Patents by Inventor Sung Bae Moon

Sung Bae Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200274217
    Abstract: The present invention relates to a phase shifter comprising a DGS and a radio communication module comprising the same. The phase shifter comprises: a first substrate; a microstrip formed on the first substrate so as to extend in a first direction; a ground layer disposed with a space on the upper surface of the microstrip and having a defected ground structure (DGS) with a defected pattern formed therein; a second substrate disposed on the ground layer; and a liquid crystal layer disposed in a space between the first substrate and the second substrate, wherein DC voltage is applied between the ground layer and the microstrip.
    Type: Application
    Filed: October 23, 2018
    Publication date: August 27, 2020
    Applicants: LG Display Co., Ltd., UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY
    Inventors: Byungwook MIN, Hoon Bae KIM, Sung-Eun KIM, Jeong Min MOON, Su Seok CHOI, Sungpil RYU, Jihwan JUNG, Kiseok CHANG
  • Patent number: 9974172
    Abstract: An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: May 15, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Hae Yeon Kim, Sung Bae Moon, Jae Man Park, Jeung Ook Park, Jong Heum Yoon, In Hee Cho
  • Patent number: 9812618
    Abstract: An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: November 7, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jaehun Jeong, Sung Bae Moon, Sang In Yoon, Mi Jin Lee, Yuwon Lee
  • Patent number: 9357630
    Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: May 31, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Bae Moon, Jae Man Park, Jong Heum Yoon, Hae Yeon Kim, In Hee Cho
  • Publication number: 20160005937
    Abstract: An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.
    Type: Application
    Filed: February 10, 2014
    Publication date: January 7, 2016
    Inventors: Jaehun Jeong, Sung Bae Moon, Sang In Yoon, Mi Jin Lee, Yuwon Lee
  • Patent number: 9048402
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and a silicon-containing alicyclic epoxy resin.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: June 2, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Bae Moon, Sang In Yoon, Jae Hun Jeong, Min Young Kim
  • Patent number: 9024347
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: May 5, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Bae Moon, Jae Hun Jeong, Sang In Yoon
  • Publication number: 20140318835
    Abstract: An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
    Type: Application
    Filed: August 30, 2012
    Publication date: October 30, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Hae Yeon Kim, Sung Bae Moon, Jae Man Park, Jeung Ook Park, Jong Heum Yoon, In Hee Cho
  • Publication number: 20140318839
    Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
    Type: Application
    Filed: July 27, 2012
    Publication date: October 30, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Bae Moon, Jae Man Park, Jong Heum Yoon, Hae Yeon Kim, In Hee Cho
  • Publication number: 20140290986
    Abstract: An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
    Type: Application
    Filed: July 12, 2012
    Publication date: October 2, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Eun Jin Kim, Hae Yeon Kim, Sung Bae Moon, Jae Man Park, Jeung Ook Park, Hyun Gyu Park, Jong Heum Yoon, In Hee Cho, Jin Hwan Kim, Thanh Kieu Giang
  • Publication number: 20140290996
    Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
    Type: Application
    Filed: July 12, 2012
    Publication date: October 2, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Bae Moon, Hae Yeon Kim, Jae Man Park, Jong Heum Yoon, In Hee Cho
  • Publication number: 20130320379
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: Sung Bae MOON, Jae Hun JEONG, Sang In YOON
  • Publication number: 20130320393
    Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Inventors: Sung Bae MOON, Sang In YOON, Jae Hun JEONG, Min Young KIM
  • Patent number: 8575234
    Abstract: An ink composition, and a method of forming a pattern, a color filter and a method of manufacturing the color filter using the same. The ink composition includes a binder resin, a multifunctional monomer having an ethylenic unsaturated double bond, a coloring agent, a polymerization initiator containing a certain positive ion and a solvent. Therefore, the composition has excellent coating property and chemical resistance and also an improved adhesion to a printing member, and thus the ink composition may be useful in forming a precise micropattern using a roll printing method, particularly a reversed printing method.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: November 5, 2013
    Assignees: Samsung Display Co., Ltd., Dongwoo Fine-Chem Co., Ltd.
    Inventors: Seung-Jun Lee, Gug Rae Jo, Jae Hyuk Chang, Hyun-Seok Kim, Sung Hee Lee, Sang-Tae Kim, Yong Seok Choi, Sung Bae Moon, In Kak Song, Seung-Yong Lee
  • Publication number: 20120058273
    Abstract: An ink composition, and a method of forming a pattern, a color filter and a method of manufacturing the color filter using the same. The ink composition includes a binder resin, a multifunctional monomer having an ethylenic unsaturated double bond, a coloring agent, a polymerization initiator containing a certain positive ion and a solvent. Therefore, the composition has excellent coating property and chemical resistance and also an improved adhesion to a printing member, and thus the ink composition may be useful in forming a precise micropattern using a roll printing method, particularly a reversed printing method.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 8, 2012
    Applicants: DONGWOO FINE-CHEM CO., LTD., Samsung Electronics Co., Ltd.
    Inventors: Seung-Jun LEE, Gug Rae JO, Jae-Hyuk CHANG, Hyun-Seok KIM, Sung Hee LEE, Sang-Tae KIM, Yong Seok CHOI, Sung Bae MOON, In Kak SONG, Seung-Yong LEE
  • Patent number: 7058037
    Abstract: Disclosed is an RF transmitting device of a mobile radio communication base station system in a CDMA system capable of digital-modulating baseband signals which are converted into band spread signals by using the same path which three frequency assignment frequency signals have for an RF in a multi-carrier mobile radio communication system supporting three frequency assignment, digital-coupling the modulated signals, and up-converting the digital-coupled signal into an IF signal and an RF signal in a sequential order, thereby transmitting the up-converted signal.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: June 6, 2006
    Assignee: UTStarcom, Inc.
    Inventor: Sung Bae Moon
  • Patent number: 6625465
    Abstract: A backward closed loop power control apparatus for a mobile communication system is disclosed.
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: September 23, 2003
    Assignee: Hyundai Electronics Industries Co., Inc.
    Inventors: Sung Bae Moon, Jeong Ho Oh