Abstract: The present invention provides a polyimide film and a manufacturing method therefor, the polyimide film having a dielectric dissipation factor (Df) of 0.003 or less, a haze of 3.5% or less, a transmittance of 45% or greater, and a glass transition temperature (Tg) that is equal to or greater than 300° C. and is less than 320° C.

Abstract: Provided is a Complementary Metal Oxide Semiconductor (CMOS) logic element. The CMOS logic element includes a substrate including a PMOS area, a circuit wiring structure including an insulating layer and a wiring layer alternately stacked on the substrate, wherein the circuit wiring structure includes an NMOS area vertically spaced apart from the PMOS area, a first transistor disposed on the PMOS area, and a second transistor disposed on the NMOS area and complementarily connected to the first transistor, wherein the first transistor includes a first gate electrode, source/drain areas formed on the PMOS area on both sides of the first gate electrode, and a first channel connecting the source and drain areas to each other, wherein the second transistor includes a second gate electrode and a second channel vertically overlapping the second gate electrode, wherein the first channel includes silicon, wherein the second channel includes an oxide semiconductor.

Abstract: An operation method of an IAB node in a communication system may comprise: measuring a power difference between a first signal received from a first node and a second signal received from a second node; controlling a transmit power of each of the first node and the second node based on the power difference; generating scheduling information for allowing the first node and the second node to simultaneously transmit signals; transmitting the scheduling information to the first node and the second node; and receiving signals that the first node and the second node simultaneously transmit according to the scheduling information by using the transmit power.

Abstract: The present invention provides a polyamic acid, polyimide film and a flexible metal clad laminate using same, the polyamic acid comprising the following components copolymerized: an acid dianhydride component comprising biphenyl-tetracarboxylic acid dianhydride (BPDA), pyromellitic dianhydride (PMDA) and p-phenylenebis(trimellitate anhydride) (TAHQ); and a diamine component comprising m-tolidine and para-phenylenediamine (PPD).

Abstract: The present disclosure relates to a simulation apparatus for secondary battery production. The simulation apparatus for secondary battery production comprises a memory configured to store at least one instruction and at least one processor configured to execute the at least one instruction stored in the memory to perform operations including: receiving information related to a user account of a user who uses a simulation apparatus related to secondary battery production; executing an apparatus operating unit including a 3D coater related to secondary battery production, a facility operating unit including a plurality of adjustment parameters for determining operation of the 3D coater, and a quality checking unit including quality information related to quality of a material produced by the 3D coater when information related to the user account is received.

Abstract: A coil component includes a body, a support substrate disposed within the body, a lead portion disposed on a first surface of the support substrate, a first insulating layer disposed on the first surface of the support substrate to cover the lead portion, a coil unit including a plurality of turns disposed on the first insulating layer, a second insulating layer covering the coil unit, and first and second external electrodes spaced apart from each other on the body, and connected to the coil unit and the lead portion, respectively.

Abstract: The present disclosure relates to a simulation apparatus for secondary battery production. The simulation apparatus for secondary battery production comprises a memory configured to store at least one instruction and at least one processor configured to execute the at least one instruction stored in the memory to perform operations including: receiving information related to a user account of a user who uses a simulation apparatus related to secondary battery production; executing an apparatus operating unit including a 3D coater related to secondary battery production, a facility operating unit including a plurality of adjustment parameters for determining operation of the 3D coater, and a quality checking unit including quality information related to quality of a material produced by the 3D coater when information related to the user account is received.

Abstract: A simulation method and a simulation apparatus of roll press for secondary battery production are provided.

Abstract: A simulation apparatus and a simulation method of mixer for secondary battery production are provided. The simulation apparatus includes a memory configured to store at least one instruction; and at least one processor configured to execute the at least one instruction stored in the memory.

Abstract: The present disclosure relates to a simulation apparatus for secondary battery production.

Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: A coil component includes: a body; a substrate disposed in the body, and having a first surface and a second surface facing each other; a coil unit including first and second coil patterns disposed on the first surface and the second surface of the substrate, respectively, first and second lead-out portions extending to surfaces of the body, a first connection portion disposed between the first coil pattern and the first lead-out portion, and a second connection portion disposed between the second coil pattern and the second lead-out portion; and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the first and second lead-out portions, respectively. Each of the first and second connection portions includes one connection pattern and at least one separation pattern. The connection pattern has a smaller line width than a respective one of the lead-out portions.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: A coil component includes a body, a support substrate disposed within the body, a lead portion disposed on a first surface of the support substrate, a first insulating layer disposed on the first surface of the support substrate to cover the lead portion, a coil unit including a plurality of turns disposed on the first insulating layer, a second insulating layer covering the coil unit, and first and second external electrodes spaced apart from each other on the body, and connected to the coil unit and the lead portion, respectively.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.