Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.

Abstract: Systems, apparatuses, and methods described herein provide heat sinks that can be incorporated into chassis, yet be compatible with edge devices that contain many different combinations of hardware that can be arranged in many different ways on circuit boards. In one example, a pattern of fittings on an interior-facing side of the heat sink are configured to mate with fittings on a first side of an adapter pedestal. A second side of the adapter pedestal is configured to thermally couple with an electronic component housed within the chassis when the heat sink is fully seated and the pedestal is properly coupled to the heat sink.

Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.

Abstract: Example implementations relate a chassis for a circuit assembly. The chassis includes a chassis body defining an access opening and a volume to house the circuit assembly including a circuit module and an input-output (IO) unit. The chassis body houses the circuit assembly such that the circuit module is enclosed within the volume defined by the chassis body and the IO unit remains accessible for cabling at the access opening. The chassis further includes an IO enclosure attached to the chassis body to seal the access opening from surrounding environment, where the IO enclosure includes a cabling port to allow the cabling to the IO unit.

Abstract: Systems, apparatuses, and methods described herein provide heat sinks that can be incorporated into chassis, yet be compatible with edge devices that contain many different combinations of hardware that can be arranged in many different ways on circuit boards. In one example, a pattern of fittings on an interior-facing side of the heat sink are configured to mate with fittings on a first side of an adapter pedestal. A second side of the adapter pedestal is configured to thermally couple with an electronic component housed within the chassis when the heat sink is fully seated and the pedestal is properly coupled to the heat sink.

Abstract: A flexible heat transfer mechanism is provided for transferring heat from a heat generating component to a heatsink. The heat transfer mechanism may include a pedestal coupled to the heatsink via a heat transfer element. The heat transfer element may be a compliant member that is capable of flexing in a vertical direction such that the pedestal may be vertically displaced relative to the heatsink.

Abstract: Example implementations relate a chassis for a circuit assembly. The chassis includes a chassis body defining an access opening and a volume to house the circuit assembly including a circuit module and an input-output (IO) unit. The chassis body houses the circuit assembly such that the circuit module is enclosed within the volume defined by the chassis body and the IO unit remains accessible for cabling at the access opening. The chassis further includes an IO enclosure attached to the chassis body to seal the access opening from surrounding environment, where the IO enclosure includes a cabling port to allow the cabling to the IO unit.

Abstract: Examples relate to a removable transceiver module that comprises a base frame installable in a rail-pair receptacle that surrounds a first connector in a system board. It further comprises a module base board, a second connector attached thereto and a lever handle pivotally attached to the base frame and coupled to the module base board. The transceiver module is installed in the rail-pair receptacle in response to a lateral movement of the base frame to the receptacle to align the first and second connectors. The lever handle is movable between a closed position to couple the second connector to the first connector and an open position to install the transceiver module into the receptacle. This lever handle determines a vertical move of the module base board between the closed position and the open position.

Abstract: Systems and methods for mounting a computing device. One system includes a wall mounting bracket having a front side and a back side. The system further includes a main chassis having a front side panel removably connected to the front side of the wall mounting bracket, a second side panel removably connected to the front side of the wall mounting bracket, and a computing device having a first side and a second side, the first side removably attached to the first side panel and the second side removably attached to the second side panel, and the main chassis connected to the front side of the wall mounting bracket.

Abstract: Systems and methods for mounting a computing device. One system includes a wall mounting bracket having a front side and a back side. The system further includes a main chassis having a front side panel removably connected to the front side of the wall mounting bracket, a second side panel removably connected to the front side of the wall mounting bracket, and a computing device having a first side and a second side, the first side removably attached to the first side panel and the second side removably attached to the second side panel, and the main chassis connected to the front side of the wall mounting bracket.

Abstract: An optical cable router is disclosed. The optical cable router is to couple to rocker-arm plenums of a modular computing system. The optical cable router includes a crossbar that includes an optical cable cavity. The optical cable cavity has a plurality of optical cables and an access panel. The optical cable router further includes optical connectors, each of which is coupled to a respective optical cable of the plurality of optical cables. Each optical connector is also coupled to a respective optical connector of a respective modular computing device retained in the modular computing system.

Abstract: An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.

Abstract: An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.

Abstract: A flexible heat transfer mechanism is provided for transferring heat from a heat generating component to a heatsink. The heat transfer mechanism may include a pedestal coupled to the heatsink via a heat transfer element. The heat transfer element may be a compliant member that is capable of flexing in a vertical direction such that the pedestal may be vertically displaced relative to the heatsink.

Abstract: The present disclosure provides a liquid-cooled transceiver assembly. The liquid-cooled transceiver assembly comprises a removable communications module and a receiving bay assembly. The removable communications module includes a faceplate connector to receive a signal from an external device, a signal conversion chip that is coupled to the faceplate connector, and a lever assembly. The lever assembly can engage the receiving bay assembly such that the signal conversion chip is aligned with and makes an electrical connection with an electrical socket disposed on the receiving bay assembly. The removable communications module is inserted into the receiving bay assembly which when fully assembled functions as a liquid-cooled transceiver assembly.

Abstract: Examples relate to a removable transceiver module that comprises a base frame installable in a rail-pair receptacle that surrounds a first connector in a system board. It further comprises a module base board, a second connector attached thereto and a lever handle pivotally attached to the base frame and coupled to the module base board. The transceiver module is installed in the rail-pair receptacle in response to a lateral movement of the base frame to the receptacle to align the first and second connectors. The lever handle is movable between a closed position to couple the second connector to the first connector and an open position to install the transceiver module into the receptacle. This lever handle determines a vertical move of the module base board between the closed position and the open position.

Abstract: An optical cable router is disclosed. The optical cable router is to couple to rocker-arm plenums of a modular computing system. The optical cable router includes a crossbar that includes an optical cable cavity. The optical cable cavity has a plurality of optical cables and an access panel. The optical cable router further includes optical connectors, each of which is coupled to a respective optical cable of the plurality of optical cables. Each optical connector is also coupled to a respective optical connector of a respective modular computing device retained in the modular computing system.