Abstract: A super-steep switching device and an inverter device using the same are disclosed. The super-steep switching device includes a semiconductor channel disposed on a substrate and made of a semiconductor material having impact ionization characteristic; a source electrode and a drain electrode in contact with the semiconductor channel, wherein the source electrode and the drain electrode are disposed on the substrate and are spaced apart from each other; and a gate electrode disposed on the semiconductor channel so as to overlap only a portion of the semiconductor channel, wherein a top surface of the semiconductor channel includes a first area overlapping the gate electrode, and a second area non-overlapping the gate electrode, wherein a ratio of a length of the first area and a length of the second area is in a range of 1:0.1 to 0.4.

Abstract: A filtering panel includes a molding layer part; a pattern layer part having an incident surface through which light emitted from a light source and viewing light transmitted to an observer enter, and an accommodation surface which is the reverse surface of the incident surface, wherein the molding layer part is stacked on the incident surface so as to be adjacent thereto, and the pattern layer part adjusts the optical paths of the emitted light and the viewing light; and a filtering layer part formed on a lower incident surface of the pattern layer part having the incident surface of the viewing light that enters from a lower region below a horizontal reference line, wherein the reflectivity of the visible light in the viewing light incident on the lower region is made greater than that of an upper region above the reference line by means of mirror reflection.

Abstract: Provided is a method for generating MRI data including applying, by an MRI computing device, an RF excitation pulse, and completing, by the MRI computing device, a K-space by acquiring a plurality of phase encoding line groups, in a state in which any other RF excitation pulse is not applied after applying the RF excitation pulse, in which each of the plurality of phase encoding line groups includes a plurality of phase encoding lines, and an absolute value of an average phase encoding size of a phase encoding line group acquired earlier is not greater than an absolute value of an average phase encoding size of a phase encoding line group acquired later, among the plurality of phase encoding line groups.

Abstract: Provided is a method for generating Mill data including applying, by an Mill computing device, an RF excitation pulse, and completing, by the MM computing device, a K-space by acquiring a plurality of phase encoding line groups, in a state in which any other RF excitation pulse is not applied after applying the RF excitation pulse, in which each of the plurality of phase encoding line groups includes a plurality of phase encoding lines, and an absolute value of an average phase encoding size of a phase encoding line group acquired earlier is not greater than an absolute value of an average phase encoding size of a phase encoding line group acquired later, among the plurality of phase encoding line groups.

Abstract: The present invention relates to a method for acquiring data for acquiring an arteriogram and a venogram of magnetic resonance imaging, the method: using one or more echo; and simultaneously acquiring, through one-time photography, an arteriogram and a venogram, which are optimized according to the number of slabs or improving connectivity of a slab boundary part of the arteriogram.

Abstract: Disclosed are a method of detecting a neuron resonance signal and an MRI signal processing apparatus. The method of detecting a neuron resonance signal includes acquiring a plurality of different digital sequences respectively corresponding to a plurality of different repetition periods by sampling a magnetic resonance signal of a neuron resonance signal according to each of the plurality of different repetition periods and calculating correlation between the plurality of different digital sequences in a frequency band based on the plurality of different digital sequences.

Abstract: Provided is an MRI image generation method including: acquiring first phase encoding lines obtained by undersampling along a first direction using an MRI device; acquiring second phase encoding lines obtained by undersampling in a second direction different from the first direction using the MRI device; generating a first MRI image based on the first phase encoding lines and the second phase encoding lines; and generating a second MRI image different from the first MRI image based on the first phase encoding lines and the second phase encoding lines.

Abstract: The present invention relates to a method for acquiring data for acquiring an arteriogram and a venogram of magnetic resonance imaging, the method: using one or more echo; and simultaneously acquiring, through one-time photography, an arteriogram and a venogram, which are optimized according to the number of slabs or improving connectivity of a slab boundary part of the arteriogram.

Abstract: Provided is an MRI image generation method including: acquiring first phase encoding lines obtained by undersampling along a first direction using an MRI device; acquiring second phase encoding lines obtained by undersampling in a second direction different from the first direction using the MRI device; generating a first MRI image based on the first phase encoding lines and the second phase encoding lines; and generating a second MRI image different from the first MRI image based on the first phase encoding lines and the second phase encoding lines.

Abstract: The present disclosure provides a neuronal resonance-magnetic resonance imaging (NR-MRI) method and technology for measuring a difference between a resting state and a state of providing external stimuli with respect to various frequency bands by using the NR-MRI scheme through frequency band selection filter characteristic mapping of neurons. In addition, the present disclosure provides technology for revealing a frequency selective communication mechanism between brain regions on the basis of systems biology researches for the frequency selective communication mechanism between the brain regions as well as technology useful for completing proof-of-concept and a frequency selective communication map between the entire brain regions.

Abstract: Disclosed are a method of detecting a neuron resonance signal and an MRI signal processing apparatus. The method of detecting a neuron resonance signal includes acquiring a plurality of different digital sequences respectively corresponding to a plurality of different repetition periods by sampling a magnetic resonance signal of a neuron resonance signal according to each of the plurality of different repetition periods and calculating correlation between the plurality of different digital sequences in a frequency band based on the plurality of different digital sequences.

Abstract: The present disclosure provides a neuronal resonance-magnetic resonance imaging (NR-MRI) method and technology for measuring a difference between a resting stale and a state of providing external stimuli with respect to various frequency bands by using the NR-MRI scheme through frequency band selection filter characteristic mapping of neurons. In addition, the present disclosure provides technology for revealing a frequency selective communication mechanism between brain regions on the basis of systems biology researches for the frequency selective communication mechanism between the brain regions as well as technology useful for completing proof-of-concept and a frequency selective communication map between the entire brain regions.

Abstract: A dual-echo sequence technique provided herein empowers simultaneous acquisition of both TOF MRA and BOLD MRV in a single MR acquisition. By this approach, an echo-specific K-space ordering scheme permits the adjustment of the scan parameters that are compatible for each of the MRA and MRV. The image quality in the MRA and MRV acquired by this compatible dual-echo arteriovenography (CODEA) technique is comparable to that for conventional, single-echo MRA and MRV. When the technique is integrated with MOTSA, seamless vascular connectivity is achieved in both MRA and MRV over a large area of brain anatomy. The technique will facilitate routine clinical acquisition and application of dual-echo MRA and MRV, as both MRA and MRV can be acquired with minimal impact on the image quality and without adversely affecting the scan throughput.

Abstract: A dual-echo sequence technique provided herein empowers simultaneous acquisition of both TOF MRA and BOLD MRV in a single MR acquisition. By this approach, an echo-specific K-space ordering scheme permits the adjustment of the scan parameters that are compatible for each of the MRA and MRV. The image quality in the MRA and MRV acquired by this compatible dual-echo arteriovenography (CODEA) technique is comparable to that for conventional, single-echo MRA and MRV. When the technique is integrated with MOTSA, seamless vascular connectivity is achieved in both MRA and MRV over a large area of brain anatomy. The technique will facilitate routine clinical acquisition and application of dual-echo MRA and MRV, as both MRA and MRV can be acquired with minimal impact on the image quality and without adversely affecting the scan throughput.

Abstract: In an embodiment of a method of inspecting a substrate, the substrate on which minute structures are formed is divided into a plurality of inspection regions. A main inspection region among the inspection regions is selected. A main image of the main inspection region and sub-images of sub-inspection regions adjacent to the main inspection region are obtained. An average image of the main image and the sub-images is obtained. The average image is then compared with the main image to detect defects in the main inspection region. Gray levels may be used. The average image may have improved quality so that the defects in the selected inspection region may be rapidly and accurately detected. This process has an improved reliability. Further, the number of inspecting processes for the substrate may be reduced. And a line for the inspection process may be automated so that a worker-free line may be established.

Abstract: In an embodiment, a method of scanning a substrate, and a method and an apparatus for analyzing crystal characteristics are disclosed. A sequential scan on the scan areas using a first electron beam and a second electron beam are repeatedly performed. The electrons accumulated in the scan areas by the first electron beam are removed from the scan areas by the second electron beam. When a size of the scan area is substantially the same as a spot size of the first electron beam, adjacent scan areas partially overlap each other. When each of the scan areas is larger than a spot size of the first electron beam, the adjacent scan areas do not overlap each other. Images of the scan areas are generated using back-scattered electrons emitted from each of the scan areas by irradiating the first electron beam to analyze crystal characteristics of circuit patterns on the substrate.

Abstract: In the methods of compensating for an alignment error during fabrication of structures on semiconductor substrates, a conductive pattern structure is formed at a first position on a first semiconductor substrate. The conductive pattern structure includes a grid of first and second conductive patterns arranged as columns and intersecting rows with openings bounded therebetween. A first conductive contact structure overlaps the conductive pattern structure, and includes a plurality of spaced apart conductive contacts arranged as a grid of rows and columns that can be tilted at a non-zero angle relative to the grid of the conductive pattern structure. A determination is made as to whether the first conductive contact structure is electrically connected to the conductive pattern structure.

Abstract: In the methods of compensating for an alignment error during fabrication of structures on semiconductor substrates, a conductive pattern structure is formed at a first position on a first semiconductor substrate. The conductive pattern structure includes a grid of first and second conductive patterns arranged as columns and intersecting rows with openings bounded therebetween. A first conductive contact structure overlaps the conductive pattern structure, and includes a plurality of spaced apart conductive contacts arranged as a grid of rows and columns that can be tilted at a non-zero angle relative to the grid of the conductive pattern structure. A determination is made as to whether the first conductive contact structure is electrically connected to the conductive pattern structure.

Abstract: In an embodiment, a method of scanning a substrate, and a method and an apparatus for analyzing crystal characteristics are disclosed. A sequential scan on the scan areas using a first electron beam and a second electron beam are repeatedly performed. The electrons accumulated in the scan areas by the first electron beam are removed from the scan areas by the second electron beam. When a size of the scan area is substantially the same as a spot size of the first electron beam, adjacent scan areas partially overlap each other. When each of the scan areas is larger than a spot size of the first electron beam, the adjacent scan areas do not overlap each other. Images of the scan areas are generated using back-scattered electrons emitted from each of the scan areas by irradiating the first electron beam to analyze crystal characteristics of circuit patterns on the substrate.

Abstract: In an embodiment of a method of inspecting a substrate, the substrate on which minute structures are formed is divided into a plurality of inspection regions. A main inspection region among the inspection regions is selected. A main image of the main inspection region and sub-images of sub-inspection regions adjacent to the main inspection region are obtained. An average image of the main image and the sub-images is obtained. The average image is then compared with the main image to detect defects in the main inspection region. Gray levels may be used. The average image may have improved quality so that the defects in the selected inspection region may be rapidly and accurately detected. This process has an improved reliability. Further, the number of inspecting processes for the substrate may be reduced. And a line for the inspection process may be automated so that a worker-free line may be established.