Patents by Inventor Susumu Yamasaki

Susumu Yamasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package having a sheet-covered cutout
    Patent number: 11104476
    Abstract: A package is formed of a die cut paperboard that includes a cutout that is covered by a polymer sheet. The sheet holds an item, such as by stretching, against the bottom side of the unpadded paperboard, which is chosen according to its ability to be transported on metal roller conveyors.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: August 31, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Qi Zhang, Ryo Igarashi, Yuichi Kosaka, Masahiro Uchida, Susumu Yamasaki, Shigekazu Ishiguro, Sayaka Kishimoto
  • Package Having A Sheet-Covered Cutout
    Publication number: 20200031515
    Abstract: A package is formed of a die cut paperboard that includes a cutout that is covered by a polymer sheet. The sheet holds an item, such as by stretching, against the bottom side of the unpadded paperboard, which is chosen according to its ability to be transported on metal roller conveyors.
    Type: Application
    Filed: July 24, 2018
    Publication date: January 30, 2020
    Inventors: Qi Zhang, Ryo Igarashi, Yuichi Kosaka, Masahiro Uchida, Susumu Yamasaki, Shigekazu Ishiguro, Sayaka Kishimoto