Patents by Inventor Sung-Hyung Lee

Sung-Hyung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127710
    Abstract: Disclosed are a system and method for automatically evaluating an essay. The system includes a structure analysis module configured to divide learning data and learner essay text in a predetermined structure analysis unit, generate structure tagging information for each structure analysis unit, and structure the learning data and the learner essay text by attaching the structure tagging information to the learning data and the learner essay text, a learning module configured to generate an essay evaluation model through learning by using essay text that is included in the structured learning data and the structure tagging information as an input value and using an evaluation score that is included in the structured learning data as a label, and an evaluation module configured to generate essay evaluation results using the essay evaluation model.
    Type: Application
    Filed: April 18, 2023
    Publication date: April 18, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Minsoo CHO, Oh Woog KWON, Yoon-Hyung ROH, Ki Young LEE, Yo Han LEE, Sung Kwon CHOI, Jinxia HUANG
  • Publication number: 20240120343
    Abstract: A thin film transistor array substrate including a substrate including an active area and a non-active area, and a first thin film transistor disposed on the substrate while including a first oxide semiconductor pattern, a first gate electrode overlapping with the first oxide semiconductor pattern, a first gate insulating layer interposed between the first oxide semiconductor pattern and the first gate electrode, a first source electrode and a first drain electrode disposed on and connected to the first oxide semiconductor pattern, and a first light shielding pattern disposed under the first oxide semiconductor pattern and electrically connected to one of the first source electrode and the first drain electrodes. The first gate electrode includes a first portion maintaining a first parasitic capacitance and a second portion maintaining a second parasitic capacitance smaller than the first parasitic capacitance, together with the first oxide semiconductor pattern.
    Type: Application
    Filed: August 8, 2023
    Publication date: April 11, 2024
    Applicant: LG Display Co., Ltd.
    Inventors: Hong Rak CHOI, Do Hyung LEE, Young Hyun KO, Chan Yong JEONG, Sung Ju CHOI
  • Patent number: 11948752
    Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyung Kang, Jong Hyun Cho, Ji Hong Jo, Hang Kyu Cho, Jae Shik Shim, Yong In Kim, Sang Roc Lee
  • Patent number: 11945880
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: April 2, 2024
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Publication number: 20240107770
    Abstract: A semiconductor memory device includes; a first stacked structure including a first staircase portion, a second stacked structure on the first stacked structure and including a second staircase portion overlapping the first staircase portion, a first contact plug penetrating the first stacked structure and the second stacked structure, electrically connected to the first stacked structure and not electrically connected to the second stacked structure, and a second contact plug penetrating the first stacked structure and the second stacked structure, electrically connected to the second stacked structure and not electrically connected to the first stacked structure.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Inventors: So Hyeon Lee, Sung Su Moon, Jae Duk Lee, Ik-Hyung Joo
  • Patent number: 11935984
    Abstract: A quantum dot including a core that includes a first semiconductor nanocrystal including zinc and selenium, and optionally sulfur and/or tellurium, and a shell that includes a second semiconductor nanocrystal including zinc, and at least one of sulfur or selenium is disclosed. The quantum dot has an average particle diameter of greater than or equal to about 13 nm, an emission peak wavelength in a range of about 440 nm to about 470 nm, and a full width at half maximum (FWHM) of an emission wavelength of less than about 25 nm. A method for preparing the quantum dot, a quantum dot-polymer composite including the quantum dot, and an electronic device including the quantum dot is also disclosed.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Seok Han, Sung Woo Kim, Jin A Kim, Tae Hyung Kim, Kun Su Park, Yuho Won, Jeong Hee Lee, Eun Joo Jang, Hyo Sook Jang
  • Publication number: 20240069475
    Abstract: A fuser includes a pressure roller to rotate, a heating belt to form a fixing nip with the pressure roller; and bushings at each end of the heating belt, respectively, to support the heating belt. Each of the bushings includes a side wall outside the each end of the heating belt, and a support member in a direction toward the heating belt with respect to the side wall to support an inner surface of the heating belt, where the support member includes a protruding region downwardly inclined in a direction toward the side wall.
    Type: Application
    Filed: March 9, 2021
    Publication date: February 29, 2024
    Inventors: Sun Hyung LEE, Sea Chul BAE, Sung Woo KANG
  • Patent number: 11859011
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: January 2, 2024
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Publication number: 20230365717
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 16, 2023
    Inventors: Matthew Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Patent number: 11739144
    Abstract: Provided herein are novel CLDN6 binding domains, and anti-CLDN6×anti-CD3 antibodies that include such CLDN6 binding domains. Also provided herein are methods of using such antibodies for the treatment of CLDN6-associated cancers.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: August 29, 2023
    Assignee: Xencor, Inc.
    Inventors: Matthew S. Faber, Sung-Hyung Lee, Yoon Kyung Kim, Jing Qi, Kendra N. Avery, Seung Y. Chu, Alex Nisthal, Matthew J. Bernett, John R. Desjarlais, Chad Borchert
  • Patent number: 11723200
    Abstract: A semiconductor device includes a first substrate including a cell region and surrounded by an extension region, a common source plate on the first substrate, a supporter on the common source plate, a first stack structure on the supporter and including an alternately stacked first insulating film and first gate electrode, a channel hole penetrating the first stack structure, the supporter, and the common source plate on the cell region, and an electrode isolation trench spaced apart from the channel hole in a first direction on the cell region, extending in a second direction, and penetrating the first stack structure, the supporter, and the common source plate, wherein a first thickness of the supporter in a first region adjacent to the electrode isolation trench is greater than a second thickness of the supporter in a second region formed between the electrode isolation trench and the channel hole.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Min Kim, Jin Hyuk Kim, Jung Tae Sung, Joong Shik Shin, Sung Hyung Lee
  • Publication number: 20230227581
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind Ectonucleotide pyrophosphatase/phosphodiesterase family member 3 (ENPP3).
    Type: Application
    Filed: August 3, 2022
    Publication date: July 20, 2023
    Inventors: Rumana Rashid, Umesh S. Muchhal, Gregory Moore, Alex Nishtal, Seung Chu, Sung-Hyung Lee, Yoon Kyung Kim
  • Patent number: 11673972
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: June 13, 2023
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Publication number: 20230146665
    Abstract: Provided herein are IL18-Fc fusion proteins that include an empty-Fc domain and an IL18 protein connected to another Fc domain. Also provided herein are additional are IL18-Fc fusion proteins such as IL18 x Fab-Fc fusion proteins that include a first monomer containing an IL18 protein connected to a first Fc domain, a second monomer containing a variable heavy chain connected to a second Fc domain, and a variable light chain, such that the variable heavy and light chains form an empty Fab. Various variant IL18 proteins with modifications to reduce heterogeneity and/or reduce affinity/potency and/or improve stability and/or improve production yield are also described.
    Type: Application
    Filed: July 26, 2022
    Publication date: May 11, 2023
    Inventors: Alex Nisthal, John Desjarlais, Gregory Moore, Sung-Hyung Lee
  • Publication number: 20230086017
    Abstract: Provided herein are trispecific antibodies that include a) a first monomer, b) a second monomer, and c) a light chain. The first monomer includes a first variant Fc domain and a variable heavy domain, the second monomer includes a second variant Fc domain and a first scFv domain and the light chain includes a variable light domain. The variable heavy domain and the variable light domain form an antigen binding domain. The trispecific antibody further includes a second scFv domain on either the first or second monomers.
    Type: Application
    Filed: July 22, 2022
    Publication date: March 23, 2023
    Inventors: Gregory Moore, John Desjarlais, Seung Chu, Sung-Hyung Lee
  • Patent number: 11472890
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind Ectonucleotide pyrophosphatase/phosphodiesterase family member 3 (ENPP3).
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: October 18, 2022
    Assignee: Xencor, Inc.
    Inventors: Rumana Rashid, Umesh S. Muchhal, Gregory Moore, Alex Nisthal, Seung Chu, Sung-Hyung Lee, Yoon Kyung Kim
  • Publication number: 20220289839
    Abstract: Provided herein are novel CLDN6 binding domains, and anti-CLDN6×anti-CD3 antibodies that include such CLDN6 binding domains. Also provided herein are methods of using such antibodies for the treatment of CLDN6-associated cancers.
    Type: Application
    Filed: March 9, 2022
    Publication date: September 15, 2022
    Inventors: Matthew S. Faber, Sung-Hyung Lee, Yoon Kyung Kim, Jing Qi, Kendra N. Avery, Seung Y. Chu, Alex Nisthal, Matthew J. Bernett, John R. Desjarlais, Chad Borchert
  • Publication number: 20220162313
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind somatostatin receptor 2 (SSTR2)
    Type: Application
    Filed: December 3, 2021
    Publication date: May 26, 2022
    Inventors: Gregory Moore, Rumana Rashid, Sung-Hyung Lee, Paul Foster
  • Publication number: 20220162343
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: December 3, 2021
    Publication date: May 26, 2022
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Publication number: 20220041757
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 10, 2022
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee