Patents by Inventor Susumu Harada

Susumu Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030068850
    Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.
    Type: Application
    Filed: November 6, 2002
    Publication date: April 10, 2003
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Masatoshi Fukuda, Susumu Harada, Tetsuya Sato, Hidenobu Sato, Atsushi Nakano
  • Publication number: 20030045671
    Abstract: An apparatus for continuously producing polybutylene terephthalate, which comprises a first reactor for reacting an aromatic dicarboxylic acid with a glycol, thereby producing an oligomer, a second reactor for polycondensating the oligomer, thereby preparing a low polymerization product, and a third reactor for further polycondensating the low polymerization product, thereby producing a high molecular weight polyester, where the second reactor is a vertical, cylindrical polymerization vessel having a plurality of concentrical partitioned reaction compartments therein, each of the reaction compartments being provided with stirring blades and a heater, and an outlet for volatile matters being provided at the upper part of the vessel. The second reactor contributes to efficient and continuous production of polybutylene terephthalate having a good quality.
    Type: Application
    Filed: September 23, 2002
    Publication date: March 6, 2003
    Inventors: Shuji Yamaguchi, Hidekazu Nakamoto, Susumu Harada, Norifumi Maeda
  • Patent number: 6498055
    Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: December 24, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masatoshi Fukuda, Susumu Harada, Tetsuya Sato, Hidenobu Sato, Atsushi Nakano
  • Publication number: 20020167983
    Abstract: To provide a point emission type light emitting element that restricts the light emitting area within a sufficiently tiny region and can be manufactured at a low cost, the point emission type light emitting element is a light emitting element that has stripe ridge comprising an n-type layer, an active layer and a p-type layer that are formed from semiconductors on a substrate, so as to emit light from one end face of the stripe ridge, wherein the stripe ridge has a protruding portion on the end face described above and the surface of the light emitting element is covered with an shading film except for the tip of the protruding portion.
    Type: Application
    Filed: March 18, 2002
    Publication date: November 14, 2002
    Inventors: Yukitoshi Marutani, Akira Kitano, Susumu Harada, Kazuyuki Akaishi, Masahiko Sano, Koji Honjo, Hitoshi Maegawa
  • Patent number: 6458916
    Abstract: An apparatus for continuously producing polybutylene terephthalate, which comprises a first reactor for reacting an aromatic dicarboxylic acid with a glycol, thereby producing an oligomer, a second reactor for polycondensating the oligomer, thereby preparing a low polymerization product, and a third reactor for further polycondensating the low polymerization product, thereby producing a high molecular weight polyester, where the second reactor is a vertical, cylindrical polymerization vessel having a plurality of concentrical partitioned reaction compartments therein, each of the reaction compartments being provided with stirring blades and a heater, and an outlet for volatile matters being provided at the upper part of the vessel. The second reactor contributes to efficient and continuous production of polybutylene terephthalate having a good quality.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: October 1, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Shuji Yamaguchi, Hidekazu Nakamoto, Susumu Harada, Norifumi Maeda
  • Publication number: 20020128399
    Abstract: Polybutylene terephthalate having good heat stability and excellent hydrolysis resistance is continuously produced in a series of a first reactor for reacting an aromatic dicarboxylic acid comprising terephthalic acid as a main ingredient or a derivative thereof with a glycol comprising 1,4-butanediol as a main ingredient, thereby producing an oligomer with an average degree of polymerization of 2.2 to 5, a second reactor for polycondensating the oligomer from the first reactor, thereby preparing a low polymerization product with an average degree of polymerization of 25 to 40, and a third reactor for further polycondensating the low polymerization product from the second reactor, thereby producing a high molecular weight polyester with an average degree of polymerization of 70 to 130, or followed by a fourth reactor for further polycondensing the polyester from the third reactor to an average degree of polymerization of 150 to 200, thereby producing a high molecular weight polyester.
    Type: Application
    Filed: March 8, 2002
    Publication date: September 12, 2002
    Inventors: Hidekazu Nakamoto, Susumu Harada, Norifumi Maeda, Shuji Yamaguchi
  • Patent number: 6420957
    Abstract: An electric component capable of attaining connection of two kinds of connection conductors thereto and electrically connecting an electrode arranged on a front surface of a circuit board and a terminal fitment to each other without soldering. A terminal fitment (129) is integrally formed by subjecting a metal plate to machining. The terminal fitment 19 includes a first conductor holding section 129A, a second conductor holding section 129B and a contact terminal section 129C. The contact terminal section 129C is constructed to as to exhibit elastic or resilient force sufficient to force a contact portion 129s against the contact electrode E2 while being kept arranged between the first conductor holding section 129A and the front surface of the circuit board 102.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: July 16, 2002
    Assignee: Hokuriku Electric Industry Co., LTD
    Inventor: Susumu Harada
  • Patent number: 6359106
    Abstract: Polybutylene terephthalate having good heat stability and excellent hydrolysis resistance is continuously produced in a series of a first reactor for reacting an aromatic dicarboxylic acid comprising terephthalic acid as a main ingredient or a derivative thereof with a glycol comprising 1,4-butanediol as a main ingredient, thereby producing an oligomer with an average degree of polymerization of 2.2 to 5, a second reactor for polycondensating the oligomer from the first reactor, thereby preparing a low polymerization product with an average degree of polymerization of 25 to 40, and a third reactor for further polycondensating the low polymerization product from the second reactor, thereby producing a high molecular weight polyester with an average degree of polymerization of 70 to 130, or followed by a fourth reactor for further polycondensing the polyester from the third reactor to an average degree of polymerization of 150 to 200, thereby producing a high molecular weight polyester.
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: March 19, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Hidekazu Nakamoto, Susumu Harada, Norifumi Maeda, Shuji Yamaguchi
  • Publication number: 20010042913
    Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.
    Type: Application
    Filed: May 16, 2001
    Publication date: November 22, 2001
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Masatoshi Fukuda, Susumu Harada, Tetsuya Sato, Hidenobu Sato, Atsushi Nakano
  • Publication number: 20010031231
    Abstract: Polybutylene terephthalate having good heat stability and excellent hydrolysis resistance is continuously produced in a series of a first reactor for reacting an aromatic dicarboxylic acid comprising terephthalic acid as a main ingredient or a derivative thereof with a glycol comprising 1,4-butanediol as a main ingredient, thereby producing an oligomer with an average degree of polymerization of 2.2 to 5, a second reactor for polycondensating the oligomer from the first reactor, thereby preparing a low polymerization product with an average degree of polymerization of 25 to 40, and a third reactor for further polycondensating the low polymerization product from the second reactor, thereby producing a high molecular weight polyester with an average degree of polymerization of 70 to 130, or followed by a fourth reactor for further polycondensing the polyester from the third reactor to an average degree of polymerization of 150 to 200, thereby producing a high molecular weight polyester.
    Type: Application
    Filed: February 23, 2001
    Publication date: October 18, 2001
    Inventors: Hidekazu Nakamoto, Susumu Harada, Norifumi Maeda, Shuji Yamaguchi
  • Patent number: 6096838
    Abstract: An apparatus for continuously producing polyester comprises three single reactors, i.e. a single esterification reactor (first reactor), a single initial polymerization reactor (second reactor) and a single final polymerization reactor (third reactor or final polymerizer), where at least one of the first reactor and the second reactor is free from an external stirring power source, or the third reactor is a horizontal, one-shaft-type, low speed rotation type reactor. Necessary number of reactors for the esterification and polycondensation reactions can be a minimum and necessary stirring power consumption for the reaction can be a miminum, and thus polyester polymers of good quality can be efficiently produced at a minimum energy cost in a necessary minimum reactor structure.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: August 1, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Hidekazu Nakamoto, Susumu Harada, Chikao Oda, Yasunari Sase, Michio Suzuki
  • Patent number: 5912613
    Abstract: A high-voltage resistor unit capable of minimizing a variation in output voltage thereof. The resistor unit includes an output terminal member provided with a contact section connected, by only contacting, to an output electrode formed on a front surface of a circuit board. The electrode contacted with the constant section of the terminal member has a surface section covered with a resistive paint layer, of which a resistance value in a thickness direction thereof is set to be smaller than a resistance value of a resistance circuit pattern formed on the front surface of the circuit board which resistance value is determined in a thickness direction thereof.
    Type: Grant
    Filed: December 10, 1996
    Date of Patent: June 15, 1999
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Hirokazu Kotani, Motoharu Higami, Shinichi Kamata, Susumu Harada
  • Patent number: 5871676
    Abstract: A method for setting up a program profile in the control of the injection speed of injection molding machines where a model shape of an article to be molded is divided into fine elements; the filling up state of melt resin for each fine element is obtained as a time period by using numerical analyzing methods including the finite element method, the boundary element method, the calculus of finite differences method and the FAN method under a condition that the moving speed of the injection plunger is constant; a time period required for filling the model shape of the article as a whole with melt resin is divided into a plurality of material filling up time periods by an arbitrary number; a mean discharge speed Cv1 to Cvn of melt material at every divided period is calculated; and a moving speed of the injection plunger Pv1 to Pvn at every divided period is set up as a function of the mean discharge speed Cv2 to Cvn.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: February 16, 1999
    Assignee: Toshiba Machine, Co., Ltd.
    Inventors: Shigeru Fujita, Susumu Harada
  • Patent number: 5723079
    Abstract: A method for controlling the injection speed of injection molding machines and an apparatus therefor in which a driving force for forwardly moving an injection plunger movably inserted in an injection cylinder is detected by a first detector; when the value PA detected by the detector exceeds a standard value PSH, the forwardly moving speed of the plunger is controlled to be reduced in accordance with a moving speed reduction control profile VD which is determined by a predetermined decreasing function: further, the forwardly moving speed of the plunger at the dwelling phase switching position is detected by the second detector; the judgment that the value VS detected by the second detector exceeds the upper limit VAH and/or the judgment that the value VS exceeds the lower limit VAL is/are conducted; an alarm signal is outputted when the value VS exceeds the upper limit and/or the value VS exceeds the lower limit.
    Type: Grant
    Filed: April 17, 1996
    Date of Patent: March 3, 1998
    Assignee: Toshiba Machine Co., Ltd.
    Inventors: Shigeru Fujita, Susumu Harada
  • Patent number: 5653126
    Abstract: A packing material capable of improving the uniformity of liquid distribution and of achieving a preferable gas-liquid contact reaction, even in the case where the specific surface area of the packing material is small, includes a plurality of projections provided on the surface of a thin plate, and a plurality of holes provided respectively between the projections. In one embodiment, the transfer extension of each projection is larger than a longitudinal extension thereof, so that descending liquid flows downward while being transversely dispersed by the projection. The holes are provided between the projections so that they do not obstruct the transfer dispersion of liquid at the projection. Moreover, the holes accelerate the transverse dispersion of liquid, or the dispersion of liquid between front and rear surfaces of the thin plate, by the surface tension of the liquid. As a result, excellent uniformity of liquid distribution can be obtained on the surface of the thin plate.
    Type: Grant
    Filed: September 1, 1995
    Date of Patent: August 5, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Susumu Harada, Satihiro Yoshimatsu, Kazuo Someya, Naruyasu Okamoto
  • Patent number: 5198883
    Abstract: First and second frame bodies are used to fabricate a semiconductor device. The first frame body includes a die pad. The second frame body only includes a plurality of leads. The die pad is depressed by a predetermined amount which is equal or greater than the thickness of a semiconductor chip to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.
    Type: Grant
    Filed: July 19, 1989
    Date of Patent: March 30, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenji Takahashi, Yasuhiro Yamaji, Susumu Harada, Kazuichi Komenaka, Mitsugu Miyamoto, Masashi Muromachi, Hiroshi Harada, Kazuo Numajiri, Haruyuki Shimakawa, Toshiharu Sakurai
  • Patent number: 5191539
    Abstract: A control apparatus for an injection molding machine has a unit for setting data corresponding to a molding operation of the injection molding machine and for controlling the molding operation of the machine based on a setting of a setting unit. The setting unit has a register for holding numerical input data, an input/output control unit for inputting and outputting numerical value data to and from the register on the basis of an external command, a numerical value manipulating unit for incrementing and decrementing the numerical value data in the register through a manual operation, a numerical value display unit for displaying numerical value data stored in the register, and a place position shifting unit for shifting set places in the numerical value display and in the numerical value manipulating unit on the basis of the number of places in the integer part of the numerical value data.
    Type: Grant
    Filed: July 6, 1990
    Date of Patent: March 2, 1993
    Assignee: Toshita Kikai Kabushiki Kaisha
    Inventors: Susumu Harada, Hideo Tanaka, Kiyoshi Sasaki, Tsuginobu Totani
  • Patent number: 5158585
    Abstract: A compressor unit in which the oil separated by a plurality of oil separators to a gas suction side pipe of the previous stage oil separator which contains gas whose oil concentration is higher than that of the gas from which oil has been separated, with the separated oil being returned to a compressor. The plurality of separators enables a simplification of the arrangement of the oil returning pipe, a prevention in a reduction in the discharge flow rate of the compressor, and reduction in space required for the separators.
    Type: Grant
    Filed: February 19, 1991
    Date of Patent: October 27, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Norihide Saho, Takeo Nemoto, Shintaro Sado, Sachihiro Yoshimatsu, Tadashi Takada, Susumu Harada
  • Patent number: 5152147
    Abstract: A refrigerator having a pressurizing device, a coldness generating device for generating coldness by expanding a portion of operating fluid which has been pressurized by the pressurizing device and a fluid passage through which the operating fluid is, via a device to be cooled, again circulated to the pressurizing device after the residual portion of the operating fluid has been cooled by the coldness generating device. A regenerator type heat exchanger is disposed in the fluid passage through which the operating fluid passes, and a switch device switches the flow of the operating fluid in the fluid passage to the reverse direction at a predetermined time period.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: October 6, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Norihide Saho, Takeo Nemoto, Hisanao Ogata, Susumu Harada, Kozo Matsumoto, Teruhiro Takizawa
  • Patent number: 5097431
    Abstract: An evaluation method analyzes flow on molding of a molten material. This is achieved in a system of making a flow analysis on an in-mold molten material through division of a molded part model into minute elements and numerical analysis thereof including the calculi of finite elements, boundary elements, finite differences, FAN and the like. One or more temperature conditions of the molten material are provided with a plurality of loading times or mold temperatures respectively for performing an analysis and from the obtained operational results of the pressure distribution of the molten material a function of the maximum molten material pressure of each element is provided. This function is graphically indicated on a display apparatus to evaluate the appropriate ranges of the molten material pressure and the loading time at a predetermined molten material temperature.
    Type: Grant
    Filed: October 10, 1990
    Date of Patent: March 17, 1992
    Assignee: Toshiba Machine Co., Ltd.
    Inventors: Susumu Harada, Shigeru Fujita