface of the second film.

Abstract: Provided is a display device. The display device has a display area and a non-display area disposed around the display area and includes pixels disposed in the display area; and an intra-pixel bending area disposed along a direction of each of the pixels.

Abstract: A display device includes a pixel including a first electrode, an emission layer, and a second electrode, a buffer layer disposed on the pixel, a first insulating pattern disposed on the buffer layer, and a second insulating pattern disposed on the first insulating pattern and having an island shape. The pixel, the buffer layer, the first insulating pattern, and the second insulating pattern are disposed in a thickness direction, and the second insulating pattern overlaps the pixel in the thickness direction.

Abstract: A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

Abstract: A display device including a substrate including a display area and a non-display area, a plurality of signal lines disposed in the display area and extending along a first direction and from the non-display area to the display area, a connection line extending from the non-display area and electrically connected to a respective signal line of the plurality of signal lines in the non-display area, and an initialization voltage line extending in a second direction intersecting the first direction, wherein the connection line overlaps the initialization voltage line in a thickness direction of the display device.

Abstract: An embodiment provides a lighting device comprising: a body having a first opening at a central part thereof; a light source member, which is disposed on the body and includes a circuit board having a plurality of light-emitting elements arranged thereon; and a cover disposed on the light source member and coupled to the body, wherein the circuit board comprises at least one second opening vertically overlapping the first opening and at least one first protrusion protruding toward the inside of the second opening from a side surface of the second opening, and at least one of the light-emitting elements is mounted on the first protrusion.

Abstract: An assembly unit includes side plate having first coupling member on first side, second coupling member on second side, and third coupling member on each of third and fourth sides, top plate including fourth coupling member and top stud, and bottom plate including fifth coupling member and bottom stud. The first coupling member is engaged with the second coupling member of neighboring side plate. The fourth coupling member is engaged with the third coupling member. The fifth coupling member is engaged with the third coupling member. The first coupling member includes protrusion. The second coupling member includes groove. The protrusion is fitted into the groove of the neighboring side plate. The third coupling member includes thread. Each of the fourth and fifth coupling members includes thread. The fourth and fifth coupling members are engaged with the third coupling member in a screwed manner using the threads.

Abstract: A display device including a display area and a non-display area, a substrate including a through hole in the display area, an element layer including an anode disposed on the substrate, a light emitting layer disposed on the anode, and a cathode disposed on the light emitting layer, and a thin-film encapsulation layer including a first inorganic layer disposed on the element layer, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer, in which the first inorganic layer includes a plurality of first refractors having a first inclination angle.

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

Abstract: An assembly unit includes side plate having first coupling member on first side, second coupling member on second side, and third coupling member on each of third and fourth sides, top plate including fourth coupling member and top stud, and bottom plate including fifth coupling member and bottom stud. The first coupling member is engaged with the second coupling member of neighboring side plate. The fourth coupling member is engaged with the third coupling member. The fifth coupling member is engaged with the third coupling member. The first coupling member includes protrusion. The second coupling member includes groove. The protrusion is fitted into the groove of the neighboring side plate. The third coupling member includes thread. Each of the fourth and fifth coupling members includes thread. The fourth and fifth coupling members are engaged with the third coupling member in a screwed manner using the threads.

Abstract: A display device includes a flat area, and a first bending area at which the display device is bendable, the first bending area including in order in a direction away from the flat area, a first upper bending portion, a first extending portion, and a first lower bending portion, a light-emitting element including an emission layer in the flat area and in the first upper bending portion and with which an image is displayable in both the flat area and the first upper bending portion, and an inorganic layer in the flat area and the in the first bending area. A thickness of the inorganic layer in each of the first upper bending portion, the first extending portion and the first lower bending portion of the first bending area is smaller than a thickness of the inorganic layer in the flat area.

Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.