Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Abstract: In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.

Abstract: The disclosure is directed to a system for generating suggested routing for waste fluid from a source component to a sink component that can use the waste fluid in a fluid process according to some embodiments. In some embodiments, the system is configured to determine usability of the waste fluid in various fluid processes by accessing contamination history from a fluid processes and calculating an acceptable amount of contamination to use in a different fluid process. The system is configured to provide different types of waste fluid from different processes at various flowrates to one or more sink components to ensure contamination thresholds for the sink processes are not violated according to some embodiments.

Abstract: In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device, where the method comprises mounting a plurality of subpanels to a panel, processing the subpanels as a panel, and removing the plurality of subpanels from the panel.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device, where the method comprises mounting a plurality of subpanels to a panel, processing the subpanels as a panel, and removing the plurality of subpanels from the panel.

Abstract: A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Abstract: In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.

Abstract: A drawing take off system itemizes components shown on a paper drawing. The take off system includes a sleeve for holding a standard pen, a computer having a software module, and an interface connection between the sleeve and the computer. The software module maintains a list of each component model shown on the drawing. The sleeve includes a pen stroke switch for counting pen strokes and a component selection switch for selecting a component model from the component model list compiled in the software module. As an estimator marks components on the paper drawing, the take off system counts pen strokes for each individual component of each model of component marked on the paper project drawing by the estimator and calculates the cost for all of the components taken off of the paper drawing.

Abstract: According to one exemplary embodiment, an overmolded package comprises a semiconductor die situated on a substrate. The overmolded package further comprises an overmold situated over the semiconductor die and the substrate, where the overmold has a top surface. The overmolded package further comprises a conductive layer situated on the top surface of the overmold, where the conductive layer comprises a conductive polymer, and where the conductive layer forms an EMI and RFI shield. According to this exemplary embodiment, the overmolded package can further comprise a post situated over the substrate, where the post is connected to the conductive layer. The overmolded package can further comprise a hole situated in the overmold, where the hole is situated over the post, where the hole is filled with the conductive polymer, and where the conductive polymer is in contact with the post.

Abstract: The need for an intelligent content-based router to analyze data and process a client's request quickly and efficiently is increasing with the popularity of the Internet. Current content routers examine only the HTTP based URL request and routes the request to the “best” server for processing. These routers fail to examine different types of TCP-based user requests. The content router we developed examines all type of TCP-based requests. The content router is a core router that simply forwards packets to the edge routers for delivery after performing its content based processing. This router can be replicated to achieve higher performance in large networks. Moreover, by adopting a formal design approach, which is subject to mechanical evaluation using the Z-EVES tool, the correctness of the design is ascertained.